Industry: Machinery & Equipment
Published Date: 2025-02-13
Pages: 143 Pages
Report ld: 3748147
Request Sample
Customized Report
The global market for Planar Die Bonder was estimated to be worth US$ million in 2024 and is forecast to a readjusted size of US$ million by 2031 with a CAGR of %during the forecast period 2025-2031.
A planar die bonder is a device used in the electronics assembly and packaging process. It is mainly used in the process of fixing micro components such as chips, chipsets, sensors, etc. on printed circuit boards (PCB) or other substrates. A planar die bonder usually includes a workbench, a feeding system and a die bonding head. In operation, the table holds the substrate, the feeding system supplies the chips or components, and the die attach head is responsible for placing the chip precisely on the substrate and fixing it using appropriate methods such as heat pressure or soldering. The operation process of a planar die bonder usually involves the following steps: Preparatory work: setting up and calibrating the machine, preparing substrates and chips. Loading: Place the chip or component in the feeding system, usually using a suction nozzle or other suitable fixture. Positioning: Place the substrate on the workbench and make sure the position is accurate. Die-bonding: The die-bonding head precisely places the chip or component on the substrate, and applies appropriate pressure or temperature to make it firmly connected to the substrate. Inspection: Check whether the connection after die bonding is accurate and reliable. Unloading: Remove the die-bonded substrate from the feeding system and prepare for the next operation. Planar die bonding machine plays a key role in the electronics manufacturing industry. It can improve production efficiency and ensure assembly quality, and is widely used in electronic equipment manufacturing, semiconductor packaging, sensor manufacturing and other fields.
North American market for Planar Die Bonder was valued at $ million in 2024 and will reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
Asia-Pacific market for Planar Die Bonder was valued at $ million in 2024 and will reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
Europe market for Planar Die Bonder was valued at $ million in 2024 and will reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
The global key companies of Planar Die Bonder include ASM Pacific Technology Ltd., Kulicke & Soffa Industries, Inc., Tokyo Electron Limited, Applied Materials, Inc., Disco Corporation, EV Group (EVG), SPTS Technologies Ltd., Besi (BE Semiconductor Industries N.V.), Nordson Corporation, Shibaura Mechatronics Corporation, etc. In 2024, the global five largest players hold a share approximately % in terms of revenue.
This report aims to provide a comprehensive presentation of the global market for Planar Die Bonder, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Planar Die Bonder by region & country, by Type, and by Application.
The Planar Die Bonder market size, estimations, and forecasts are provided in terms of sales volume (Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Planar Die Bonder.
MARKET SEGMENTATION
CHAPTER OUTLINE
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Planar Die Bonder manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Planar Die Bonder in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Planar Die Bonder in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.
QYRESEARCH'S STRENGTHS
Unlike generic global market reports, this study combines macro-level industry trends with hyper-local operational intelligence, empowering data-driven decisions across the Compound Chocolate value chain, addressing:
We identify regional market threats and growth prospects to guide your overseas layout.
We adjust product portfolios in line with local consumption habits.
We unpack rivals’ operation strategies for scattered and highly concentrated industries.
We cover competition landscape, full supply chain and quantified market size data, and deliver tailor-made customized surveys to meet your unique business demands.
We own self-owned massive exclusive databases, backed by 19 years of global market research experience across thousands of sectors.
Our team operates 24 hours a day, 365 days a year, enabling ultra-fast report turnaround to respond to your research needs efficiently.
We integrate regional risk assessment, localized product optimization and competitor analysis to deliver actionable market strategies.
All data is cross-verified from multiple industry sources to deliver thorough, precise analysis that supports reliable corporate strategic decisions.
We provide responsive, dedicated after-sales support to resolve all follow-up inquiries about reports, data and industry interpretation.
TABLE OF CONTENTS
1 Market Overview
1.1 Planar Die Bonder Product Introduction
1.2 Global Planar Die Bonder Market Size Forecast
1.2.1 Global Planar Die Bonder Sales Value (2020-2031)
1.2.2 Global Planar Die Bonder Sales Volume (2020-2031)
1.2.3 Global Planar Die Bonder Sales Price (2020-2031)
1.3 Planar Die Bonder Market Trends & Drivers
1.3.1 Planar Die Bonder Industry Trends
1.3.2 Planar Die Bonder Market Drivers & Opportunity
1.3.3 Planar Die Bonder Market Challenges
1.3.4 Planar Die Bonder Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Planar Die Bonder Players Revenue Ranking (2024)
2.2 Global Planar Die Bonder Revenue by Company (2020-2025)
2.3 Global Planar Die Bonder Players Sales Volume Ranking (2024)
2.4 Global Planar Die Bonder Sales Volume by Company Players (2020-2025)
2.5 Global Planar Die Bonder Average Price by Company (2020-2025)
2.6 Key Manufacturers Planar Die Bonder Manufacturing Base and Headquarters
2.7 Key Manufacturers Planar Die Bonder Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of Planar Die Bonder
2.9 Planar Die Bonder Market Competitive Analysis
2.9.1 Planar Die Bonder Market Concentration Rate (2020-2025)
2.9.2 Global 5 and 10 Largest Manufacturers by Planar Die Bonder Revenue in 2024
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Planar Die Bonder as of 2024)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 Manual Plane Die Bonder
3.1.2 Semi-Automatic Planar Die Bonder
3.1.3 Fully Automatic Flat Die Bonder
3.2 Global Planar Die Bonder Sales Value by Type
3.2.1 Global Planar Die Bonder Sales Value by Type (2020 VS 2024 VS 2031)
3.2.2 Global Planar Die Bonder Sales Value, by Type (2020-2031)
3.2.3 Global Planar Die Bonder Sales Value, by Type (%) (2020-2031)
3.3 Global Planar Die Bonder Sales Volume by Type
3.3.1 Global Planar Die Bonder Sales Volume by Type (2020 VS 2024 VS 2031)
3.3.2 Global Planar Die Bonder Sales Volume, by Type (2020-2031)
3.3.3 Global Planar Die Bonder Sales Volume, by Type (%) (2020-2031)
3.4 Global Planar Die Bonder Average Price by Type (2020-2031)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Semiconductor Manufacturing
4.1.2 Electronic Packaging
4.1.3 Others
4.2 Global Planar Die Bonder Sales Value by Application
4.2.1 Global Planar Die Bonder Sales Value by Application (2020 VS 2024 VS 2031)
4.2.2 Global Planar Die Bonder Sales Value, by Application (2020-2031)
4.2.3 Global Planar Die Bonder Sales Value, by Application (%) (2020-2031)
4.3 Global Planar Die Bonder Sales Volume by Application
4.3.1 Global Planar Die Bonder Sales Volume by Application (2020 VS 2024 VS 2031)
4.3.2 Global Planar Die Bonder Sales Volume, by Application (2020-2031)
4.3.3 Global Planar Die Bonder Sales Volume, by Application (%) (2020-2031)
4.4 Global Planar Die Bonder Average Price by Application (2020-2031)
5 Segmentation by Region
5.1 Global Planar Die Bonder Sales Value by Region
5.1.1 Global Planar Die Bonder Sales Value by Region: 2020 VS 2024 VS 2031
5.1.2 Global Planar Die Bonder Sales Value by Region (2020-2025)
5.1.3 Global Planar Die Bonder Sales Value by Region (2026-2031)
5.1.4 Global Planar Die Bonder Sales Value by Region (%), (2020-2031)
5.2 Global Planar Die Bonder Sales Volume by Region
5.2.1 Global Planar Die Bonder Sales Volume by Region: 2020 VS 2024 VS 2031
5.2.2 Global Planar Die Bonder Sales Volume by Region (2020-2025)
5.2.3 Global Planar Die Bonder Sales Volume by Region (2026-2031)
5.2.4 Global Planar Die Bonder Sales Volume by Region (%), (2020-2031)
5.3 Global Planar Die Bonder Average Price by Region (2020-2031)
5.4 North America
5.4.1 North America Planar Die Bonder Sales Value, 2020-2031
5.4.2 North America Planar Die Bonder Sales Value by Country (%), 2024 VS 2031
5.5 Europe
5.5.1 Europe Planar Die Bonder Sales Value, 2020-2031
5.5.2 Europe Planar Die Bonder Sales Value by Country (%), 2024 VS 2031
5.6 Asia Pacific
5.6.1 Asia Pacific Planar Die Bonder Sales Value, 2020-2031
5.6.2 Asia Pacific Planar Die Bonder Sales Value by Region (%), 2024 VS 2031
5.7 South America
5.7.1 South America Planar Die Bonder Sales Value, 2020-2031
5.7.2 South America Planar Die Bonder Sales Value by Country (%), 2024 VS 2031
5.8 Middle East & Africa
5.8.1 Middle East & Africa Planar Die Bonder Sales Value, 2020-2031
5.8.2 Middle East & Africa Planar Die Bonder Sales Value by Country (%), 2024 VS 2031
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Planar Die Bonder Sales Value Growth Trends, 2020 VS 2024 VS 2031
6.2 Key Countries/Regions Planar Die Bonder Sales Value
6.2.1 Key Countries/Regions Planar Die Bonder Sales Value, 2020-2031
6.2.2 Key Countries/Regions Planar Die Bonder Sales Volume, 2020-2031
6.3 United States
6.3.1 United States Planar Die Bonder Sales Value, 2020-2031
6.3.2 United States Planar Die Bonder Sales Value by Type (%), 2024 VS 2031
6.3.3 United States Planar Die Bonder Sales Value by Application, 2024 VS 2031
6.4 Europe
6.4.1 Europe Planar Die Bonder Sales Value, 2020-2031
6.4.2 Europe Planar Die Bonder Sales Value by Type (%), 2024 VS 2031
6.4.3 Europe Planar Die Bonder Sales Value by Application, 2024 VS 2031
6.5 China
6.5.1 China Planar Die Bonder Sales Value, 2020-2031
6.5.2 China Planar Die Bonder Sales Value by Type (%), 2024 VS 2031
6.5.3 China Planar Die Bonder Sales Value by Application, 2024 VS 2031
6.6 Japan
6.6.1 Japan Planar Die Bonder Sales Value, 2020-2031
6.6.2 Japan Planar Die Bonder Sales Value by Type (%), 2024 VS 2031
6.6.3 Japan Planar Die Bonder Sales Value by Application, 2024 VS 2031
6.7 South Korea
6.7.1 South Korea Planar Die Bonder Sales Value, 2020-2031
6.7.2 South Korea Planar Die Bonder Sales Value by Type (%), 2024 VS 2031
6.7.3 South Korea Planar Die Bonder Sales Value by Application, 2024 VS 2031
6.8 Southeast Asia
6.8.1 Southeast Asia Planar Die Bonder Sales Value, 2020-2031
6.8.2 Southeast Asia Planar Die Bonder Sales Value by Type (%), 2024 VS 2031
6.8.3 Southeast Asia Planar Die Bonder Sales Value by Application, 2024 VS 2031
6.9 India
6.9.1 India Planar Die Bonder Sales Value, 2020-2031
6.9.2 India Planar Die Bonder Sales Value by Type (%), 2024 VS 2031
6.9.3 India Planar Die Bonder Sales Value by Application, 2024 VS 2031
7 Company Profiles
7.1 ASM Pacific Technology Ltd.
7.1.1 ASM Pacific Technology Ltd. Company Information
7.1.2 ASM Pacific Technology Ltd. Introduction and Business Overview
7.1.3 ASM Pacific Technology Ltd. Planar Die Bonder Sales, Revenue, Price and Gross Margin (2020-2025)
7.1.4 ASM Pacific Technology Ltd. Planar Die Bonder Product Offerings
7.1.5 ASM Pacific Technology Ltd. Recent Development
7.2 Kulicke & Soffa Industries, Inc.
7.2.1 Kulicke & Soffa Industries, Inc. Company Information
7.2.2 Kulicke & Soffa Industries, Inc. Introduction and Business Overview
7.2.3 Kulicke & Soffa Industries, Inc. Planar Die Bonder Sales, Revenue, Price and Gross Margin (2020-2025)
7.2.4 Kulicke & Soffa Industries, Inc. Planar Die Bonder Product Offerings
7.2.5 Kulicke & Soffa Industries, Inc. Recent Development
7.3 Tokyo Electron Limited
7.3.1 Tokyo Electron Limited Company Information
7.3.2 Tokyo Electron Limited Introduction and Business Overview
7.3.3 Tokyo Electron Limited Planar Die Bonder Sales, Revenue, Price and Gross Margin (2020-2025)
7.3.4 Tokyo Electron Limited Planar Die Bonder Product Offerings
7.3.5 Tokyo Electron Limited Recent Development
7.4 Applied Materials, Inc.
7.4.1 Applied Materials, Inc. Company Information
7.4.2 Applied Materials, Inc. Introduction and Business Overview
7.4.3 Applied Materials, Inc. Planar Die Bonder Sales, Revenue, Price and Gross Margin (2020-2025)
7.4.4 Applied Materials, Inc. Planar Die Bonder Product Offerings
7.4.5 Applied Materials, Inc. Recent Development
7.5 Disco Corporation
7.5.1 Disco Corporation Company Information
7.5.2 Disco Corporation Introduction and Business Overview
7.5.3 Disco Corporation Planar Die Bonder Sales, Revenue, Price and Gross Margin (2020-2025)
7.5.4 Disco Corporation Planar Die Bonder Product Offerings
7.5.5 Disco Corporation Recent Development
7.6 EV Group (EVG)
7.6.1 EV Group (EVG) Company Information
7.6.2 EV Group (EVG) Introduction and Business Overview
7.6.3 EV Group (EVG) Planar Die Bonder Sales, Revenue, Price and Gross Margin (2020-2025)
7.6.4 EV Group (EVG) Planar Die Bonder Product Offerings
7.6.5 EV Group (EVG) Recent Development
7.7 SPTS Technologies Ltd.
7.7.1 SPTS Technologies Ltd. Company Information
7.7.2 SPTS Technologies Ltd. Introduction and Business Overview
7.7.3 SPTS Technologies Ltd. Planar Die Bonder Sales, Revenue, Price and Gross Margin (2020-2025)
7.7.4 SPTS Technologies Ltd. Planar Die Bonder Product Offerings
7.7.5 SPTS Technologies Ltd. Recent Development
7.8 Besi (BE Semiconductor Industries N.V.)
7.8.1 Besi (BE Semiconductor Industries N.V.) Company Information
7.8.2 Besi (BE Semiconductor Industries N.V.) Introduction and Business Overview
7.8.3 Besi (BE Semiconductor Industries N.V.) Planar Die Bonder Sales, Revenue, Price and Gross Margin (2020-2025)
7.8.4 Besi (BE Semiconductor Industries N.V.) Planar Die Bonder Product Offerings
7.8.5 Besi (BE Semiconductor Industries N.V.) Recent Development
7.9 Nordson Corporation
7.9.1 Nordson Corporation Company Information
7.9.2 Nordson Corporation Introduction and Business Overview
7.9.3 Nordson Corporation Planar Die Bonder Sales, Revenue, Price and Gross Margin (2020-2025)
7.9.4 Nordson Corporation Planar Die Bonder Product Offerings
7.9.5 Nordson Corporation Recent Development
7.10 Shibaura Mechatronics Corporation
7.10.1 Shibaura Mechatronics Corporation Company Information
7.10.2 Shibaura Mechatronics Corporation Introduction and Business Overview
7.10.3 Shibaura Mechatronics Corporation Planar Die Bonder Sales, Revenue, Price and Gross Margin (2020-2025)
7.10.4 Shibaura Mechatronics Corporation Planar Die Bonder Product Offerings
7.10.5 Shibaura Mechatronics Corporation Recent Development
7.11 Palomar Technologies, Inc.
7.11.1 Palomar Technologies, Inc. Company Information
7.11.2 Palomar Technologies, Inc. Introduction and Business Overview
7.11.3 Palomar Technologies, Inc. Planar Die Bonder Sales, Revenue, Price and Gross Margin (2020-2025)
7.11.4 Palomar Technologies, Inc. Planar Die Bonder Product Offerings
7.11.5 Palomar Technologies, Inc. Recent Development
7.12 Shinkawa Ltd.
7.12.1 Shinkawa Ltd. Company Information
7.12.2 Shinkawa Ltd. Introduction and Business Overview
7.12.3 Shinkawa Ltd. Planar Die Bonder Sales, Revenue, Price and Gross Margin (2020-2025)
7.12.4 Shinkawa Ltd. Planar Die Bonder Product Offerings
7.12.5 Shinkawa Ltd. Recent Development
7.13 Towa Corporation
7.13.1 Towa Corporation Company Information
7.13.2 Towa Corporation Introduction and Business Overview
7.13.3 Towa Corporation Planar Die Bonder Sales, Revenue, Price and Gross Margin (2020-2025)
7.13.4 Towa Corporation Planar Die Bonder Product Offerings
7.13.5 Towa Corporation Recent Development
7.14 F&K Delvotec Bondtechnik GmbH
7.14.1 F&K Delvotec Bondtechnik GmbH Company Information
7.14.2 F&K Delvotec Bondtechnik GmbH Introduction and Business Overview
7.14.3 F&K Delvotec Bondtechnik GmbH Planar Die Bonder Sales, Revenue, Price and Gross Margin (2020-2025)
7.14.4 F&K Delvotec Bondtechnik GmbH Planar Die Bonder Product Offerings
7.14.5 F&K Delvotec Bondtechnik GmbH Recent Development
7.15 West Bond, Inc.
7.15.1 West Bond, Inc. Company Information
7.15.2 West Bond, Inc. Introduction and Business Overview
7.15.3 West Bond, Inc. Planar Die Bonder Sales, Revenue, Price and Gross Margin (2020-2025)
7.15.4 West Bond, Inc. Planar Die Bonder Product Offerings
7.15.5 West Bond, Inc. Recent Development
7.16 Orthodyne Electronics Corporation
7.16.1 Orthodyne Electronics Corporation Company Information
7.16.2 Orthodyne Electronics Corporation Introduction and Business Overview
7.16.3 Orthodyne Electronics Corporation Planar Die Bonder Sales, Revenue, Price and Gross Margin (2020-2025)
7.16.4 Orthodyne Electronics Corporation Planar Die Bonder Product Offerings
7.16.5 Orthodyne Electronics Corporation Recent Development
8 Industry Chain Analysis
8.1 Planar Die Bonder Industrial Chain
8.2 Planar Die Bonder Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Planar Die Bonder Sales Model
8.5.2 Sales Channel
8.5.3 Planar Die Bonder Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.1.1 Research Programs/Design
10.1.1.2 Market Size Estimation
10.1.1.3 Market Breakdown and Data Triangulation
10.1.2 Data Source
10.1.2.1 Secondary Sources
10.1.2.2 Primary Sources
10.2 Author Details
10.3 Disclaimer
TABLE OF FIGURES
List of Tables
List of Figures
KEY QUESTIONS ADDRESSED BY THE REPORT
Related Reports
The global market for Planar Die Bonder was estimated to be worth US$ million in 2025 and is projected to reach US$ million, growing at a CAGR of %from 2026 to 2032.
Published Date: 2026-01-31
Pages: 131
USD 3950.00
(Single User License)
The global Planar Die Bonder market was valued at US$ million in 2025 and is anticipated to reach US$ million by 2032, at a CAGR of %from 2026 to 2032.
Published Date: 2026-01-31
Pages: 154
USD 2900.00
(Single User License)
The global Planar Die Bonder market is projected to grow from US$ million in 2024 to US$ million by 2031, at a CAGR of %(2025-2031), driven by critical product segments and diverse end‑use applications, while evolving U.S. tariff policies introduce trade‑cost volatility and supply‑chain uncertainty.
Published Date: 2025-10-03
Pages: 175
USD 4900.00
(Single User License)
The global Planar Die Bonder market size was US$ million in 2024 and is forecast to a readjusted size of US$ million by 2031 with a CAGR of %during the forecast period 2025-2031.
Published Date: 2025-02-13
Pages: 109
USD 4250.00
(Single User License)
The global market for Planar Die Bonder was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
Published Date: 2025-02-13
Pages: 107
USD 2900.00
(Single User License)
A planar die bonder is a device used in the electronics assembly and packaging process. It is mainly used in the process of fixing micro components such as chips, chipsets, sensors, etc. on printed circuit boards (PCB) or other substrates. A planar die bonder usually includes a workbench, a feeding system and a die bonding head. In operation, the table holds the substrate, the feeding system supplies the chips or components, and the die attach head is responsible for placing the chip precisely on the substrate and fixing it using appropriate methods such as heat pressure or soldering. The operation process of a planar die bonder usually involves the following steps: Preparatory work: setting up and calibrating the machine, preparing substrates and chips. Loading: Place the chip or component in the feeding system, usually using a suction nozzle or other suitable fixture. Positioning: Place the substrate on the workbench and make sure the position is accurate. Die-bonding: The die-bonding head precisely places the chip or component on the substrate, and applies appropriate pressure or temperature to make it firmly connected to the substrate. Inspection: Check whether the connection after die bonding is accurate and reliable. Unloading: Remove the die-bonded substrate from the feeding system and prepare for the next operation. Planar die bonding machine plays a key role in the electronics manufacturing industry. It can improve production efficiency and ensure assembly quality, and is widely used in electronic equipment manufacturing, semiconductor packaging, sensor manufacturing and other fields.
Published Date: 2024-04-14
Pages: 116
USD 4900.00
(Single User License)
A planar die bonder is a device used in the electronics assembly and packaging process. It is mainly used in the process of fixing micro components such as chips, chipsets, sensors, etc. on printed circuit boards (PCB) or other substrates. A planar die bonder usually includes a workbench, a feeding system and a die bonding head. In operation, the table holds the substrate, the feeding system supplies the chips or components, and the die attach head is responsible for placing the chip precisely on the substrate and fixing it using appropriate methods such as heat pressure or soldering. The operation process of a planar die bonder usually involves the following steps: Preparatory work: setting up and calibrating the machine, preparing substrates and chips. Loading: Place the chip or component in the feeding system, usually using a suction nozzle or other suitable fixture. Positioning: Place the substrate on the workbench and make sure the position is accurate. Die-bonding: The die-bonding head precisely places the chip or component on the substrate, and applies appropriate pressure or temperature to make it firmly connected to the substrate. Inspection: Check whether the connection after die bonding is accurate and reliable. Unloading: Remove the die-bonded substrate from the feeding system and prepare for the next operation. Planar die bonding machine plays a key role in the electronics manufacturing industry. It can improve production efficiency and ensure assembly quality, and is widely used in electronic equipment manufacturing, semiconductor packaging, sensor manufacturing and other fields.
Published Date: 2024-01-23
Pages: 116
USD 2900.00
(Single User License)
The global market for Planar Die Bonder was estimated to be worth US$ million in 2025 and is projected to reach US$ million, growing at a CAGR of %from 2026 to 2032.
Published: 2026-01-31
Pages: 131
The global Planar Die Bonder market was valued at US$ million in 2025 and is anticipated to reach US$ million by 2032, at a CAGR of %from 2026 to 2032.
Published: 2026-01-31
Pages: 154
The global Planar Die Bonder market is projected to grow from US$ million in 2024 to US$ million by 2031, at a CAGR of %(2025-2031), driven by critical product segments and diverse end‑use applications, while evolving U.S. tariff policies introduce trade‑cost volatility and supply‑chain uncertainty.
Published: 2025-10-03
Pages: 175
The global Planar Die Bonder market size was US$ million in 2024 and is forecast to a readjusted size of US$ million by 2031 with a CAGR of %during the forecast period 2025-2031.
Published: 2025-02-13
Pages: 109
The global market for Planar Die Bonder was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
Published: 2025-02-13
Pages: 107
A planar die bonder is a device used in the electronics assembly and packaging process. It is mainly used in the process of fixing micro components such as chips, chipsets, sensors, etc. on printed circuit boards (PCB) or other substrates. A planar die bonder usually includes a workbench, a feeding system and a die bonding head. In operation, the table holds the substrate, the feeding system supplies the chips or components, and the die attach head is responsible for placing the chip precisely on the substrate and fixing it using appropriate methods such as heat pressure or soldering. The operation process of a planar die bonder usually involves the following steps: Preparatory work: setting up and calibrating the machine, preparing substrates and chips. Loading: Place the chip or component in the feeding system, usually using a suction nozzle or other suitable fixture. Positioning: Place the substrate on the workbench and make sure the position is accurate. Die-bonding: The die-bonding head precisely places the chip or component on the substrate, and applies appropriate pressure or temperature to make it firmly connected to the substrate. Inspection: Check whether the connection after die bonding is accurate and reliable. Unloading: Remove the die-bonded substrate from the feeding system and prepare for the next operation. Planar die bonding machine plays a key role in the electronics manufacturing industry. It can improve production efficiency and ensure assembly quality, and is widely used in electronic equipment manufacturing, semiconductor packaging, sensor manufacturing and other fields.
Published: 2024-04-14
Pages: 116
A planar die bonder is a device used in the electronics assembly and packaging process. It is mainly used in the process of fixing micro components such as chips, chipsets, sensors, etc. on printed circuit boards (PCB) or other substrates. A planar die bonder usually includes a workbench, a feeding system and a die bonding head. In operation, the table holds the substrate, the feeding system supplies the chips or components, and the die attach head is responsible for placing the chip precisely on the substrate and fixing it using appropriate methods such as heat pressure or soldering. The operation process of a planar die bonder usually involves the following steps: Preparatory work: setting up and calibrating the machine, preparing substrates and chips. Loading: Place the chip or component in the feeding system, usually using a suction nozzle or other suitable fixture. Positioning: Place the substrate on the workbench and make sure the position is accurate. Die-bonding: The die-bonding head precisely places the chip or component on the substrate, and applies appropriate pressure or temperature to make it firmly connected to the substrate. Inspection: Check whether the connection after die bonding is accurate and reliable. Unloading: Remove the die-bonded substrate from the feeding system and prepare for the next operation. Planar die bonding machine plays a key role in the electronics manufacturing industry. It can improve production efficiency and ensure assembly quality, and is widely used in electronic equipment manufacturing, semiconductor packaging, sensor manufacturing and other fields.
Published: 2024-01-23
Pages: 116
REPORT COVERAGE
DESCRIPTION
OVERVIEW
MARKET SEGMENTATION
CHAPTER OUTLINE
QYRESEARCH'S STRENGTHS
TABLE OF CONTENTS
TABLE OF FIGURES
RLEATED REPORTS
INTEREST IN THIS REPORT?
Get A Free Sample
Request For Quotation
OR
NEED A CUSTOMIZED REPORT?
Customized Report
Request Sample
Pre-Order Enquiry
Add to Cart
Buy Now