Industry: Machinery & Equipment
Published Date: 2026-01-31
Pages: 154 Pages
Report ld: 5823774
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The global Planar Die Bonder market was valued at US$ million in 2025 and is anticipated to reach US$ million by 2032, at a CAGR of %from 2026 to 2032.
The 2025 U.S. tariff policies introduce profound uncertainty into the global economic landscape. This report critically examines the implications of recent tariff adjustments and international strategic countermeasures on Planar Die Bonder competitive dynamics, regional economic interdependencies, and supply chain reconfigurations.
A planar die bonder is a device used in the electronics assembly and packaging process. It is mainly used in the process of fixing micro components such as chips, chipsets, sensors, etc. on printed circuit boards (PCB) or other substrates. A planar die bonder usually includes a workbench, a feeding system and a die bonding head. In operation, the table holds the substrate, the feeding system supplies the chips or components, and the die attach head is responsible for placing the chip precisely on the substrate and fixing it using appropriate methods such as heat pressure or soldering. The operation process of a planar die bonder usually involves the following steps: Preparatory work: setting up and calibrating the machine, preparing substrates and chips. Loading: Place the chip or component in the feeding system, usually using a suction nozzle or other suitable fixture. Positioning: Place the substrate on the workbench and make sure the position is accurate. Die-bonding: The die-bonding head precisely places the chip or component on the substrate, and applies appropriate pressure or temperature to make it firmly connected to the substrate. Inspection: Check whether the connection after die bonding is accurate and reliable. Unloading: Remove the die-bonded substrate from the feeding system and prepare for the next operation. Planar die bonding machine plays a key role in the electronics manufacturing industry. It can improve production efficiency and ensure assembly quality, and is widely used in electronic equipment manufacturing, semiconductor packaging, sensor manufacturing and other fields.
The North American market for Planar Die Bonder is projected to increase from US$ million in 2025 to US$ million by 2032, at a CAGR of % over 2026–2032.
The Asia-Pacific market for Planar Die Bonder is projected to rise from US$ million in 2025 to US$ million by 2032, at a CAGR of % over 2026–2032.
Major global manufacturers of Planar Die Bonder include ASM Pacific Technology Ltd., Kulicke & Soffa Industries, Inc., Tokyo Electron Limited, Applied Materials, Inc., Disco Corporation, EV Group (EVG), SPTS Technologies Ltd., Besi (BE Semiconductor Industries N.V.), Nordson Corporation, Shibaura Mechatronics Corporation, etc. In 2025, the world's top three vendors accounted for approximately % of revenue.
This report delivers a comprehensive overview of the global Planar Die Bonder market, with both quantitative and qualitative analyses, to help readers develop growth strategies, assess the competitive landscape, evaluate their position in the current market, and make informed business decisions regarding Planar Die Bonder. The Planar Die Bonder market size, estimates, and forecasts are provided in terms of output/shipments (Units) and revenue (US$ millions), with 2025 as the base year and historical and forecast data for 2021–2032.
The report segments the global Planar Die Bonder market comprehensively. Regional market sizes by Type, by Application, , and by company are also provided. For deeper insight, the report profiles the competitive landscape, key competitors, and their respective market rankings, and discusses technological trends and new product developments.
This report will assist Planar Die Bonder manufacturers, new entrants, and companies across the industry value chain with information on revenues, production, and average prices for the overall market and its sub-segments, by company, by Type, by Application, and by region.
MARKET SEGMENTATION
CHAPTER OUTLINE
Chapter 1: Defines the scope of the report and presents an executive summary of market segments (by Type, by Application, , etc.), including the size of each segment and its future growth potential. It offers a high-level view of the current market and its likely evolution in the short, medium, and long term.
Chapter 2: Provides a detailed analysis of the competitive landscape for Planar Die Bonder manufacturers, including prices, production, value-based market shares, latest development plans, and information on mergers and acquisitions.
Chapter 3: Examines Planar Die Bonder production/output and value by region and country, providing a quantitative assessment of market size and growth potential for each region over the next six years.
Chapter 4: Analyzes Planar Die Bonder consumption at the regional and country levels. It quantifies market size and growth potential for each region and its key countries, and outlines market development, outlook, addressable space, and national production.
Chapter 5: Analyzes market segments by Type, covering the size and growth potential of each segment to help readers identify “blue ocean” opportunities.
Chapter 6: Analyzes market segments by Application, covering the size and growth potential of each segment to help readers identify “blue ocean” opportunities in downstream markets.
Chapter 7: Profiles key players, detailing the fundamentals of major companies, including product production/output, value, price, gross margin, product portfolio/introductions, and recent developments.
Chapter 8: Reviews the industry value chain, including upstream and downstream segments.
Chapter 9: Discusses market dynamics and recent developments, including drivers, restraints, challenges and risks for manufacturers, U.S. Tariffs and relevant policy analysis.
Chapter 10: Summarizes the key findings and conclusions of the report.
QYRESEARCH'S STRENGTHS
Unlike generic global market reports, this study combines macro-level industry trends with hyper-local operational intelligence, empowering data-driven decisions across the Compound Chocolate value chain, addressing:
We identify regional market threats and growth prospects to guide your overseas layout.
We adjust product portfolios in line with local consumption habits.
We unpack rivals’ operation strategies for scattered and highly concentrated industries.
We cover competition landscape, full supply chain and quantified market size data, and deliver tailor-made customized surveys to meet your unique business demands.
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Our team operates 24 hours a day, 365 days a year, enabling ultra-fast report turnaround to respond to your research needs efficiently.
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TABLE OF CONTENTS
1 Planar Die Bonder Market Overview
1.1 Product Definition
1.2 Planar Die Bonder by Type
1.2.1 Global Planar Die Bonder Market Value Growth Rate Analysis by Type: 2025 vs 2032
1.2.2 Manual Plane Die Bonder
1.2.3 Semi-Automatic Planar Die Bonder
1.2.4 Fully Automatic Flat Die Bonder
1.3 Planar Die Bonder by Application
1.3.1 Global Planar Die Bonder Market Value Growth Rate Analysis by Application: 2025 vs 2032
1.3.2 Semiconductor Manufacturing
1.3.3 Electronic Packaging
1.3.4 Others
1.4 Global Market Growth Prospects
1.4.1 Global Planar Die Bonder Production Value Estimates and Forecasts (2021–2032)
1.4.2 Global Planar Die Bonder Production Capacity Estimates and Forecasts (2021–2032)
1.4.3 Global Planar Die Bonder Production Estimates and Forecasts (2021–2032)
1.4.4 Global Planar Die Bonder Market Average Price Estimates and Forecasts (2021–2032)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Planar Die Bonder Production Market Share by Manufacturers (2021–2026)
2.2 Global Planar Die Bonder Production Value Market Share by Manufacturers (2021–2026)
2.3 Global Key Players of Planar Die Bonder, Industry Ranking, 2024 vs 2025
2.4 Global Planar Die Bonder Market Share by Company Tier (Tier 1, Tier 2, Tier 3)
2.5 Global Planar Die Bonder Average Price by Manufacturers (2021–2026)
2.6 Global Key Manufacturers of Planar Die Bonder, Manufacturing Footprints and Headquarters
2.7 Global Key Manufacturers of Planar Die Bonder, Product Offerings and Applications
2.8 Global Key Manufacturers of Planar Die Bonder, Date of Entry into the Industry
2.9 Planar Die Bonder Market Competitive Situation and Trends
2.9.1 Planar Die Bonder Market Concentration Rate
2.9.2 Top 5 and Top 10 Global Planar Die Bonder Players Market Share by Revenue
2.10 Mergers & Acquisitions and Expansion
3 Planar Die Bonder Production by Region
3.1 Global Planar Die Bonder Production Value Estimates and Forecasts by Region: 2021 vs 2025 vs 2032
3.2 Global Planar Die Bonder Production Value by Region (2021–2032)
3.2.1 Global Planar Die Bonder Production Value by Region (2021–2026)
3.2.2 Global Forecasted Production Value of Planar Die Bonder by Region (2027–2032)
3.3 Global Planar Die Bonder Production Estimates and Forecasts by Region: 2021 vs 2025 vs 2032
3.4 Global Planar Die Bonder Production Volume by Region (2021–2032)
3.4.1 Global Planar Die Bonder Production by Region (2021–2026)
3.4.2 Global Forecasted Production of Planar Die Bonder by Region (2027–2032)
3.5 Global Planar Die Bonder Market Price Analysis by Region (2021–2026)
3.6 Global Planar Die Bonder Production, Value, and Year-over-Year Growth
3.6.1 North America Planar Die Bonder Production Value Estimates and Forecasts (2021–2032)
3.6.2 Europe Planar Die Bonder Production Value Estimates and Forecasts (2021–2032)
3.6.3 China Planar Die Bonder Production Value Estimates and Forecasts (2021–2032)
3.6.4 Japan Planar Die Bonder Production Value Estimates and Forecasts (2021–2032)
4 Planar Die Bonder Consumption by Region
4.1 Global Planar Die Bonder Consumption Estimates and Forecasts by Region: 2021 vs 2025 vs 2032
4.2 Global Planar Die Bonder Consumption by Region (2021–2032)
4.2.1 Global Planar Die Bonder Consumption by Region (2021–2026)
4.2.2 Global Planar Die Bonder Forecasted Consumption by Region (2027–2032)
4.3 North America
4.3.1 North America Planar Die Bonder Consumption Growth Rate by Country: 2021 vs 2025 vs 2032
4.3.2 North America Planar Die Bonder Consumption by Country (2021–2032)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Planar Die Bonder Consumption Growth Rate by Country: 2021 vs 2025 vs 2032
4.4.2 Europe Planar Die Bonder Consumption by Country (2021–2032)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Planar Die Bonder Consumption Growth Rate by Region: 2021 vs 2025 vs 2032
4.5.2 Asia Pacific Planar Die Bonder Consumption by Region (2021–2032)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Planar Die Bonder Consumption Growth Rate by Country: 2021 vs 2025 vs 2032
4.6.2 Latin America, Middle East & Africa Planar Die Bonder Consumption by Country (2021–2032)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Planar Die Bonder Production by Type (2021–2032)
5.1.1 Global Planar Die Bonder Production by Type (2021–2026)
5.1.2 Global Planar Die Bonder Production by Type (2027–2032)
5.1.3 Global Planar Die Bonder Production Market Share by Type (2021–2032)
5.2 Global Planar Die Bonder Production Value by Type (2021–2032)
5.2.1 Global Planar Die Bonder Production Value by Type (2021–2026)
5.2.2 Global Planar Die Bonder Production Value by Type (2027–2032)
5.2.3 Global Planar Die Bonder Production Value Market Share by Type (2021–2032)
5.3 Global Planar Die Bonder Price by Type (2021–2032)
6 Segment by Application
6.1 Global Planar Die Bonder Production by Application (2021–2032)
6.1.1 Global Planar Die Bonder Production by Application (2021–2026)
6.1.2 Global Planar Die Bonder Production by Application (2027–2032)
6.1.3 Global Planar Die Bonder Production Market Share by Application (2021–2032)
6.2 Global Planar Die Bonder Production Value by Application (2021–2032)
6.2.1 Global Planar Die Bonder Production Value by Application (2021–2026)
6.2.2 Global Planar Die Bonder Production Value by Application (2027–2032)
6.2.3 Global Planar Die Bonder Production Value Market Share by Application (2021–2032)
6.3 Global Planar Die Bonder Price by Application (2021–2032)
7 Key Companies Profiled
7.1 ASM Pacific Technology Ltd.
7.1.1 ASM Pacific Technology Ltd. Planar Die Bonder Company Information
7.1.2 ASM Pacific Technology Ltd. Planar Die Bonder Product Portfolio
7.1.3 ASM Pacific Technology Ltd. Planar Die Bonder Production, Value, Price, and Gross Margin (2021–2026)
7.1.4 ASM Pacific Technology Ltd. Main Business and Markets Served
7.1.5 ASM Pacific Technology Ltd. Recent Developments/Updates
7.2 Kulicke & Soffa Industries, Inc.
7.2.1 Kulicke & Soffa Industries, Inc. Planar Die Bonder Company Information
7.2.2 Kulicke & Soffa Industries, Inc. Planar Die Bonder Product Portfolio
7.2.3 Kulicke & Soffa Industries, Inc. Planar Die Bonder Production, Value, Price, and Gross Margin (2021–2026)
7.2.4 Kulicke & Soffa Industries, Inc. Main Business and Markets Served
7.2.5 Kulicke & Soffa Industries, Inc. Recent Developments/Updates
7.3 Tokyo Electron Limited
7.3.1 Tokyo Electron Limited Planar Die Bonder Company Information
7.3.2 Tokyo Electron Limited Planar Die Bonder Product Portfolio
7.3.3 Tokyo Electron Limited Planar Die Bonder Production, Value, Price, and Gross Margin (2021–2026)
7.3.4 Tokyo Electron Limited Main Business and Markets Served
7.3.5 Tokyo Electron Limited Recent Developments/Updates
7.4 Applied Materials, Inc.
7.4.1 Applied Materials, Inc. Planar Die Bonder Company Information
7.4.2 Applied Materials, Inc. Planar Die Bonder Product Portfolio
7.4.3 Applied Materials, Inc. Planar Die Bonder Production, Value, Price, and Gross Margin (2021–2026)
7.4.4 Applied Materials, Inc. Main Business and Markets Served
7.4.5 Applied Materials, Inc. Recent Developments/Updates
7.5 Disco Corporation
7.5.1 Disco Corporation Planar Die Bonder Company Information
7.5.2 Disco Corporation Planar Die Bonder Product Portfolio
7.5.3 Disco Corporation Planar Die Bonder Production, Value, Price, and Gross Margin (2021–2026)
7.5.4 Disco Corporation Main Business and Markets Served
7.5.5 Disco Corporation Recent Developments/Updates
7.6 EV Group (EVG)
7.6.1 EV Group (EVG) Planar Die Bonder Company Information
7.6.2 EV Group (EVG) Planar Die Bonder Product Portfolio
7.6.3 EV Group (EVG) Planar Die Bonder Production, Value, Price, and Gross Margin (2021–2026)
7.6.4 EV Group (EVG) Main Business and Markets Served
7.6.5 EV Group (EVG) Recent Developments/Updates
7.7 SPTS Technologies Ltd.
7.7.1 SPTS Technologies Ltd. Planar Die Bonder Company Information
7.7.2 SPTS Technologies Ltd. Planar Die Bonder Product Portfolio
7.7.3 SPTS Technologies Ltd. Planar Die Bonder Production, Value, Price, and Gross Margin (2021–2026)
7.7.4 SPTS Technologies Ltd. Main Business and Markets Served
7.7.5 SPTS Technologies Ltd. Recent Developments/Updates
7.8 Besi (BE Semiconductor Industries N.V.)
7.8.1 Besi (BE Semiconductor Industries N.V.) Planar Die Bonder Company Information
7.8.2 Besi (BE Semiconductor Industries N.V.) Planar Die Bonder Product Portfolio
7.8.3 Besi (BE Semiconductor Industries N.V.) Planar Die Bonder Production, Value, Price, and Gross Margin (2021–2026)
7.8.4 Besi (BE Semiconductor Industries N.V.) Main Business and Markets Served
7.8.5 Besi (BE Semiconductor Industries N.V.) Recent Developments/Updates
7.9 Nordson Corporation
7.9.1 Nordson Corporation Planar Die Bonder Company Information
7.9.2 Nordson Corporation Planar Die Bonder Product Portfolio
7.9.3 Nordson Corporation Planar Die Bonder Production, Value, Price, and Gross Margin (2021–2026)
7.9.4 Nordson Corporation Main Business and Markets Served
7.9.5 Nordson Corporation Recent Developments/Updates
7.10 Shibaura Mechatronics Corporation
7.10.1 Shibaura Mechatronics Corporation Planar Die Bonder Company Information
7.10.2 Shibaura Mechatronics Corporation Planar Die Bonder Product Portfolio
7.10.3 Shibaura Mechatronics Corporation Planar Die Bonder Production, Value, Price, and Gross Margin (2021–2026)
7.10.4 Shibaura Mechatronics Corporation Main Business and Markets Served
7.10.5 Shibaura Mechatronics Corporation Recent Developments/Updates
7.11 Palomar Technologies, Inc.
7.11.1 Palomar Technologies, Inc. Planar Die Bonder Company Information
7.11.2 Palomar Technologies, Inc. Planar Die Bonder Product Portfolio
7.11.3 Palomar Technologies, Inc. Planar Die Bonder Production, Value, Price, and Gross Margin (2021–2026)
7.11.4 Palomar Technologies, Inc. Main Business and Markets Served
7.11.5 Palomar Technologies, Inc. Recent Developments/Updates
7.12 Shinkawa Ltd.
7.12.1 Shinkawa Ltd. Planar Die Bonder Company Information
7.12.2 Shinkawa Ltd. Planar Die Bonder Product Portfolio
7.12.3 Shinkawa Ltd. Planar Die Bonder Production, Value, Price, and Gross Margin (2021–2026)
7.12.4 Shinkawa Ltd. Main Business and Markets Served
7.12.5 Shinkawa Ltd. Recent Developments/Updates
7.13 Towa Corporation
7.13.1 Towa Corporation Planar Die Bonder Company Information
7.13.2 Towa Corporation Planar Die Bonder Product Portfolio
7.13.3 Towa Corporation Planar Die Bonder Production, Value, Price, and Gross Margin (2021–2026)
7.13.4 Towa Corporation Main Business and Markets Served
7.13.5 Towa Corporation Recent Developments/Updates
7.14 F&K Delvotec Bondtechnik GmbH
7.14.1 F&K Delvotec Bondtechnik GmbH Planar Die Bonder Company Information
7.14.2 F&K Delvotec Bondtechnik GmbH Planar Die Bonder Product Portfolio
7.14.3 F&K Delvotec Bondtechnik GmbH Planar Die Bonder Production, Value, Price, and Gross Margin (2021–2026)
7.14.4 F&K Delvotec Bondtechnik GmbH Main Business and Markets Served
7.14.5 F&K Delvotec Bondtechnik GmbH Recent Developments/Updates
7.15 West Bond, Inc.
7.15.1 West Bond, Inc. Planar Die Bonder Company Information
7.15.2 West Bond, Inc. Planar Die Bonder Product Portfolio
7.15.3 West Bond, Inc. Planar Die Bonder Production, Value, Price, and Gross Margin (2021–2026)
7.15.4 West Bond, Inc. Main Business and Markets Served
7.15.5 West Bond, Inc. Recent Developments/Updates
7.16 Orthodyne Electronics Corporation
7.16.1 Orthodyne Electronics Corporation Planar Die Bonder Company Information
7.16.2 Orthodyne Electronics Corporation Planar Die Bonder Product Portfolio
7.16.3 Orthodyne Electronics Corporation Planar Die Bonder Production, Value, Price, and Gross Margin (2021–2026)
7.16.4 Orthodyne Electronics Corporation Main Business and Markets Served
7.16.5 Orthodyne Electronics Corporation Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Planar Die Bonder Industry Chain Analysis
8.2 Planar Die Bonder Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Planar Die Bonder Production Modes and Processes
8.4 Planar Die Bonder Sales and Marketing
8.4.1 Planar Die Bonder Sales Channels
8.4.2 Planar Die Bonder Distributors
8.5 Planar Die Bonder Customer Analysis
9 Planar Die Bonder Market Dynamics
9.1 Planar Die Bonder Industry Trends
9.2 Planar Die Bonder Market Drivers
9.3 Planar Die Bonder Market Challenges
9.4 Planar Die Bonder Market Restraints
9.5 Impact of U.S. Tariffs
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
TABLE OF FIGURES
List of Tables
List of Figures
KEY QUESTIONS ADDRESSED BY THE REPORT
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REPORT COVERAGE
DESCRIPTION
OVERVIEW
MARKET SEGMENTATION
CHAPTER OUTLINE
QYRESEARCH'S STRENGTHS
TABLE OF CONTENTS
TABLE OF FIGURES
RLEATED REPORTS
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