Industry Research Reports

Non-Conductive Film (NCF) is applied for 3D-package which consists of stacking of Through Silicon Via (TSV) memory with narrow bump pitch and narrow gap. In HBM, NCF is the core factor that determines heat and semiconductor height.

A PCB laser drilling machine is a piece of equipment specifically used in the electronics manufacturing industry for precision laser drilling in printed circuit boards (PCBs). These machines utilize laser technology to create tiny and precise holes in PCBs to meet the manufacturing needs of high-density circuit boards and microelectronic devices. These devices play a key role in PCB manufacturing for the electronics industry, supporting a variety of applications including the creation of vias, fabrication of microvias, and implementation of precision circuit designs.

This report studies the AMHS for Semiconductor and Flat Panel Display.

AR/VR SoC stands for Augmented Reality/Virtual Reality System-on-Chip. It refers to a specialized integrated circuit that combines various components required for processing and rendering AR (Augmented Reality) and VR (Virtual Reality) experiences into a single chip. These components typically include CPU (Central Processing Unit), GPU (Graphics Processing Unit), DSP (Digital Signal Processor), memory controllers, I/O interfaces, and other specialized hardware accelerators tailored for AR/VR applications. The purpose of an AR/VR SoC is to optimize performance, power efficiency, and cost-effectiveness for AR and VR devices such as headsets, glasses, and other wearable gadgets. By integrating multiple functions into a single chip, AR/VR SoCs can enable smoother and more immersive user experiences while minimizing the power consumption and physical footprint of the devices. They are essential for pushing the boundaries of AR and VR technology and making these experiences more accessible to consumers.

Engineered technical ceramics are used in the semiconductor industry because of their excellent material properties. This report studies the structural ceramic components used in semiconductor wafer processing, and semiconductor fabrication (front end). Key ceramic components for crystal silicon pulling, deposition (CVD, PVD, ALD, Etch, High Temp Processing, Ion Implant, Lithography & Wafer Inspection, Diffusion & LPCVD Processing, CMP, and Wafer Handling, etc.

Manufacturing silicon wafers and semiconductors require a harsh environment. This abrasive environment dramatically shortens the life of chamber components used to house the process, threatening the quality of the highly sensitive products. This report studies the coating service for semiconductor equipment parts, like chambers, showerhead (GDP), electrostatic chuck (ESC), liners, baffle, shield cover, heater, shutter, focus ring, edge ring, ceramic window, etch gas injector, etc.

The global SiC Diodes revenue was US$ 458 million in 2023 and is forecast to a readjusted size of US$ 2345 million by 2030 with a CAGR of 25.0% during the review period (2024-2030).

Semiconductor probe is a high-end precision electronic component, which is mainly used in the semiconductor testing process to test the conduction, current, function, aging and other performance indicators of the chip by connecting to the testing machine. Semiconductor probes are mainly used for semiconductor chip design verification, wafer testing, and finished product testing mitigation. They are the core components that connect chips, wafers and testing equipment for signal transmission, and play an important role in the quality control of semiconductor products.

Linear Pluggable Optics (LPO) is a term used in the context of optical networking to describe a form factor and interface standard for high-speed optical transceivers. LPO modules are designed to provide flexible and modular optical connectivity in networking equipment, such as switches and routers. The concept of LPO emerged as a response to the need for a compact, hot-swappable, and interoperable form factor for high-speed optical transceivers. LPO modules are typically small in size and feature a pluggable design that allows for easy installation and removal without interrupting network operation. LPO modules are commonly used in data centers, telecommunications networks, and other high-bandwidth applications where flexible and scalable optical connectivity is essential. They offer a modular approach to optical networking, allowing for easy upgrades, replacement, and scalability as network bandwidth requirements evolve.

Power supply filter is a filter circuit composed of capacitors, inductors and resistors, a passive bidirectional network, one end of which is the power supply and the other end is the load. The principle of the power filter is a kind of impedance adaptation network: the greater the impedance adaptation between the input and output sides of the power filter and the power supply and load sides, the more effective the attenuation of electromagnetic interference. The filter can effectively filter the frequency point of a specific frequency in the power line or the frequency other than the frequency point to obtain a power signal of a specific frequency, or eliminate the power signal of a specific frequency.