Industry: Electronics & Semiconductor
Published Date: 2025-06-14
Pages: 97 Pages
Report ld: 4407362
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CPU/GPU Heat Spreader Market Size(US$)

CAGR 2025-2031
8.9%
Market Size,2031
USD 1,248
Million
Market Snapshot
Source: Secondary research, interviews with experts, and QYResearch analysis
The global market for CPU/GPU Heat Spreader was valued at US$ 621 million in the year 2024 and is projected to reach a revised size of US$ 1248 million by 2031, growing at a CAGR of 8.9% during the forecast period.
The 2025 U.S. tariff policies introduce profound uncertainty into the global economic landscape. This report critically examines the implications of recent tariff adjustments and international strategic countermeasures on CPU/GPU Heat Spreader competitive dynamics, regional economic interdependencies, and supply chain reconfigurations.
A heat spreader is high thermal conductive metallic materials for efficient heat dissipation from an IC chip in a semiconductor package. These spreaders are used in CPU/GPU for desktop personal computers and servers/data centers.
Heat spreaders are fundamental in thermal management in electronic design. In cases where natural convection is insufficient for timely heat dissipation, and forced convection using fans is not yet necessary, heat spreaders are widely used as a solution. With the advancement of performance and miniaturization processes, the number of transistors in relation to the chip area has increased. This complexity in circuit design does not always result in a 100% improvement in performance. As a result, a significant portion of electrical energy is converted into thermal energy. Additionally, as process miniaturization progresses, leakage power consumption increases, leading to higher power requirements and waste heat generation within the same unit area. Furthermore, with the trend towards compact desktop computers and all-in-one functionality, future mini PCs will need to handle multiple tasks such as information processing and multimedia performance simultaneously. Therefore, effective heat dissipation becomes crucial, making heat spreaders an indispensable solution for efficient thermal management.
Major thermal solution providers are actively exploring new market applications, including gaming consoles, communication devices, servers, automotive electronics, home electronics, and smartphones. The emerging trends of cloud services and the Internet of Things (IoT) in the market contribute to the increasing demand for servers and data centers. As a result, the need for effective heat dissipation in central processing units (CPUs) and connectors becomes more prominent and represents a promising area for further exploration.
Currently, the global heat spreader market is primarily dominated by manufacturers from Japan, the United States, and China Taiwan, with China Taiwan being the largest production region, accounting for approximately 57% of the global market share in 2024. Japan and the United States are also significant production regions, with market shares of 16.7% and 17.1%, respectively, in 2024. Chinese manufacturers entered this field relatively late, with two main players currently holding a combined global market share of 4.98% in 2024, which is expected to grow to 10.25% by 2031.
In terms of materials, copper heat spreaders currently dominate the market, accounting for 89% of the market share in 2024. Due to the design changes in AI chips, heat spreaders have not only become larger and thicker but also shifted materials. Historically, copper was the primary material used for heat spreaders due to its high thermal conductivity of 401 W/m.K, which is higher than that of gold or aluminum, second only to silver. However, heat spreader materials are now moving toward stainless steel, which has higher hardness and is more difficult to process, thus raising the technological barriers for manufacturers. In the coming years, stainless steel-based heat spreader are expected to see faster growth.
Regarding chip sizes, the proportion of large-sized heat spreader products is gradually increasing. Heat spreaders are closely related to chip packaging. In the past, processors required heat spreaders with an area of around 30mm x 30mm. Now, with chip manufacturers enhancing computational speeds and incorporating more memory, the number of bare die (chips) has significantly increased, expanding the area to 60mm x 60mm or larger. In 2024, heat spreaders with sizes greater than 35mm x 35mm will account for approximately 53%, and it is expected to rise to 61% by 2031.
In terms of market application, PC CPU/GPU heat spreaders currently hold the largest market share, accounting for 52% in 2024. However, the server/data center sector is growing at a faster pace, accounting for 35% in 2024 and projected to reach 50% by 2031.
The main global heat spreader manufacturers include Jentech Precision Industrial, Honeywell, Shinko, Fujikura, I-Chiun, Favor Precision Technology, and Shandong Ruisi Precision Industry. The top five global manufacturers are expected to account for approximately 91% of the market share in 2024. In the coming years, competition in this industry is expected to intensify.
REPORT SCOPE
This report aims to provide a comprehensive presentation of the global market for CPU/GPU Heat Spreader, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding CPU/GPU Heat Spreader.
The CPU/GPU Heat Spreader market size, estimations, and forecasts are provided in terms of output/shipments (Million Pcs) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global CPU/GPU Heat Spreader market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the CPU/GPU Heat Spreader manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
By Company
Shinko
Honeywell Advanced Materials
Jentech Precision Industrial
I-Chiun
Favor Precision Technology
Niching Industrial Corporation
Fastrong Technologies Corp.
ECE (Excel Cell Electronic)
Shandong Ruisi Precision Industry
HongRiDa Electronics (HRD)
TBT Co., Ltd
Segment by Type
Size (Above 35*35mm)
Size (Below 35*35mm)
Segment by Application
PC CPU/GPU Package
Server/Data Center/AI Chip Package
Automotive SoC/FPGA Package
Gaming Console
Others
Production by Region
Japan
China Taiwan
North America
China
Consumption by Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Southeast Asia
Europe
Germany
France
U.K.
Italy
Russia
Latin America
Mexico
Brazil
Argentina
Colombia
Middle East and Africa
Turkey
Saudi Arabia
UAE
CHAPTER OUTLINE
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of CPU/GPU Heat Spreader manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of CPU/GPU Heat Spreader by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of CPU/GPU Heat Spreader in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
QYRESEARCH'S STRENGTHS
Unlike generic global market reports, this study combines macro-level industry trends with hyper-local operational intelligence, empowering data-driven decisions across the Compound Chocolate value chain, addressing:
We identify regional market threats and growth prospects to guide your overseas layout.
We adjust product portfolios in line with local consumption habits.
We unpack rivals’ operation strategies for scattered and highly concentrated industries.
We cover competition landscape, full supply chain and quantified market size data, and deliver tailor-made customized surveys to meet your unique business demands.
We own self-owned massive exclusive databases, backed by 19 years of global market research experience across thousands of sectors.
Our team operates 24 hours a day, 365 days a year, enabling ultra-fast report turnaround to respond to your research needs efficiently.
We integrate regional risk assessment, localized product optimization and competitor analysis to deliver actionable market strategies.
All data is cross-verified from multiple industry sources to deliver thorough, precise analysis that supports reliable corporate strategic decisions.
We provide responsive, dedicated after-sales support to resolve all follow-up inquiries about reports, data and industry interpretation.
TABLE OF CONTENTS
1 CPU/GPU Heat Spreader Market Overview
1.1 Product Definition
1.2 CPU/GPU Heat Spreader by Type
1.2.1 Global CPU/GPU Heat Spreader Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 Size (Above 35*35mm)
1.2.3 Size (Below 35*35mm)
1.3 CPU/GPU Heat Spreader by Application
1.3.1 Global CPU/GPU Heat Spreader Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 PC CPU/GPU Package
1.3.3 Server/Data Center/AI Chip Package
1.3.4 Automotive SoC/FPGA Package
1.3.5 Gaming Console
1.3.6 Others
1.4 Global Market Growth Prospects
1.4.1 Global CPU/GPU Heat Spreader Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global CPU/GPU Heat Spreader Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global CPU/GPU Heat Spreader Production Estimates and Forecasts (2020-2031)
1.4.4 Global CPU/GPU Heat Spreader Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global CPU/GPU Heat Spreader Production Market Share by Manufacturers (2020-2025)
2.2 Global CPU/GPU Heat Spreader Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of CPU/GPU Heat Spreader, Industry Ranking, 2023 VS 2024
2.4 Global CPU/GPU Heat Spreader Company Type and Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global CPU/GPU Heat Spreader Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of CPU/GPU Heat Spreader, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of CPU/GPU Heat Spreader, Product Offered and Application
2.8 Global Key Manufacturers of CPU/GPU Heat Spreader, Date of Enter into This Industry
2.9 CPU/GPU Heat Spreader Market Competitive Situation and Trends
2.9.1 CPU/GPU Heat Spreader Market Concentration Rate
2.9.2 Global 5 and 10 Largest CPU/GPU Heat Spreader Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 CPU/GPU Heat Spreader Production by Region
3.1 Global CPU/GPU Heat Spreader Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global CPU/GPU Heat Spreader Production Value by Region (2020-2031)
3.2.1 Global CPU/GPU Heat Spreader Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of CPU/GPU Heat Spreader by Region (2026-2031)
3.3 Global CPU/GPU Heat Spreader Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global CPU/GPU Heat Spreader Production Volume by Region (2020-2031)
3.4.1 Global CPU/GPU Heat Spreader Production by Region (2020-2025)
3.4.2 Global Forecasted Production of CPU/GPU Heat Spreader by Region (2026-2031)
3.5 Global CPU/GPU Heat Spreader Market Price Analysis by Region (2020-2025)
3.6 Global CPU/GPU Heat Spreader Production and Value, Year-over-Year Growth
3.6.1 Japan CPU/GPU Heat Spreader Production Value Estimates and Forecasts (2020-2031)
3.6.2 China Taiwan CPU/GPU Heat Spreader Production Value Estimates and Forecasts (2020-2031)
3.6.3 North America CPU/GPU Heat Spreader Production Value Estimates and Forecasts (2020-2031)
3.6.4 China CPU/GPU Heat Spreader Production Value Estimates and Forecasts (2020-2031)
4 CPU/GPU Heat Spreader Consumption by Region
4.1 Global CPU/GPU Heat Spreader Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global CPU/GPU Heat Spreader Consumption by Region (2020-2031)
4.2.1 Global CPU/GPU Heat Spreader Consumption by Region (2020-2025)
4.2.2 Global CPU/GPU Heat Spreader Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America CPU/GPU Heat Spreader Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America CPU/GPU Heat Spreader Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe CPU/GPU Heat Spreader Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe CPU/GPU Heat Spreader Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific CPU/GPU Heat Spreader Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific CPU/GPU Heat Spreader Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa CPU/GPU Heat Spreader Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa CPU/GPU Heat Spreader Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global CPU/GPU Heat Spreader Production by Type (2020-2031)
5.1.1 Global CPU/GPU Heat Spreader Production by Type (2020-2025)
5.1.2 Global CPU/GPU Heat Spreader Production by Type (2026-2031)
5.1.3 Global CPU/GPU Heat Spreader Production Market Share by Type (2020-2031)
5.2 Global CPU/GPU Heat Spreader Production Value by Type (2020-2031)
5.2.1 Global CPU/GPU Heat Spreader Production Value by Type (2020-2025)
5.2.2 Global CPU/GPU Heat Spreader Production Value by Type (2026-2031)
5.2.3 Global CPU/GPU Heat Spreader Production Value Market Share by Type (2020-2031)
5.3 Global CPU/GPU Heat Spreader Price by Type (2020-2031)
6 Segment by Application
6.1 Global CPU/GPU Heat Spreader Production by Application (2020-2031)
6.1.1 Global CPU/GPU Heat Spreader Production by Application (2020-2025)
6.1.2 Global CPU/GPU Heat Spreader Production by Application (2026-2031)
6.1.3 Global CPU/GPU Heat Spreader Production Market Share by Application (2020-2031)
6.2 Global CPU/GPU Heat Spreader Production Value by Application (2020-2031)
6.2.1 Global CPU/GPU Heat Spreader Production Value by Application (2020-2025)
6.2.2 Global CPU/GPU Heat Spreader Production Value by Application (2026-2031)
6.2.3 Global CPU/GPU Heat Spreader Production Value Market Share by Application (2020-2031)
6.3 Global CPU/GPU Heat Spreader Price by Application (2020-2031)
7 Key Companies Profiled
7.1 Shinko
7.1.1 Shinko CPU/GPU Heat Spreader Company Information
7.1.2 Shinko CPU/GPU Heat Spreader Product Portfolio
7.1.3 Shinko CPU/GPU Heat Spreader Production, Value, Price and Gross Margin (2020-2025)
7.1.4 Shinko Main Business and Markets Served
7.1.5 Shinko Recent Developments/Updates
7.2 Honeywell Advanced Materials
7.2.1 Honeywell Advanced Materials CPU/GPU Heat Spreader Company Information
7.2.2 Honeywell Advanced Materials CPU/GPU Heat Spreader Product Portfolio
7.2.3 Honeywell Advanced Materials CPU/GPU Heat Spreader Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Honeywell Advanced Materials Main Business and Markets Served
7.2.5 Honeywell Advanced Materials Recent Developments/Updates
7.3 Jentech Precision Industrial
7.3.1 Jentech Precision Industrial CPU/GPU Heat Spreader Company Information
7.3.2 Jentech Precision Industrial CPU/GPU Heat Spreader Product Portfolio
7.3.3 Jentech Precision Industrial CPU/GPU Heat Spreader Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Jentech Precision Industrial Main Business and Markets Served
7.3.5 Jentech Precision Industrial Recent Developments/Updates
7.4 I-Chiun
7.4.1 I-Chiun CPU/GPU Heat Spreader Company Information
7.4.2 I-Chiun CPU/GPU Heat Spreader Product Portfolio
7.4.3 I-Chiun CPU/GPU Heat Spreader Production, Value, Price and Gross Margin (2020-2025)
7.4.4 I-Chiun Main Business and Markets Served
7.4.5 I-Chiun Recent Developments/Updates
7.5 Favor Precision Technology
7.5.1 Favor Precision Technology CPU/GPU Heat Spreader Company Information
7.5.2 Favor Precision Technology CPU/GPU Heat Spreader Product Portfolio
7.5.3 Favor Precision Technology CPU/GPU Heat Spreader Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Favor Precision Technology Main Business and Markets Served
7.5.5 Favor Precision Technology Recent Developments/Updates
7.6 Niching Industrial Corporation
7.6.1 Niching Industrial Corporation CPU/GPU Heat Spreader Company Information
7.6.2 Niching Industrial Corporation CPU/GPU Heat Spreader Product Portfolio
7.6.3 Niching Industrial Corporation CPU/GPU Heat Spreader Production, Value, Price and Gross Margin (2020-2025)
7.6.4 Niching Industrial Corporation Main Business and Markets Served
7.6.5 Niching Industrial Corporation Recent Developments/Updates
7.7 Fastrong Technologies Corp.
7.7.1 Fastrong Technologies Corp. CPU/GPU Heat Spreader Company Information
7.7.2 Fastrong Technologies Corp. CPU/GPU Heat Spreader Product Portfolio
7.7.3 Fastrong Technologies Corp. CPU/GPU Heat Spreader Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Fastrong Technologies Corp. Main Business and Markets Served
7.7.5 Fastrong Technologies Corp. Recent Developments/Updates
7.8 ECE (Excel Cell Electronic)
7.8.1 ECE (Excel Cell Electronic) CPU/GPU Heat Spreader Company Information
7.8.2 ECE (Excel Cell Electronic) CPU/GPU Heat Spreader Product Portfolio
7.8.3 ECE (Excel Cell Electronic) CPU/GPU Heat Spreader Production, Value, Price and Gross Margin (2020-2025)
7.8.4 ECE (Excel Cell Electronic) Main Business and Markets Served
7.8.5 ECE (Excel Cell Electronic) Recent Developments/Updates
7.9 Shandong Ruisi Precision Industry
7.9.1 Shandong Ruisi Precision Industry CPU/GPU Heat Spreader Company Information
7.9.2 Shandong Ruisi Precision Industry CPU/GPU Heat Spreader Product Portfolio
7.9.3 Shandong Ruisi Precision Industry CPU/GPU Heat Spreader Production, Value, Price and Gross Margin (2020-2025)
7.9.4 Shandong Ruisi Precision Industry Main Business and Markets Served
7.9.5 Shandong Ruisi Precision Industry Recent Developments/Updates
7.10 HongRiDa Electronics (HRD)
7.10.1 HongRiDa Electronics (HRD) CPU/GPU Heat Spreader Company Information
7.10.2 HongRiDa Electronics (HRD) CPU/GPU Heat Spreader Product Portfolio
7.10.3 HongRiDa Electronics (HRD) CPU/GPU Heat Spreader Production, Value, Price and Gross Margin (2020-2025)
7.10.4 HongRiDa Electronics (HRD) Main Business and Markets Served
7.10.5 HongRiDa Electronics (HRD) Recent Developments/Updates
7.11 TBT Co., Ltd
7.11.1 TBT Co., Ltd CPU/GPU Heat Spreader Company Information
7.11.2 TBT Co., Ltd CPU/GPU Heat Spreader Product Portfolio
7.11.3 TBT Co., Ltd CPU/GPU Heat Spreader Production, Value, Price and Gross Margin (2020-2025)
7.11.4 TBT Co., Ltd Main Business and Markets Served
7.11.5 TBT Co., Ltd Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 CPU/GPU Heat Spreader Industry Chain Analysis
8.2 CPU/GPU Heat Spreader Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 CPU/GPU Heat Spreader Production Mode & Process Analysis
8.4 CPU/GPU Heat Spreader Sales and Marketing
8.4.1 CPU/GPU Heat Spreader Sales Channels
8.4.2 CPU/GPU Heat Spreader Distributors
8.5 CPU/GPU Heat Spreader Customer Analysis
9 CPU/GPU Heat Spreader Market Dynamics
9.1 CPU/GPU Heat Spreader Industry Trends
9.2 CPU/GPU Heat Spreader Market Drivers
9.3 CPU/GPU Heat Spreader Market Challenges
9.4 CPU/GPU Heat Spreader Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
TABLE OF FIGURES
List of Tables
List of Figures
KEY QUESTIONS ADDRESSED BY THE REPORT
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