Industry: Electronics & Semiconductor
Published Date: 2025-06-14
Pages: 130 Pages
Report ld: 4407356
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CPU/GPU Heat Spreader Market Size(US$)

CAGR 2025-2031
8.9%
Market Size,2031
USD 1,248
Million
Market Snapshot
Source: Secondary research, interviews with experts, and QYResearch analysis
The global market for CPU/GPU Heat Spreader was estimated to be worth US$ 621 million in 2024 and is forecast to a readjusted size of US$ 1248 million by 2031 with a CAGR of 8.9% during the forecast period 2025-2031.
The potential shifts in the 2025 U.S. tariff framework pose substantial volatility risks to global markets. This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on CPU/GPU Heat Spreader cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
A heat spreader is high thermal conductive metallic materials for efficient heat dissipation from an IC chip in a semiconductor package. These spreaders are used in CPU/GPU for desktop personal computers and servers/data centers.
Heat spreaders are fundamental in thermal management in electronic design. In cases where natural convection is insufficient for timely heat dissipation, and forced convection using fans is not yet necessary, heat spreaders are widely used as a solution. With the advancement of performance and miniaturization processes, the number of transistors in relation to the chip area has increased. This complexity in circuit design does not always result in a 100% improvement in performance. As a result, a significant portion of electrical energy is converted into thermal energy. Additionally, as process miniaturization progresses, leakage power consumption increases, leading to higher power requirements and waste heat generation within the same unit area. Furthermore, with the trend towards compact desktop computers and all-in-one functionality, future mini PCs will need to handle multiple tasks such as information processing and multimedia performance simultaneously. Therefore, effective heat dissipation becomes crucial, making heat spreaders an indispensable solution for efficient thermal management.
Major thermal solution providers are actively exploring new market applications, including gaming consoles, communication devices, servers, automotive electronics, home electronics, and smartphones. The emerging trends of cloud services and the Internet of Things (IoT) in the market contribute to the increasing demand for servers and data centers. As a result, the need for effective heat dissipation in central processing units (CPUs) and connectors becomes more prominent and represents a promising area for further exploration.
Currently, the global heat spreader market is primarily dominated by manufacturers from Japan, the United States, and China Taiwan, with China Taiwan being the largest production region, accounting for approximately 57% of the global market share in 2024. Japan and the United States are also significant production regions, with market shares of 16.7% and 17.1%, respectively, in 2024. Chinese manufacturers entered this field relatively late, with two main players currently holding a combined global market share of 4.98% in 2024, which is expected to grow to 10.25% by 2031.
In terms of materials, copper heat spreaders currently dominate the market, accounting for 89% of the market share in 2024. Due to the design changes in AI chips, heat spreaders have not only become larger and thicker but also shifted materials. Historically, copper was the primary material used for heat spreaders due to its high thermal conductivity of 401 W/m.K, which is higher than that of gold or aluminum, second only to silver. However, heat spreader materials are now moving toward stainless steel, which has higher hardness and is more difficult to process, thus raising the technological barriers for manufacturers. In the coming years, stainless steel-based heat spreader are expected to see faster growth.
Regarding chip sizes, the proportion of large-sized heat spreader products is gradually increasing. Heat spreaders are closely related to chip packaging. In the past, processors required heat spreaders with an area of around 30mm x 30mm. Now, with chip manufacturers enhancing computational speeds and incorporating more memory, the number of bare die (chips) has significantly increased, expanding the area to 60mm x 60mm or larger. In 2024, heat spreaders with sizes greater than 35mm x 35mm will account for approximately 53%, and it is expected to rise to 61% by 2031.
In terms of market application, PC CPU/GPU heat spreaders currently hold the largest market share, accounting for 52% in 2024. However, the server/data center sector is growing at a faster pace, accounting for 35% in 2024 and projected to reach 50% by 2031.
The main global heat spreader manufacturers include Jentech Precision Industrial, Honeywell, Shinko, Fujikura, I-Chiun, Favor Precision Technology, and Shandong Ruisi Precision Industry. The top five global manufacturers are expected to account for approximately 91% of the market share in 2024. In the coming years, competition in this industry is expected to intensify.
This report aims to provide a comprehensive presentation of the global market for CPU/GPU Heat Spreader, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of CPU/GPU Heat Spreader by region & country, by Type, and by Application.
The CPU/GPU Heat Spreader market size, estimations, and forecasts are provided in terms of sales volume (Million Pcs) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding CPU/GPU Heat Spreader.
MARKET SEGMENTATION
CHAPTER OUTLINE
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of CPU/GPU Heat Spreader manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of CPU/GPU Heat Spreader in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of CPU/GPU Heat Spreader in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.
QYRESEARCH'S STRENGTHS
Unlike generic global market reports, this study combines macro-level industry trends with hyper-local operational intelligence, empowering data-driven decisions across the Compound Chocolate value chain, addressing:
We identify regional market threats and growth prospects to guide your overseas layout.
We adjust product portfolios in line with local consumption habits.
We unpack rivals’ operation strategies for scattered and highly concentrated industries.
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TABLE OF CONTENTS
1 Market Overview
1.1 CPU/GPU Heat Spreader Product Introduction
1.2 Global CPU/GPU Heat Spreader Market Size Forecast
1.2.1 Global CPU/GPU Heat Spreader Sales Value (2020-2031)
1.2.2 Global CPU/GPU Heat Spreader Sales Volume (2020-2031)
1.2.3 Global CPU/GPU Heat Spreader Sales Price (2020-2031)
1.3 CPU/GPU Heat Spreader Market Trends & Drivers
1.3.1 CPU/GPU Heat Spreader Industry Trends
1.3.2 CPU/GPU Heat Spreader Market Drivers & Opportunity
1.3.3 CPU/GPU Heat Spreader Market Challenges
1.3.4 CPU/GPU Heat Spreader Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global CPU/GPU Heat Spreader Players Revenue Ranking (2024)
2.2 Global CPU/GPU Heat Spreader Revenue by Company (2020-2025)
2.3 Global CPU/GPU Heat Spreader Players Sales Volume Ranking (2024)
2.4 Global CPU/GPU Heat Spreader Sales Volume by Company Players (2020-2025)
2.5 Global CPU/GPU Heat Spreader Average Price by Company (2020-2025)
2.6 Key Manufacturers CPU/GPU Heat Spreader Manufacturing Base and Headquarters
2.7 Key Manufacturers CPU/GPU Heat Spreader Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of CPU/GPU Heat Spreader
2.9 CPU/GPU Heat Spreader Market Competitive Analysis
2.9.1 CPU/GPU Heat Spreader Market Concentration Rate (2020-2025)
2.9.2 Global 5 and 10 Largest Manufacturers by CPU/GPU Heat Spreader Revenue in 2024
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in CPU/GPU Heat Spreader as of 2024)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 Size (Above 35*35mm)
3.1.2 Size (Below 35*35mm)
3.2 Global CPU/GPU Heat Spreader Sales Value by Type
3.2.1 Global CPU/GPU Heat Spreader Sales Value by Type (2020 VS 2024 VS 2031)
3.2.2 Global CPU/GPU Heat Spreader Sales Value, by Type (2020-2031)
3.2.3 Global CPU/GPU Heat Spreader Sales Value, by Type (%) (2020-2031)
3.3 Global CPU/GPU Heat Spreader Sales Volume by Type
3.3.1 Global CPU/GPU Heat Spreader Sales Volume by Type (2020 VS 2024 VS 2031)
3.3.2 Global CPU/GPU Heat Spreader Sales Volume, by Type (2020-2031)
3.3.3 Global CPU/GPU Heat Spreader Sales Volume, by Type (%) (2020-2031)
3.4 Global CPU/GPU Heat Spreader Average Price by Type (2020-2031)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 PC CPU/GPU Package
4.1.2 Server/Data Center/AI Chip Package
4.1.3 Automotive SoC/FPGA Package
4.1.4 Gaming Console
4.1.5 Others
4.2 Global CPU/GPU Heat Spreader Sales Value by Application
4.2.1 Global CPU/GPU Heat Spreader Sales Value by Application (2020 VS 2024 VS 2031)
4.2.2 Global CPU/GPU Heat Spreader Sales Value, by Application (2020-2031)
4.2.3 Global CPU/GPU Heat Spreader Sales Value, by Application (%) (2020-2031)
4.3 Global CPU/GPU Heat Spreader Sales Volume by Application
4.3.1 Global CPU/GPU Heat Spreader Sales Volume by Application (2020 VS 2024 VS 2031)
4.3.2 Global CPU/GPU Heat Spreader Sales Volume, by Application (2020-2031)
4.3.3 Global CPU/GPU Heat Spreader Sales Volume, by Application (%) (2020-2031)
4.4 Global CPU/GPU Heat Spreader Average Price by Application (2020-2031)
5 Segmentation by Region
5.1 Global CPU/GPU Heat Spreader Sales Value by Region
5.1.1 Global CPU/GPU Heat Spreader Sales Value by Region: 2020 VS 2024 VS 2031
5.1.2 Global CPU/GPU Heat Spreader Sales Value by Region (2020-2025)
5.1.3 Global CPU/GPU Heat Spreader Sales Value by Region (2026-2031)
5.1.4 Global CPU/GPU Heat Spreader Sales Value by Region (%), (2020-2031)
5.2 Global CPU/GPU Heat Spreader Sales Volume by Region
5.2.1 Global CPU/GPU Heat Spreader Sales Volume by Region: 2020 VS 2024 VS 2031
5.2.2 Global CPU/GPU Heat Spreader Sales Volume by Region (2020-2025)
5.2.3 Global CPU/GPU Heat Spreader Sales Volume by Region (2026-2031)
5.2.4 Global CPU/GPU Heat Spreader Sales Volume by Region (%), (2020-2031)
5.3 Global CPU/GPU Heat Spreader Average Price by Region (2020-2031)
5.4 North America
5.4.1 North America CPU/GPU Heat Spreader Sales Value, 2020-2031
5.4.2 North America CPU/GPU Heat Spreader Sales Value by Country (%), 2024 VS 2031
5.5 Europe
5.5.1 Europe CPU/GPU Heat Spreader Sales Value, 2020-2031
5.5.2 Europe CPU/GPU Heat Spreader Sales Value by Country (%), 2024 VS 2031
5.6 Asia Pacific
5.6.1 Asia Pacific CPU/GPU Heat Spreader Sales Value, 2020-2031
5.6.2 Asia Pacific CPU/GPU Heat Spreader Sales Value by Region (%), 2024 VS 2031
5.7 South America
5.7.1 South America CPU/GPU Heat Spreader Sales Value, 2020-2031
5.7.2 South America CPU/GPU Heat Spreader Sales Value by Country (%), 2024 VS 2031
5.8 Middle East & Africa
5.8.1 Middle East & Africa CPU/GPU Heat Spreader Sales Value, 2020-2031
5.8.2 Middle East & Africa CPU/GPU Heat Spreader Sales Value by Country (%), 2024 VS 2031
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions CPU/GPU Heat Spreader Sales Value Growth Trends, 2020 VS 2024 VS 2031
6.2 Key Countries/Regions CPU/GPU Heat Spreader Sales Value and Sales Volume
6.2.1 Key Countries/Regions CPU/GPU Heat Spreader Sales Value, 2020-2031
6.2.2 Key Countries/Regions CPU/GPU Heat Spreader Sales Volume, 2020-2031
6.3 United States
6.3.1 United States CPU/GPU Heat Spreader Sales Value, 2020-2031
6.3.2 United States CPU/GPU Heat Spreader Sales Value by Type (%), 2024 VS 2031
6.3.3 United States CPU/GPU Heat Spreader Sales Value by Application, 2024 VS 2031
6.4 Europe
6.4.1 Europe CPU/GPU Heat Spreader Sales Value, 2020-2031
6.4.2 Europe CPU/GPU Heat Spreader Sales Value by Type (%), 2024 VS 2031
6.4.3 Europe CPU/GPU Heat Spreader Sales Value by Application, 2024 VS 2031
6.5 China
6.5.1 China CPU/GPU Heat Spreader Sales Value, 2020-2031
6.5.2 China CPU/GPU Heat Spreader Sales Value by Type (%), 2024 VS 2031
6.5.3 China CPU/GPU Heat Spreader Sales Value by Application, 2024 VS 2031
6.6 Japan
6.6.1 Japan CPU/GPU Heat Spreader Sales Value, 2020-2031
6.6.2 Japan CPU/GPU Heat Spreader Sales Value by Type (%), 2024 VS 2031
6.6.3 Japan CPU/GPU Heat Spreader Sales Value by Application, 2024 VS 2031
6.7 South Korea
6.7.1 South Korea CPU/GPU Heat Spreader Sales Value, 2020-2031
6.7.2 South Korea CPU/GPU Heat Spreader Sales Value by Type (%), 2024 VS 2031
6.7.3 South Korea CPU/GPU Heat Spreader Sales Value by Application, 2024 VS 2031
6.8 Southeast Asia
6.8.1 Southeast Asia CPU/GPU Heat Spreader Sales Value, 2020-2031
6.8.2 Southeast Asia CPU/GPU Heat Spreader Sales Value by Type (%), 2024 VS 2031
6.8.3 Southeast Asia CPU/GPU Heat Spreader Sales Value by Application, 2024 VS 2031
6.9 India
6.9.1 India CPU/GPU Heat Spreader Sales Value, 2020-2031
6.9.2 India CPU/GPU Heat Spreader Sales Value by Type (%), 2024 VS 2031
6.9.3 India CPU/GPU Heat Spreader Sales Value by Application, 2024 VS 2031
7 Company Profiles
7.1 Shinko
7.1.1 Shinko Company Information
7.1.2 Shinko Introduction and Business Overview
7.1.3 Shinko CPU/GPU Heat Spreader Sales, Revenue, Price and Gross Margin (2020-2025)
7.1.4 Shinko CPU/GPU Heat Spreader Product Offerings
7.1.5 Shinko Recent Development
7.2 Honeywell Advanced Materials
7.2.1 Honeywell Advanced Materials Company Information
7.2.2 Honeywell Advanced Materials Introduction and Business Overview
7.2.3 Honeywell Advanced Materials CPU/GPU Heat Spreader Sales, Revenue, Price and Gross Margin (2020-2025)
7.2.4 Honeywell Advanced Materials CPU/GPU Heat Spreader Product Offerings
7.2.5 Honeywell Advanced Materials Recent Development
7.3 Jentech Precision Industrial
7.3.1 Jentech Precision Industrial Company Information
7.3.2 Jentech Precision Industrial Introduction and Business Overview
7.3.3 Jentech Precision Industrial CPU/GPU Heat Spreader Sales, Revenue, Price and Gross Margin (2020-2025)
7.3.4 Jentech Precision Industrial CPU/GPU Heat Spreader Product Offerings
7.3.5 Jentech Precision Industrial Recent Development
7.4 I-Chiun
7.4.1 I-Chiun Company Information
7.4.2 I-Chiun Introduction and Business Overview
7.4.3 I-Chiun CPU/GPU Heat Spreader Sales, Revenue, Price and Gross Margin (2020-2025)
7.4.4 I-Chiun CPU/GPU Heat Spreader Product Offerings
7.4.5 I-Chiun Recent Development
7.5 Favor Precision Technology
7.5.1 Favor Precision Technology Company Information
7.5.2 Favor Precision Technology Introduction and Business Overview
7.5.3 Favor Precision Technology CPU/GPU Heat Spreader Sales, Revenue, Price and Gross Margin (2020-2025)
7.5.4 Favor Precision Technology CPU/GPU Heat Spreader Product Offerings
7.5.5 Favor Precision Technology Recent Development
7.6 Niching Industrial Corporation
7.6.1 Niching Industrial Corporation Company Information
7.6.2 Niching Industrial Corporation Introduction and Business Overview
7.6.3 Niching Industrial Corporation CPU/GPU Heat Spreader Sales, Revenue, Price and Gross Margin (2020-2025)
7.6.4 Niching Industrial Corporation CPU/GPU Heat Spreader Product Offerings
7.6.5 Niching Industrial Corporation Recent Development
7.7 Fastrong Technologies Corp.
7.7.1 Fastrong Technologies Corp. Company Information
7.7.2 Fastrong Technologies Corp. Introduction and Business Overview
7.7.3 Fastrong Technologies Corp. CPU/GPU Heat Spreader Sales, Revenue, Price and Gross Margin (2020-2025)
7.7.4 Fastrong Technologies Corp. CPU/GPU Heat Spreader Product Offerings
7.7.5 Fastrong Technologies Corp. Recent Development
7.8 ECE (Excel Cell Electronic)
7.8.1 ECE (Excel Cell Electronic) Company Information
7.8.2 ECE (Excel Cell Electronic) Introduction and Business Overview
7.8.3 ECE (Excel Cell Electronic) CPU/GPU Heat Spreader Sales, Revenue, Price and Gross Margin (2020-2025)
7.8.4 ECE (Excel Cell Electronic) CPU/GPU Heat Spreader Product Offerings
7.8.5 ECE (Excel Cell Electronic) Recent Development
7.9 Shandong Ruisi Precision Industry
7.9.1 Shandong Ruisi Precision Industry Company Information
7.9.2 Shandong Ruisi Precision Industry Introduction and Business Overview
7.9.3 Shandong Ruisi Precision Industry CPU/GPU Heat Spreader Sales, Revenue, Price and Gross Margin (2020-2025)
7.9.4 Shandong Ruisi Precision Industry CPU/GPU Heat Spreader Product Offerings
7.9.5 Shandong Ruisi Precision Industry Recent Development
7.10 HongRiDa Electronics (HRD)
7.10.1 HongRiDa Electronics (HRD) Company Information
7.10.2 HongRiDa Electronics (HRD) Introduction and Business Overview
7.10.3 HongRiDa Electronics (HRD) CPU/GPU Heat Spreader Sales, Revenue, Price and Gross Margin (2020-2025)
7.10.4 HongRiDa Electronics (HRD) CPU/GPU Heat Spreader Product Offerings
7.10.5 HongRiDa Electronics (HRD) Recent Development
7.11 TBT Co., Ltd
7.11.1 TBT Co., Ltd Company Information
7.11.2 TBT Co., Ltd Introduction and Business Overview
7.11.3 TBT Co., Ltd CPU/GPU Heat Spreader Sales, Revenue, Price and Gross Margin (2020-2025)
7.11.4 TBT Co., Ltd CPU/GPU Heat Spreader Product Offerings
7.11.5 TBT Co., Ltd Recent Development
8 Industry Chain Analysis
8.1 CPU/GPU Heat Spreader Industrial Chain
8.2 CPU/GPU Heat Spreader Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 CPU/GPU Heat Spreader Sales Model
8.5.2 Sales Channel
8.5.3 CPU/GPU Heat Spreader Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.1.1 Research Programs/Design
10.1.1.2 Market Size Estimation
10.1.1.3 Market Breakdown and Data Triangulation
10.1.2 Data Source
10.1.2.1 Secondary Sources
10.1.2.2 Primary Sources
10.2 Author Details
10.3 Disclaimer
TABLE OF FIGURES
List of Tables
List of Figures
KEY QUESTIONS ADDRESSED BY THE REPORT
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REPORT COVERAGE
DESCRIPTION
OVERVIEW
MARKET SEGMENTATION
CHAPTER OUTLINE
QYRESEARCH'S STRENGTHS
TABLE OF CONTENTS
TABLE OF FIGURES
RLEATED REPORTS
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