Industry: Machinery & Equipment
Published Date: 2025-02-13
Pages: 109 Pages
Report ld: 3754649
Request Sample
Customized Report
The global Planar Die Bonder market size was US$ million in 2024 and is forecast to a readjusted size of US$ million by 2031 with a CAGR of %during the forecast period 2025-2031.
A planar die bonder is a device used in the electronics assembly and packaging process. It is mainly used in the process of fixing micro components such as chips, chipsets, sensors, etc. on printed circuit boards (PCB) or other substrates. A planar die bonder usually includes a workbench, a feeding system and a die bonding head. In operation, the table holds the substrate, the feeding system supplies the chips or components, and the die attach head is responsible for placing the chip precisely on the substrate and fixing it using appropriate methods such as heat pressure or soldering. The operation process of a planar die bonder usually involves the following steps: Preparatory work: setting up and calibrating the machine, preparing substrates and chips. Loading: Place the chip or component in the feeding system, usually using a suction nozzle or other suitable fixture. Positioning: Place the substrate on the workbench and make sure the position is accurate. Die-bonding: The die-bonding head precisely places the chip or component on the substrate, and applies appropriate pressure or temperature to make it firmly connected to the substrate. Inspection: Check whether the connection after die bonding is accurate and reliable. Unloading: Remove the die-bonded substrate from the feeding system and prepare for the next operation. Planar die bonding machine plays a key role in the electronics manufacturing industry. It can improve production efficiency and ensure assembly quality, and is widely used in electronic equipment manufacturing, semiconductor packaging, sensor manufacturing and other fields.
The North America Planar Die Bonder market size was US$ million in 2024, while Europe was US$ million. The proportion of the North America was % in 2024, while Europe percentage was %, and it is predicted that Europe share will reach % in 2031, trailing a CAGR of % through the analysis period.
The global key manufacturers of Planar Die Bonder include ASM Pacific Technology Ltd., Kulicke & Soffa Industries, Inc., Tokyo Electron Limited, Applied Materials, Inc., Disco Corporation, EV Group (EVG), SPTS Technologies Ltd., Besi (BE Semiconductor Industries N.V.), Nordson Corporation, Shibaura Mechatronics Corporation, etc. In 2024, the global top five players occupied for a share approximately % in terms of revenue.
In North America, in terms of sales volume, in 2024, the top three players hold a share about %, while in Europe, top three players hold a share nearly %.
The global Planar Die Bonder market is segmented by company, region (country), by Type, and by Application. Players, stakeholders, and other participants in the global Planar Die Bonder market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), by Type and by Application for the period 2020-2031.
MARKET SEGMENTATION
CHAPTER OUTLINE
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, and by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Sales and revenue of Planar Die Bonder in global, regional level and country level. It provides a quantitative analysis of the market size and development potential of each region.
Chapter 3: Detailed analysis of Planar Die Bonder manufacturers competitive landscape, sales, revenue, price, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the sales, revenue, price, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the sales, revenue, price, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Region analysis by company, by customer, by Type, by Application, sales, revenue, and price for each segment,
Chapter 7: Provides profiles of key manufacturers, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Planar Die Bonder revenue, gross margin, and recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Sales channels analysis
Chapter 10: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 11: The main points and conclusions of the report.
QYRESEARCH'S STRENGTHS
Unlike generic global market reports, this study combines macro-level industry trends with hyper-local operational intelligence, empowering data-driven decisions across the Compound Chocolate value chain, addressing:
We identify regional market threats and growth prospects to guide your overseas layout.
We adjust product portfolios in line with local consumption habits.
We unpack rivals’ operation strategies for scattered and highly concentrated industries.
We cover competition landscape, full supply chain and quantified market size data, and deliver tailor-made customized surveys to meet your unique business demands.
We own self-owned massive exclusive databases, backed by 19 years of global market research experience across thousands of sectors.
Our team operates 24 hours a day, 365 days a year, enabling ultra-fast report turnaround to respond to your research needs efficiently.
We integrate regional risk assessment, localized product optimization and competitor analysis to deliver actionable market strategies.
All data is cross-verified from multiple industry sources to deliver thorough, precise analysis that supports reliable corporate strategic decisions.
We provide responsive, dedicated after-sales support to resolve all follow-up inquiries about reports, data and industry interpretation.
TABLE OF CONTENTS
1 Market Overview
1.1 Planar Die Bonder Product Scope
1.2 Planar Die Bonder by Type
1.2.1 Global Planar Die Bonder Sales by Type (2020 & 2024 & 2031)
1.2.2 Manual Plane Die Bonder
1.2.3 Semi-Automatic Planar Die Bonder
1.2.4 Fully Automatic Flat Die Bonder
1.3 Planar Die Bonder by Application
1.3.1 Global Planar Die Bonder Sales Comparison by Application (2020 & 2024 & 2031)
1.3.2 Semiconductor Manufacturing
1.3.3 Electronic Packaging
1.3.4 Others
1.4 Global Planar Die Bonder Market Estimates and Forecasts (2020-2031)
1.4.1 Global Planar Die Bonder Market Size in Value Growth Rate (2020-2031)
1.4.2 Global Planar Die Bonder Market Size in Volume Growth Rate (2020-2031)
1.4.3 Global Planar Die Bonder Price Trends (2020-2031)
1.5 Assumptions and Limitations
2 Market Size and Prospective by Region
2.1 Global Planar Die Bonder Market Size by Region: 2020 VS 2024 VS 2031
2.2 Global Planar Die Bonder Retrospective Market Scenario by Region (2020-2025)
2.2.1 Global Planar Die Bonder Sales Market Share by Region (2020-2025)
2.2.2 Global Planar Die Bonder Revenue Market Share by Region (2020-2025)
2.3 Global Planar Die Bonder Market Estimates and Forecasts by Region (2026-2031)
2.3.1 Global Planar Die Bonder Sales Estimates and Forecasts by Region (2026-2031)
2.3.2 Global Planar Die Bonder Revenue Forecast by Region (2026-2031)
2.4 Major Region and Emerging Market Analysis
2.4.1 North America Planar Die Bonder Market Size and Prospective (2020-2031)
2.4.2 Europe Planar Die Bonder Market Size and Prospective (2020-2031)
2.4.3 China Planar Die Bonder Market Size and Prospective (2020-2031)
2.4.4 Japan Planar Die Bonder Market Size and Prospective (2020-2031)
3 Global Market Size by Type
3.1 Global Planar Die Bonder Historic Market Review by Type (2020-2025)
3.1.1 Global Planar Die Bonder Sales by Type (2020-2025)
3.1.2 Global Planar Die Bonder Revenue by Type (2020-2025)
3.1.3 Global Planar Die Bonder Price by Type (2020-2025)
3.2 Global Planar Die Bonder Market Estimates and Forecasts by Type (2026-2031)
3.2.1 Global Planar Die Bonder Sales Forecast by Type (2026-2031)
3.2.2 Global Planar Die Bonder Revenue Forecast by Type (2026-2031)
3.2.3 Global Planar Die Bonder Price Forecast by Type (2026-2031)
3.3 Different Types Planar Die Bonder Representative Players
4 Global Market Size by Application
4.1 Global Planar Die Bonder Historic Market Review by Application (2020-2025)
4.1.1 Global Planar Die Bonder Sales by Application (2020-2025)
4.1.2 Global Planar Die Bonder Revenue by Application (2020-2025)
4.1.3 Global Planar Die Bonder Price by Application (2020-2025)
4.2 Global Planar Die Bonder Market Estimates and Forecasts by Application (2026-2031)
4.2.1 Global Planar Die Bonder Sales Forecast by Application (2026-2031)
4.2.2 Global Planar Die Bonder Revenue Forecast by Application (2026-2031)
4.2.3 Global Planar Die Bonder Price Forecast by Application (2026-2031)
4.3 New Sources of Growth in Planar Die Bonder Application
5 Competition Landscape by Players
5.1 Global Planar Die Bonder Sales by Players (2020-2025)
5.2 Global Top Planar Die Bonder Players by Revenue (2020-2025)
5.3 Global Planar Die Bonder Market Share by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Planar Die Bonder as of 2024)
5.4 Global Planar Die Bonder Average Price by Company (2020-2025)
5.5 Global Key Manufacturers of Planar Die Bonder, Manufacturing Sites & Headquarters
5.6 Global Key Manufacturers of Planar Die Bonder, Product Type & Application
5.7 Global Key Manufacturers of Planar Die Bonder, Date of Enter into This Industry
5.8 Manufacturers Mergers & Acquisitions, Expansion Plans
6 Region Analysis
6.1 North America Market: Players, Segments, Downstream and Major Customers
6.1.1 North America Planar Die Bonder Sales by Company
6.1.1.1 North America Planar Die Bonder Sales by Company (2020-2025)
6.1.1.2 North America Planar Die Bonder Revenue by Company (2020-2025)
6.1.2 North America Planar Die Bonder Sales Breakdown by Type (2020-2025)
6.1.3 North America Planar Die Bonder Sales Breakdown by Application (2020-2025)
6.1.4 North America Planar Die Bonder Major Customer
6.1.5 North America Market Trend and Opportunities
6.2 Europe Market: Players, Segments, Downstream and Major Customers
6.2.1 Europe Planar Die Bonder Sales by Company
6.2.1.1 Europe Planar Die Bonder Sales by Company (2020-2025)
6.2.1.2 Europe Planar Die Bonder Revenue by Company (2020-2025)
6.2.2 Europe Planar Die Bonder Sales Breakdown by Type (2020-2025)
6.2.3 Europe Planar Die Bonder Sales Breakdown by Application (2020-2025)
6.2.4 Europe Planar Die Bonder Major Customer
6.2.5 Europe Market Trend and Opportunities
6.3 China Market: Players, Segments, Downstream and Major Customers
6.3.1 China Planar Die Bonder Sales by Company
6.3.1.1 China Planar Die Bonder Sales by Company (2020-2025)
6.3.1.2 China Planar Die Bonder Revenue by Company (2020-2025)
6.3.2 China Planar Die Bonder Sales Breakdown by Type (2020-2025)
6.3.3 China Planar Die Bonder Sales Breakdown by Application (2020-2025)
6.3.4 China Planar Die Bonder Major Customer
6.3.5 China Market Trend and Opportunities
6.4 Japan Market: Players, Segments, Downstream and Major Customers
6.4.1 Japan Planar Die Bonder Sales by Company
6.4.1.1 Japan Planar Die Bonder Sales by Company (2020-2025)
6.4.1.2 Japan Planar Die Bonder Revenue by Company (2020-2025)
6.4.2 Japan Planar Die Bonder Sales Breakdown by Type (2020-2025)
6.4.3 Japan Planar Die Bonder Sales Breakdown by Application (2020-2025)
6.4.4 Japan Planar Die Bonder Major Customer
6.4.5 Japan Market Trend and Opportunities
7 Company Profiles and Key Figures
7.1 ASM Pacific Technology Ltd.
7.1.1 ASM Pacific Technology Ltd. Company Information
7.1.2 ASM Pacific Technology Ltd. Business Overview
7.1.3 ASM Pacific Technology Ltd. Planar Die Bonder Sales, Revenue and Gross Margin (2020-2025)
7.1.4 ASM Pacific Technology Ltd. Planar Die Bonder Products Offered
7.1.5 ASM Pacific Technology Ltd. Recent Development
7.2 Kulicke & Soffa Industries, Inc.
7.2.1 Kulicke & Soffa Industries, Inc. Company Information
7.2.2 Kulicke & Soffa Industries, Inc. Business Overview
7.2.3 Kulicke & Soffa Industries, Inc. Planar Die Bonder Sales, Revenue and Gross Margin (2020-2025)
7.2.4 Kulicke & Soffa Industries, Inc. Planar Die Bonder Products Offered
7.2.5 Kulicke & Soffa Industries, Inc. Recent Development
7.3 Tokyo Electron Limited
7.3.1 Tokyo Electron Limited Company Information
7.3.2 Tokyo Electron Limited Business Overview
7.3.3 Tokyo Electron Limited Planar Die Bonder Sales, Revenue and Gross Margin (2020-2025)
7.3.4 Tokyo Electron Limited Planar Die Bonder Products Offered
7.3.5 Tokyo Electron Limited Recent Development
7.4 Applied Materials, Inc.
7.4.1 Applied Materials, Inc. Company Information
7.4.2 Applied Materials, Inc. Business Overview
7.4.3 Applied Materials, Inc. Planar Die Bonder Sales, Revenue and Gross Margin (2020-2025)
7.4.4 Applied Materials, Inc. Planar Die Bonder Products Offered
7.4.5 Applied Materials, Inc. Recent Development
7.5 Disco Corporation
7.5.1 Disco Corporation Company Information
7.5.2 Disco Corporation Business Overview
7.5.3 Disco Corporation Planar Die Bonder Sales, Revenue and Gross Margin (2020-2025)
7.5.4 Disco Corporation Planar Die Bonder Products Offered
7.5.5 Disco Corporation Recent Development
7.6 EV Group (EVG)
7.6.1 EV Group (EVG) Company Information
7.6.2 EV Group (EVG) Business Overview
7.6.3 EV Group (EVG) Planar Die Bonder Sales, Revenue and Gross Margin (2020-2025)
7.6.4 EV Group (EVG) Planar Die Bonder Products Offered
7.6.5 EV Group (EVG) Recent Development
7.7 SPTS Technologies Ltd.
7.7.1 SPTS Technologies Ltd. Company Information
7.7.2 SPTS Technologies Ltd. Business Overview
7.7.3 SPTS Technologies Ltd. Planar Die Bonder Sales, Revenue and Gross Margin (2020-2025)
7.7.4 SPTS Technologies Ltd. Planar Die Bonder Products Offered
7.7.5 SPTS Technologies Ltd. Recent Development
7.8 Besi (BE Semiconductor Industries N.V.)
7.8.1 Besi (BE Semiconductor Industries N.V.) Company Information
7.8.2 Besi (BE Semiconductor Industries N.V.) Business Overview
7.8.3 Besi (BE Semiconductor Industries N.V.) Planar Die Bonder Sales, Revenue and Gross Margin (2020-2025)
7.8.4 Besi (BE Semiconductor Industries N.V.) Planar Die Bonder Products Offered
7.8.5 Besi (BE Semiconductor Industries N.V.) Recent Development
7.9 Nordson Corporation
7.9.1 Nordson Corporation Company Information
7.9.2 Nordson Corporation Business Overview
7.9.3 Nordson Corporation Planar Die Bonder Sales, Revenue and Gross Margin (2020-2025)
7.9.4 Nordson Corporation Planar Die Bonder Products Offered
7.9.5 Nordson Corporation Recent Development
7.10 Shibaura Mechatronics Corporation
7.10.1 Shibaura Mechatronics Corporation Company Information
7.10.2 Shibaura Mechatronics Corporation Business Overview
7.10.3 Shibaura Mechatronics Corporation Planar Die Bonder Sales, Revenue and Gross Margin (2020-2025)
7.10.4 Shibaura Mechatronics Corporation Planar Die Bonder Products Offered
7.10.5 Shibaura Mechatronics Corporation Recent Development
7.11 Palomar Technologies, Inc.
7.11.1 Palomar Technologies, Inc. Company Information
7.11.2 Palomar Technologies, Inc. Business Overview
7.11.3 Palomar Technologies, Inc. Planar Die Bonder Sales, Revenue and Gross Margin (2020-2025)
7.11.4 Palomar Technologies, Inc. Planar Die Bonder Products Offered
7.11.5 Palomar Technologies, Inc. Recent Development
7.12 Shinkawa Ltd.
7.12.1 Shinkawa Ltd. Company Information
7.12.2 Shinkawa Ltd. Business Overview
7.12.3 Shinkawa Ltd. Planar Die Bonder Sales, Revenue and Gross Margin (2020-2025)
7.12.4 Shinkawa Ltd. Planar Die Bonder Products Offered
7.12.5 Shinkawa Ltd. Recent Development
7.13 Towa Corporation
7.13.1 Towa Corporation Company Information
7.13.2 Towa Corporation Business Overview
7.13.3 Towa Corporation Planar Die Bonder Sales, Revenue and Gross Margin (2020-2025)
7.13.4 Towa Corporation Planar Die Bonder Products Offered
7.13.5 Towa Corporation Recent Development
7.14 F&K Delvotec Bondtechnik GmbH
7.14.1 F&K Delvotec Bondtechnik GmbH Company Information
7.14.2 F&K Delvotec Bondtechnik GmbH Business Overview
7.14.3 F&K Delvotec Bondtechnik GmbH Planar Die Bonder Sales, Revenue and Gross Margin (2020-2025)
7.14.4 F&K Delvotec Bondtechnik GmbH Planar Die Bonder Products Offered
7.14.5 F&K Delvotec Bondtechnik GmbH Recent Development
7.15 West Bond, Inc.
7.15.1 West Bond, Inc. Company Information
7.15.2 West Bond, Inc. Business Overview
7.15.3 West Bond, Inc. Planar Die Bonder Sales, Revenue and Gross Margin (2020-2025)
7.15.4 West Bond, Inc. Planar Die Bonder Products Offered
7.15.5 West Bond, Inc. Recent Development
7.16 Orthodyne Electronics Corporation
7.16.1 Orthodyne Electronics Corporation Company Information
7.16.2 Orthodyne Electronics Corporation Business Overview
7.16.3 Orthodyne Electronics Corporation Planar Die Bonder Sales, Revenue and Gross Margin (2020-2025)
7.16.4 Orthodyne Electronics Corporation Planar Die Bonder Products Offered
7.16.5 Orthodyne Electronics Corporation Recent Development
8 Planar Die Bonder Manufacturing Cost Analysis
8.1 Planar Die Bonder Key Raw Materials Analysis
8.1.1 Key Raw Materials
8.1.2 Key Suppliers of Raw Materials
8.2 Proportion of Manufacturing Cost Structure
8.3 Manufacturing Process Analysis of Planar Die Bonder
8.4 Planar Die Bonder Industrial Chain Analysis
9 Marketing Channel, Distributors and Customers
9.1 Marketing Channel
9.2 Planar Die Bonder Distributors List
9.3 Planar Die Bonder Customers
10 Planar Die Bonder Market Dynamics
10.1 Planar Die Bonder Industry Trends
10.2 Planar Die Bonder Market Drivers
10.3 Planar Die Bonder Market Challenges
10.4 Planar Die Bonder Market Restraints
11 Research Findings and Conclusion
12 Appendix
12.1 Research Methodology
12.1.1 Methodology/Research Approach
12.1.1.1 Research Programs/Design
12.1.1.2 Market Size Estimation
12.1.1.3 Market Breakdown and Data Triangulation
12.1.2 Data Source
12.1.2.1 Secondary Sources
12.1.2.2 Primary Sources
12.2 Author Details
12.3 Disclaimer
TABLE OF FIGURES
List of Tables
List of Figures
KEY QUESTIONS ADDRESSED BY THE REPORT
Related Reports
The global market for Planar Die Bonder was estimated to be worth US$ million in 2025 and is projected to reach US$ million, growing at a CAGR of %from 2026 to 2032.
Published Date: 2026-01-31
Pages: 131
USD 3950.00
(Single User License)
The global Planar Die Bonder market was valued at US$ million in 2025 and is anticipated to reach US$ million by 2032, at a CAGR of %from 2026 to 2032.
Published Date: 2026-01-31
Pages: 154
USD 2900.00
(Single User License)
The global Planar Die Bonder market is projected to grow from US$ million in 2024 to US$ million by 2031, at a CAGR of %(2025-2031), driven by critical product segments and diverse end‑use applications, while evolving U.S. tariff policies introduce trade‑cost volatility and supply‑chain uncertainty.
Published Date: 2025-10-03
Pages: 175
USD 4900.00
(Single User License)
The global market for Planar Die Bonder was estimated to be worth US$ million in 2024 and is forecast to a readjusted size of US$ million by 2031 with a CAGR of %during the forecast period 2025-2031.
Published Date: 2025-02-13
Pages: 143
USD 3950.00
(Single User License)
The global market for Planar Die Bonder was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
Published Date: 2025-02-13
Pages: 107
USD 2900.00
(Single User License)
A planar die bonder is a device used in the electronics assembly and packaging process. It is mainly used in the process of fixing micro components such as chips, chipsets, sensors, etc. on printed circuit boards (PCB) or other substrates. A planar die bonder usually includes a workbench, a feeding system and a die bonding head. In operation, the table holds the substrate, the feeding system supplies the chips or components, and the die attach head is responsible for placing the chip precisely on the substrate and fixing it using appropriate methods such as heat pressure or soldering. The operation process of a planar die bonder usually involves the following steps: Preparatory work: setting up and calibrating the machine, preparing substrates and chips. Loading: Place the chip or component in the feeding system, usually using a suction nozzle or other suitable fixture. Positioning: Place the substrate on the workbench and make sure the position is accurate. Die-bonding: The die-bonding head precisely places the chip or component on the substrate, and applies appropriate pressure or temperature to make it firmly connected to the substrate. Inspection: Check whether the connection after die bonding is accurate and reliable. Unloading: Remove the die-bonded substrate from the feeding system and prepare for the next operation. Planar die bonding machine plays a key role in the electronics manufacturing industry. It can improve production efficiency and ensure assembly quality, and is widely used in electronic equipment manufacturing, semiconductor packaging, sensor manufacturing and other fields.
Published Date: 2024-04-14
Pages: 116
USD 4900.00
(Single User License)
A planar die bonder is a device used in the electronics assembly and packaging process. It is mainly used in the process of fixing micro components such as chips, chipsets, sensors, etc. on printed circuit boards (PCB) or other substrates. A planar die bonder usually includes a workbench, a feeding system and a die bonding head. In operation, the table holds the substrate, the feeding system supplies the chips or components, and the die attach head is responsible for placing the chip precisely on the substrate and fixing it using appropriate methods such as heat pressure or soldering. The operation process of a planar die bonder usually involves the following steps: Preparatory work: setting up and calibrating the machine, preparing substrates and chips. Loading: Place the chip or component in the feeding system, usually using a suction nozzle or other suitable fixture. Positioning: Place the substrate on the workbench and make sure the position is accurate. Die-bonding: The die-bonding head precisely places the chip or component on the substrate, and applies appropriate pressure or temperature to make it firmly connected to the substrate. Inspection: Check whether the connection after die bonding is accurate and reliable. Unloading: Remove the die-bonded substrate from the feeding system and prepare for the next operation. Planar die bonding machine plays a key role in the electronics manufacturing industry. It can improve production efficiency and ensure assembly quality, and is widely used in electronic equipment manufacturing, semiconductor packaging, sensor manufacturing and other fields.
Published Date: 2024-01-23
Pages: 116
USD 2900.00
(Single User License)
The global market for Planar Die Bonder was estimated to be worth US$ million in 2025 and is projected to reach US$ million, growing at a CAGR of %from 2026 to 2032.
Published: 2026-01-31
Pages: 131
The global Planar Die Bonder market was valued at US$ million in 2025 and is anticipated to reach US$ million by 2032, at a CAGR of %from 2026 to 2032.
Published: 2026-01-31
Pages: 154
The global Planar Die Bonder market is projected to grow from US$ million in 2024 to US$ million by 2031, at a CAGR of %(2025-2031), driven by critical product segments and diverse end‑use applications, while evolving U.S. tariff policies introduce trade‑cost volatility and supply‑chain uncertainty.
Published: 2025-10-03
Pages: 175
The global market for Planar Die Bonder was estimated to be worth US$ million in 2024 and is forecast to a readjusted size of US$ million by 2031 with a CAGR of %during the forecast period 2025-2031.
Published: 2025-02-13
Pages: 143
The global market for Planar Die Bonder was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
Published: 2025-02-13
Pages: 107
A planar die bonder is a device used in the electronics assembly and packaging process. It is mainly used in the process of fixing micro components such as chips, chipsets, sensors, etc. on printed circuit boards (PCB) or other substrates. A planar die bonder usually includes a workbench, a feeding system and a die bonding head. In operation, the table holds the substrate, the feeding system supplies the chips or components, and the die attach head is responsible for placing the chip precisely on the substrate and fixing it using appropriate methods such as heat pressure or soldering. The operation process of a planar die bonder usually involves the following steps: Preparatory work: setting up and calibrating the machine, preparing substrates and chips. Loading: Place the chip or component in the feeding system, usually using a suction nozzle or other suitable fixture. Positioning: Place the substrate on the workbench and make sure the position is accurate. Die-bonding: The die-bonding head precisely places the chip or component on the substrate, and applies appropriate pressure or temperature to make it firmly connected to the substrate. Inspection: Check whether the connection after die bonding is accurate and reliable. Unloading: Remove the die-bonded substrate from the feeding system and prepare for the next operation. Planar die bonding machine plays a key role in the electronics manufacturing industry. It can improve production efficiency and ensure assembly quality, and is widely used in electronic equipment manufacturing, semiconductor packaging, sensor manufacturing and other fields.
Published: 2024-04-14
Pages: 116
A planar die bonder is a device used in the electronics assembly and packaging process. It is mainly used in the process of fixing micro components such as chips, chipsets, sensors, etc. on printed circuit boards (PCB) or other substrates. A planar die bonder usually includes a workbench, a feeding system and a die bonding head. In operation, the table holds the substrate, the feeding system supplies the chips or components, and the die attach head is responsible for placing the chip precisely on the substrate and fixing it using appropriate methods such as heat pressure or soldering. The operation process of a planar die bonder usually involves the following steps: Preparatory work: setting up and calibrating the machine, preparing substrates and chips. Loading: Place the chip or component in the feeding system, usually using a suction nozzle or other suitable fixture. Positioning: Place the substrate on the workbench and make sure the position is accurate. Die-bonding: The die-bonding head precisely places the chip or component on the substrate, and applies appropriate pressure or temperature to make it firmly connected to the substrate. Inspection: Check whether the connection after die bonding is accurate and reliable. Unloading: Remove the die-bonded substrate from the feeding system and prepare for the next operation. Planar die bonding machine plays a key role in the electronics manufacturing industry. It can improve production efficiency and ensure assembly quality, and is widely used in electronic equipment manufacturing, semiconductor packaging, sensor manufacturing and other fields.
Published: 2024-01-23
Pages: 116
REPORT COVERAGE
DESCRIPTION
OVERVIEW
MARKET SEGMENTATION
CHAPTER OUTLINE
QYRESEARCH'S STRENGTHS
TABLE OF CONTENTS
TABLE OF FIGURES
RLEATED REPORTS
INTEREST IN THIS REPORT?
Get A Free Sample
Request For Quotation
OR
NEED A CUSTOMIZED REPORT?
Customized Report
Request Sample
Pre-Order Enquiry
Add to Cart
Buy Now