Industry: Electronics & Semiconductor
Published Date: 2025-08-23
Pages: 125 Pages
Report ld: 4936473
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OLED DDIC Packaging and Testing Market Size(US$)

CAGR 2025-2031
10.8%
Market Size,2031
USD 919
Million
Market Snapshot
Source: Secondary research, interviews with experts, and QYResearch analysis
The global OLED DDIC Packaging and Testing market is projected to grow from US$ 448 million in 2024 to US$ 919 million by 2031, at a CAGR of 10.8% (2025-2031), driven by critical product segments and diverse end‑use applications.
In 2024, the global OLED DDIC packaging and testing services will reach US$448.39 million. Gold bumping services are valued at US$122.83 per wafer, wafer testing (CP) at US$90.82 per wafer, and chip-on-film (COF) at US$90.82 per 1,000 wafers. The display driver chip (DDIC), abbreviated as DDIC, is one of the key control components of a display panel and is often referred to as the "brain" of the display panel. Its primary function is to transmit drive signals and data to the display panel in the form of electrical signals. This control enables image information to be displayed on the screen by controlling screen brightness and color. DDICs are widely used in products such as televisions, monitors, laptops, tablets, mobile phones, and smart wearable devices. The packaging and molding of display driver chips requires the coordinated coordination of multiple processes: Step 1: Incoming material inspection, which involves microscopically inspecting customer-provided wafers to detect defects. Step 2: Gold bump fabrication, which involves creating gold bumps on the surface of qualified wafers. Step 3: Wafer testing, which involves contacting each die on the wafer with a probe to test their electrical characteristics. Step 4: Grinding, dicing, cleaning, and sorting, which involves grinding the wafer to the required thickness, dicing, and selecting qualified chips. Step 5: COG or COF packaging. COG stands for chip-on-glass packaging, which involves packaging and shipping after step 4, with the panel or module manufacturer bonding the chip to the glass substrate. COF, for chip-on-film packaging, involves bonding the chip's internal pins to the tape, applying adhesive, and baking to secure the bond. The finished chips are then packaged and shipped after testing. OLED DDIC packaging and testing places higher demands on cutting and testing. Especially during the testing process, compared to LCDs, OLED display driver chips occupy test equipment for longer periods of time, resulting in higher pricing and higher gross profit margins.
Supply Chain:
Main raw materials include gold plating solution, gold salt, gold target, tray, photoresist, and COG tape. Gold-containing electroplating solutions are primarily supplied by Japan, while gold salts, gold targets, trays, photoresist, and COG tapes come from Taiwan and Hong Kong. Key equipment in the packaging and testing process, including grinders, wafer saws, and testers, is also primarily supplied by Japanese manufacturers.
Industry Chain:
Packaging and testing occupy a mid- to downstream role in the display driver chip industry chain. The ordering process for display driver chips follows: panel manufacturers submit their requirements, chip design companies complete the designs, and then place the orders with wafer fabrication foundries and packaging and testing companies. The production process for display driver chips follows the design by the chip design company, which is then manufactured by the wafer fabrication foundry. The chips are then handed over to packaging and testing companies for bumping, packaging, and testing. Finally, the finished chips are delivered directly to display panel or module manufacturers for assembly. Display driver chip manufacturers include Samsung, LG, TSMC, SMIC, Nexchip, and UMC. Display driver chip design companies include Samsung, LG, Novatek Microelectronics Corporation, Himax Technologies, ChiponeIC, GalaxyCore, Torey, OmniVision, SinoWealth, Jadard Technology, Fitipower, Raydium Semiconductor, ITH Corporation, Sitronix, Solomon-Systech, Aixiesheng, and New Vision Microelectronics. Display driver chip packaging and testing suppliers include Samsung, LG, Chipbond, ChipMOS, Chipmore, Union Semiconductor, and TongFu Microelectronics. Downstream display panel manufacturers include Samsung, LG, BOE, TCL CSOT, Tianma Microelectronics, and Visionox. Samsung and LG employ a fully integrated supply chain model, integrating chip design, chip manufacturing, packaging, panel manufacturing, and device manufacturers within their groups.
Similar to the display panel industry, global DDIC packaging and testing manufacturers are primarily concentrated in South Korea, Taiwan, and mainland China. With the shift in the DDIC industry, the packaging and testing supply chain is also shifting from South Korea and Taiwan to mainland China.
South Korea: Steco and LB Lucem, for example, provide DDIC packaging and testing services to the Samsung and LG ecosystems, respectively, but do not offer services to external parties. As leading companies in the display panel industry, Samsung and LG employ a fully integrated model, possessing strong technological and scale advantages.
Taiwan: Chipbond and IMOS-ChipMOS are examples. Due to the relatively well-developed LCD industry, over ten packaging and testing manufacturers have entered the DDIC packaging and testing sector, intensifying competition. After years of industry consolidation, small and medium-sized manufacturers have been continuously acquired by larger ones. Currently, only two core manufacturers, Chipbond and ChipMOS, remain in the market, forming a duopoly. Mainland China: Due to its relatively late start, the industry lags behind South Korea and Taiwan in terms of technology and scale. Representative companies include Tongfu, Union Semiconductor (Hefei) Co., Ltd., and Jiangsu nepes Semiconductor Co., Ltd. Currently, with the rapid growth of the display driver design industry and increasing capital investment, the DDIC packaging and testing business is gradually shifting to mainland China.
Report Includes:
This definitive report equips CEOs, marketing directors, and investors with a 360° view of the global OLED DDIC Packaging and Testing market across value chain. It analyzes historical revenue data (2020–2024) and delivers forecasts through 2031, illuminating demand trends and growth drivers.
By segmenting the market by Type and by Application, the study quantifies market size, growth rates, niche opportunities, and substitution risks, and analyzes downstream customers distribution pattern.
Granular regional insights cover five major markets—North America, Europe, APAC, South America, and MEA—with in‑depth analysis of 20+ countries, detailing dominant products, competitive landscape, and downstream demand trends.
Critical competitive intelligence profiles players—revenue, margins, pricing strategies, and major customers—and dissects the top-player positioning across product lines, applications, and regions to reveal strategic strengths.
A concise Industry‑chain overview maps upstream, middlestream, and downstream distribution dynamics to identify strategic gaps and unmet demand.
MARKET SEGMENTATION
CHAPTER OUTLINE
Chapter 1: Defines the OLED DDIC Packaging and Testing study scope, segments the market by Type and by Application, etc, highlights segment size and growth potential.
Chapter 2: Offers current market state, projects global revenue and sales to 2031, pinpointing high consumption regions and emerging market catalysts
Chapter 3: Dissects the player landscape—ranks by revenue and profitability, details Player performance by product type and evaluates concentration alongside M&A moves.
Chapter 4: Unlocks high margin product segments—compares revenue, ASP, and technology differentiators, highlighting growth niches and substitution risks
Chapter 5: Targets downstream market opportunities—evaluates market size by Application, identifies emerging use cases, and profiles leading customers by region and by Application.
Chapter 6: North America—breaks down market size by Type, by Application and country, profiles key players and assesses growth drivers and barriers.
Chapter 7: Europe—analyses regional market by Type, by Application and players, flagging drivers and barriers.
Chapter 8: Asia Pacific—quantifies market size by Type, by Application, and region/country, profiles top players, and uncovers high potential expansion areas.
Chapter 9: Central & South America—measures market size by Type, by Application, and country, profiles top players, and identifies investment opportunities and challenges.
Chapter 10: Middle East and Africa—evaluates market size by Type, by Application, and country, profiles key players, and outlines investment prospects and market hurdles
Chapter 11: Profiles players in depth—details product specs, revenue, margins; Top-tier players 2024 sales breakdowns by Product type, by Application, by region SWOT analysis, and recent strategic developments.
Chapter 12: Industry chain—analyses upstream, cost drivers, plus downstream channels.
Chapter 13: Market dynamics—explores drivers, restraints, regulatory impacts, and risk mitigation strategies.
Chapter 14: Actionable conclusions and strategic recommendations.
WHY THIS REPORT
Beyond standard market data, this analysis provides a clear profitability roadmap, empowering you to:
Beyond standard market data, this analysis provides a clear profitability roadmap—empowering you to:
Allocate capital strategically to high growth regions (Chapters 6–10) and margin rich segments (Chapter 5).
Negotiate from strength with suppliers (Chapter 12) and customers (Chapter 5) using cost and demand intelligence.
Outmaneuver competitors with granular insights into their operations, margins, and strategies (Chapters 3 and 11).
Capitalize on the projected billion‑dollar opportunity with data‑driven regional and segment tactics (Chapter 12-14).
Leverage this 360° intelligence to turn market complexity into actionable competitive advantage.
QYRESEARCH'S STRENGTHS
Unlike generic global market reports, this study combines macro-level industry trends with hyper-local operational intelligence, empowering data-driven decisions across the Compound Chocolate value chain, addressing:
We identify regional market threats and growth prospects to guide your overseas layout.
We adjust product portfolios in line with local consumption habits.
We unpack rivals’ operation strategies for scattered and highly concentrated industries.
We cover competition landscape, full supply chain and quantified market size data, and deliver tailor-made customized surveys to meet your unique business demands.
We own self-owned massive exclusive databases, backed by 19 years of global market research experience across thousands of sectors.
Our team operates 24 hours a day, 365 days a year, enabling ultra-fast report turnaround to respond to your research needs efficiently.
We integrate regional risk assessment, localized product optimization and competitor analysis to deliver actionable market strategies.
All data is cross-verified from multiple industry sources to deliver thorough, precise analysis that supports reliable corporate strategic decisions.
We provide responsive, dedicated after-sales support to resolve all follow-up inquiries about reports, data and industry interpretation.
TABLE OF CONTENTS
1 Study Coverage
1.1 Introduction to OLED DDIC Packaging and Testing: Definition, Properties, and Key Attributes
1.2 Market Segmentation by Type
1.2.1 Global OLED DDIC Packaging and Testing Market Size by Type, 2020 VS 2024 VS 2031
1.2.2 8-inch Wafer Packaging and Testing
1.2.3 12-inch Wafer Packaging and Testing
1.3 Market Segmentation by Application
1.3.1 Global OLED DDIC Packaging and Testing Market Size by Application, 2020 VS 2024 VS 2031
1.3.2 TVs & Displays
1.3.3 Laptops & Tablets
1.3.4 Mobile Phones
1.3.5 Smart Wearables
1.3.6 In-Vehicle Displays
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Executive Summary
2.1 Global OLED DDIC Packaging and Testing Revenue Estimates and Forecasts 2020-2031
2.2 Global OLED DDIC Packaging and Testing Revenue by Region
2.2.1 Revenue Comparison: 2020 VS 2024 VS 2031
2.2.2 Historical and Forecasted Revenue by Region (2020-2031)
2.2.3 Global Revenue Market Share by Region (2020-2031)
2.2.4 Emerging Market Focus: Growth Drivers & Investment Trends
3 Competition by Players
3.1 Global OLED DDIC Packaging and Testing Player Revenue Rankings and Profitability
3.1.1 Global Revenue (Value) by Players (2020-2025)
3.1.2 Global Key Player Revenue Ranking (2023 vs. 2024)
3.1.3 Revenue-Based Tier Segmentation (Tier 1, Tier 2, and Tier 3)
3.1.4 Gross Margin by Top Player (2020 VS 2024)
3.2 Global OLED DDIC Packaging and Testing Companies Headquarters and Service Footprint
3.3 Main Product Type Market Size by Players
3.3.1 8-inch Wafer Packaging and Testing Market Size by Players
3.3.2 12-inch Wafer Packaging and Testing Market Size by Players
3.4 Global OLED DDIC Packaging and Testing Market Concentration and Dynamics
3.4.1 Global Market Concentration (CR5 and HHI)
3.4.2 Entrant/Exit Impact Analysis
3.4.3 Strategic Moves: M&A, Expansion, R&D Investment
4 Global Product Segmentation Analysis
4.1 Global OLED DDIC Packaging and Testing Revenue Trends by Type
4.1.1 Global Historical and Forecasted Revenue by Type (2020-2031)
4.1.2 Global Revenue Market Share by Type (2020-2031)
4.2 Key Product Attributes and Differentiation
4.3 Subtype Dynamics: Growth Leaders, Profitability and Risk
4.3.1 High-Growth Niches and Adoption Drivers
4.3.2 Profitability Hotspots and Cost Drivers
4.3.3 Substitution Threats
5 Global Downstream Application Analysis
5.1 Global OLED DDIC Packaging and Testing Revenue by Application
5.1.1 Global Historical and Forecasted Revenue by Application (2020-2031)
5.1.2 Revenue Market Share by Application (2020-2031)
5.1.3 High-Growth Application Identification
5.1.4 Emerging Application Case Studies
5.2 Downstream Customer Analysis
5.2.1 Top Customers by Region
5.2.2 Top Customers by Application
6 North America
6.1 North America Market Size (2020-2031)
6.2 North America Key Players Revenue in 2024
6.3 North America OLED DDIC Packaging and Testing Market Size by Type (2020-2031)
6.4 North America OLED DDIC Packaging and Testing Market Size by Application (2020-2031)
6.5 North America Growth Accelerators and Market Barriers
6.6 North America OLED DDIC Packaging and Testing Market Size by Country
6.6.1 North America Revenue Trends by Country
6.6.2 US
6.6.3 Canada
6.6.4 Mexico
7 Europe
7.1 Europe Market Size (2020-2031)
7.2 Europe Key Players Revenue in 2024
7.3 Europe OLED DDIC Packaging and Testing Market Size by Type (2020-2031)
7.4 Europe OLED DDIC Packaging and Testing Market Size by Application (2020-2031)
7.5 Europe Growth Accelerators and Market Barriers
7.6 Europe OLED DDIC Packaging and Testing Market Size by Country
7.6.1 Europe Revenue Trends by Country
7.6.2 Germany
7.6.3 France
7.6.4 U.K.
7.6.5 Italy
7.6.6 Russia
8 Asia-Pacific
8.1 Asia-Pacific Market Size (2020-2031)
8.2 Asia-Pacific Key Players Revenue in 2024
8.3 Asia-Pacific OLED DDIC Packaging and Testing Market Size by Type (2020-2031)
8.4 Asia-Pacific OLED DDIC Packaging and Testing Market Size by Application (2020-2031)
8.5 Asia-Pacific Growth Accelerators and Market Barriers
8.6 Asia-Pacific OLED DDIC Packaging and Testing Market Size by Region
8.6.1 Asia-Pacific Revenue Trends by Region
8.7 China
8.8 Japan
8.9 South Korea
8.10 Australia
8.11 India
8.12 Southeast Asia
8.12.1 Indonesia
8.12.2 Vietnam
8.12.3 Malaysia
8.12.4 Philippines
8.12.5 Singapore
9 Central and South America
9.1 Central and South America Market Size (2020-2031)
9.2 Central and South America Key Players Revenue in 2024
9.3 Central and South America OLED DDIC Packaging and Testing Market Size by Type (2020-2031)
9.4 Central and South America OLED DDIC Packaging and Testing Market Size by Application (2020-2031)
9.5 Central and South America Investment Opportunities and Key Challenges
9.6 Central and South America OLED DDIC Packaging and Testing Market Size by Country
9.6.1 Central and South America Revenue Trends by Country (2020 VS 2024 VS 2031)
9.6.2 Brazil
9.6.3 Argentina
10 Middle East and Africa
10.1 Middle East and Africa Market Size (2020-2031)
10.2 Middle East and Africa Key Players Revenue in 2024
10.3 Middle East and Africa OLED DDIC Packaging and Testing Market Size by Type (2020-2031)
10.4 Middle East and Africa OLED DDIC Packaging and Testing Market Size by Application (2020-2031)
10.5 Middle East and Africa Investment Opportunities and Key Challenges
10.6 Middle East and Africa OLED DDIC Packaging and Testing Market Size by Country
10.6.1 Middle East and Africa Revenue Trends by Country (2020 VS 2024 VS 2031)
10.6.2 GCC Countries
10.6.3 Israel
10.6.4 Egypt
10.6.5 South Africa
11 Corporate Profile
11.1 Steco(Samsung)
11.1.1 Steco(Samsung) Corporation Information
11.1.2 Steco(Samsung) Business Overview
11.1.3 Steco(Samsung) OLED DDIC Packaging and Testing Product Features and Attributes
11.1.4 Steco(Samsung) OLED DDIC Packaging and Testing Revenue and Gross Margin (2020-2025)
11.1.5 Steco(Samsung) OLED DDIC Packaging and Testing Revenue by Product in 2024
11.1.6 Steco(Samsung) OLED DDIC Packaging and Testing Revenue by Application in 2024
11.1.7 Steco(Samsung) OLED DDIC Packaging and Testing Revenue by Geographic Area in 2024
11.1.8 Steco(Samsung) OLED DDIC Packaging and Testing SWOT Analysis
11.1.9 Steco(Samsung) Recent Developments
11.2 LB-Lusem(LG)
11.2.1 LB-Lusem(LG) Corporation Information
11.2.2 LB-Lusem(LG) Business Overview
11.2.3 LB-Lusem(LG) OLED DDIC Packaging and Testing Product Features and Attributes
11.2.4 LB-Lusem(LG) OLED DDIC Packaging and Testing Revenue and Gross Margin (2020-2025)
11.2.5 LB-Lusem(LG) OLED DDIC Packaging and Testing Revenue by Product in 2024
11.2.6 LB-Lusem(LG) OLED DDIC Packaging and Testing Revenue by Application in 2024
11.2.7 LB-Lusem(LG) OLED DDIC Packaging and Testing Revenue by Geographic Area in 2024
11.2.8 LB-Lusem(LG) OLED DDIC Packaging and Testing SWOT Analysis
11.2.9 LB-Lusem(LG) Recent Developments
11.3 Chipbond Technology Corporation
11.3.1 Chipbond Technology Corporation Corporation Information
11.3.2 Chipbond Technology Corporation Business Overview
11.3.3 Chipbond Technology Corporation OLED DDIC Packaging and Testing Product Features and Attributes
11.3.4 Chipbond Technology Corporation OLED DDIC Packaging and Testing Revenue and Gross Margin (2020-2025)
11.3.5 Chipbond Technology Corporation OLED DDIC Packaging and Testing Revenue by Product in 2024
11.3.6 Chipbond Technology Corporation OLED DDIC Packaging and Testing Revenue by Application in 2024
11.3.7 Chipbond Technology Corporation OLED DDIC Packaging and Testing Revenue by Geographic Area in 2024
11.3.8 Chipbond Technology Corporation OLED DDIC Packaging and Testing SWOT Analysis
11.3.9 Chipbond Technology Corporation Recent Developments
11.4 IMOS-ChipMOS TECHNOLOGIES INC.
11.4.1 IMOS-ChipMOS TECHNOLOGIES INC. Corporation Information
11.4.2 IMOS-ChipMOS TECHNOLOGIES INC. Business Overview
11.4.3 IMOS-ChipMOS TECHNOLOGIES INC. OLED DDIC Packaging and Testing Product Features and Attributes
11.4.4 IMOS-ChipMOS TECHNOLOGIES INC. OLED DDIC Packaging and Testing Revenue and Gross Margin (2020-2025)
11.4.5 IMOS-ChipMOS TECHNOLOGIES INC. OLED DDIC Packaging and Testing Revenue by Product in 2024
11.4.6 IMOS-ChipMOS TECHNOLOGIES INC. OLED DDIC Packaging and Testing Revenue by Application in 2024
11.4.7 IMOS-ChipMOS TECHNOLOGIES INC. OLED DDIC Packaging and Testing Revenue by Geographic Area in 2024
11.4.8 IMOS-ChipMOS TECHNOLOGIES INC. OLED DDIC Packaging and Testing SWOT Analysis
11.4.9 IMOS-ChipMOS TECHNOLOGIES INC. Recent Developments
11.5 Hefei Chipmore Technology Co., Ltd..
11.5.1 Hefei Chipmore Technology Co., Ltd.. Corporation Information
11.5.2 Hefei Chipmore Technology Co., Ltd.. Business Overview
11.5.3 Hefei Chipmore Technology Co., Ltd.. OLED DDIC Packaging and Testing Product Features and Attributes
11.5.4 Hefei Chipmore Technology Co., Ltd.. OLED DDIC Packaging and Testing Revenue and Gross Margin (2020-2025)
11.5.5 Hefei Chipmore Technology Co., Ltd.. OLED DDIC Packaging and Testing Revenue by Product in 2024
11.5.6 Hefei Chipmore Technology Co., Ltd.. OLED DDIC Packaging and Testing Revenue by Application in 2024
11.5.7 Hefei Chipmore Technology Co., Ltd.. OLED DDIC Packaging and Testing Revenue by Geographic Area in 2024
11.5.8 Hefei Chipmore Technology Co., Ltd.. OLED DDIC Packaging and Testing SWOT Analysis
11.5.9 Hefei Chipmore Technology Co., Ltd.. Recent Developments
11.6 Jiangsu nepes Semiconductor Co., Ltd.
11.6.1 Jiangsu nepes Semiconductor Co., Ltd. Corporation Information
11.6.2 Jiangsu nepes Semiconductor Co., Ltd. Business Overview
11.6.3 Jiangsu nepes Semiconductor Co., Ltd. OLED DDIC Packaging and Testing Product Features and Attributes
11.6.4 Jiangsu nepes Semiconductor Co., Ltd. OLED DDIC Packaging and Testing Revenue and Gross Margin (2020-2025)
11.6.5 Jiangsu nepes Semiconductor Co., Ltd. Recent Developments
11.7 Tongfu Microelectronics Co.,ltd.
11.7.1 Tongfu Microelectronics Co.,ltd. Corporation Information
11.7.2 Tongfu Microelectronics Co.,ltd. Business Overview
11.7.3 Tongfu Microelectronics Co.,ltd. OLED DDIC Packaging and Testing Product Features and Attributes
11.7.4 Tongfu Microelectronics Co.,ltd. OLED DDIC Packaging and Testing Revenue and Gross Margin (2020-2025)
11.7.5 Tongfu Microelectronics Co.,ltd. Recent Developments
11.8 JCET Group Co., Ltd.
11.8.1 JCET Group Co., Ltd. Corporation Information
11.8.2 JCET Group Co., Ltd. Business Overview
11.8.3 JCET Group Co., Ltd. OLED DDIC Packaging and Testing Product Features and Attributes
11.8.4 JCET Group Co., Ltd. OLED DDIC Packaging and Testing Revenue and Gross Margin (2020-2025)
11.8.5 JCET Group Co., Ltd. Recent Developments
11.9 ASE Group
11.9.1 ASE Group Corporation Information
11.9.2 ASE Group Business Overview
11.9.3 ASE Group OLED DDIC Packaging and Testing Product Features and Attributes
11.9.4 ASE Group OLED DDIC Packaging and Testing Revenue and Gross Margin (2020-2025)
11.9.5 ASE Group Recent Developments
11.10 Union Semiconductor (Hefei) Co., Ltd.
11.10.1 Union Semiconductor (Hefei) Co., Ltd. Corporation Information
11.10.2 Union Semiconductor (Hefei) Co., Ltd. Business Overview
11.10.3 Union Semiconductor (Hefei) Co., Ltd. OLED DDIC Packaging and Testing Product Features and Attributes
11.10.4 Union Semiconductor (Hefei) Co., Ltd. OLED DDIC Packaging and Testing Revenue and Gross Margin (2020-2025)
11.10.5 Company Ten Recent Developments
12 OLED DDIC Packaging and TestingIndustry Chain Analysis
12.1 OLED DDIC Packaging and Testing Industry Chain
12.2 Upstream Analysis
12.2.1 Upstream Key Suppliers
12.3 Middlestream Analysis
12.4 Downstream Sales Model and Distribution Networks
12.4.1 Sales Channels
12.4.2 Distributors
13 OLED DDIC Packaging and Testing Market Dynamics
13.1 Industry Trends and Evolution
13.2 Market Growth Drivers and Emerging Opportunities
13.3 Market Challenges, Risks, and Restraints
14 Key Findings in the Global OLED DDIC Packaging and Testing Study
15 Appendix
15.1 Research Methodology
15.1.1 Methodology/Research Approach
15.1.1.1 Research Programs/Design
15.1.1.2 Market Size Estimation
15.1.1.3 Market Breakdown and Data Triangulation
15.1.2 Data Source
15.1.2.1 Secondary Sources
15.1.2.2 Primary Sources
15.2 Author Details
TABLE OF FIGURES
List of Tables
List of Figures
KEY QUESTIONS ADDRESSED BY THE REPORT
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Published: 2026-03-12
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REPORT COVERAGE
DESCRIPTION
OVERVIEW
MARKET SEGMENTATION
CHAPTER OUTLINE
WHY THIS REPORT
QYRESEARCH'S STRENGTHS
TABLE OF CONTENTS
TABLE OF FIGURES
RLEATED REPORTS
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