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Molded interconnect device refers to three-dimensional electromechanical components that combine the finest of mechanical and electrical engineering. These are used to describe the method of producing selectively plated plastic pieces. Market Analysis and Insights: Global and United States Molded Interconnect Device (MID) Market
This report focuses on global and United States Molded Interconnect Device (MID) market, also covers the segmentation data of other regions in regional level and county level. The global Molded Interconnect Device (MID) revenue was US$ 33600 million in 2022 and is forecast to a readjusted size of US$ 40590 million by 2029 with a CAGR of 2.5% during the forecast period (2023-2029). In United States the Molded Interconnect Device (MID) revenue is expected to grow from US$ million in 2022 to US$ million by 2029, at a CAGR of % during the forecast period (2023-2029). The global key players of Molded Interconnect Device (MID) include Molex LLC, TE Connectivity, Amphenol Corporation, LPKF Laser & Electronics AG, 2E mechatronic GmbH & Co. KG, Harting Technologiegruppe, Arlington Plating Company, MID Solutions and MacDermid Inc., etc. The global five biggest players hold a share of % in 2022. Global Molded Interconnect Device (MID) Scope and Market Size Molded Interconnect Device (MID) market is segmented in regional and country, by players, by type and by application. Companies, stakeholders, and other participants in the global Molded Interconnect Device (MID) market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by type and by application for the period 2018-2029. For United States market, this report focuses on the Molded Interconnect Device (MID) market size by players, by Type and by Application, for the period 2018-2029. The key players include the global and local players, which play important roles in United States. By Company Molex LLC TE Connectivity Amphenol Corporation LPKF Laser & Electronics AG 2E mechatronic GmbH & Co. KG Harting Technologiegruppe Arlington Plating Company MID Solutions MacDermid Inc. JOHNAN Corporation TactoTek Oy Axon' Cable S.A.S S2P Solutions Suzhou Cicor Technology Co. Ltd. Chogori Technology Segment by Type Antenna and Connectivity Modules Connectors and Switches Sensors Lighting Segment by Application Automotive Healthcare Industrial Military Aerospace By Region Americas United States Canada Mexico Brazil China APAC (excluding China) Japan South Korea China Taiwan ASEAN India EMEA Europe Middle East Africa Chapter Introduction Chapter 1: Introduces Molded Interconnect Device (MID) definition, global sales (volume and revenue), United States market size, United States percentage in global market. This section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry. Chapter 2: Provides the analysis of various market segments by type, covering the volume, price, revenue, and development potential of each market segment, to help readers find the blue ocean market in different market segments. Chapter 3: Provides the analysis of various market segments by application, covering the revenue, price, volume, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets. Chapter 4: Detailed analysis of Molded Interconnect Device (MID) companies’ competitive landscape, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc. Chapter 5: Revenue and volume of Molded Interconnect Device (MID) in global and regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and capacity of each country in the world. Chapter 6: Americas by type, by application and by country, sales, and revenue for each segment. Chapter 7: EMEA by type, by application and by region, sales, and revenue for each segment. Chapter 8: China by type, by application, sales, and revenue for each segment. Chapter 9: APAC (excluding China) by type, by application and by region, sales, and revenue for each segment. Chapter 10: Provides profiles of key companies, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Molded Interconnect Device (MID) sales, revenue, gross margin, and recent development, etc. Chapter 11: Analysis of industrial chain, sales channel, key raw materials, distributors, and customers. Chapter 12: Research findings and conclusion
1 Study Coverage
1.1 Molded Interconnect Device (MID) Product Introduction
1.2 Global Molded Interconnect Device (MID) Outlook 2018 VS 2022 VS 2029
1.2.1 Global Molded Interconnect Device (MID) Sales in US$ Million for the Year 2018-2029
1.2.2 Global Molded Interconnect Device (MID) Sales in Volume for the Year 2018-2029
1.3 United States Molded Interconnect Device (MID) Outlook 2018 VS 2022 VS 2029
1.3.1 United States Molded Interconnect Device (MID) Sales in US$ Million for the Year 2018-2029
1.3.2 United States Molded Interconnect Device (MID) Sales in Volume for the Year 2018-2029
1.4 Molded Interconnect Device (MID) Market Size, United States VS Global, 2018 VS 2022 VS 2029
1.4.1 The Market Share of United States Molded Interconnect Device (MID) in Global, 2018 VS 2022 VS 2029
1.4.2 The Growth Rate of Molded Interconnect Device (MID) Market Size, United States VS Global, 2018 VS 2022 VS 2029
1.5 Molded Interconnect Device (MID) Market Dynamics
1.5.1 Molded Interconnect Device (MID) Industry Trends
1.5.2 Molded Interconnect Device (MID) Market Drivers
1.5.3 Molded Interconnect Device (MID) Market Challenges
1.5.4 Molded Interconnect Device (MID) Market Restraints
1.6 Study Objectives
1.7 Years Considered
1.8 Years Considered
2 Molded Interconnect Device (MID) by Type
2.1 Molded Interconnect Device (MID) Market Segment by Type
2.1.1 Antenna and Connectivity Modules
2.1.2 Connectors and Switches
2.1.3 Sensors
2.1.4 Lighting
2.2 Global Molded Interconnect Device (MID) Market Size by Type
2.2.1 Global Molded Interconnect Device (MID) Sales in Value, by Type (2018, 2022 & 2029)
2.2.2 Global Molded Interconnect Device (MID) Sales in Volume, by Type (2018, 2022 & 2029)
2.2.3 Global Molded Interconnect Device (MID) Average Selling Price (ASP) by Type (2018, 2022 & 2029)
2.3 United States Molded Interconnect Device (MID) Market Size by Type
2.3.1 United States Molded Interconnect Device (MID) Sales in Value, by Type (2018, 2022 & 2029)
2.3.2 United States Molded Interconnect Device (MID) Sales in Volume, by Type (2018, 2022 & 2029)
2.3.3 United States Molded Interconnect Device (MID) Average Selling Price (ASP) by Type (2018, 2022 & 2029)
3 Molded Interconnect Device (MID) by Application
3.1 Molded Interconnect Device (MID) Market Segment by Application
3.1.1 Automotive
3.1.2 Healthcare
3.1.3 Industrial
3.1.4 Military
3.1.5 Aerospace
3.2 Global Molded Interconnect Device (MID) Market Size by Application
3.2.1 Global Molded Interconnect Device (MID) Sales in Value, by Application (2018, 2022 & 2029)
3.2.2 Global Molded Interconnect Device (MID) Sales in Volume, by Application (2018, 2022 & 2029)
3.3.3 Global Molded Interconnect Device (MID) Average Selling Price (ASP) by Application (2018, 2022 & 2029)
3.3 United States Molded Interconnect Device (MID) Market Size by Application
3.3.1 United States Molded Interconnect Device (MID) Sales in Value, by Application (2018, 2022 & 2029)
3.3.2 United States Molded Interconnect Device (MID) Sales in Volume, by Application (2018, 2022 & 2029)
3.3.3 United States Molded Interconnect Device (MID) Average Selling Price (ASP) by Application (2018, 2022 & 2029)
4 Global Molded Interconnect Device (MID) Competitor Landscape by Company
4.1 Global Molded Interconnect Device (MID) Market Size by Company
4.1.1 Global Key Manufacturers of Molded Interconnect Device (MID), Ranked by Revenue (2022)
4.1.2 Global Molded Interconnect Device (MID) Revenue by Manufacturer (2018-2023)
4.1.3 Global Molded Interconnect Device (MID) Sales by Manufacturer (2018-2023)
4.1.4 Global Molded Interconnect Device (MID) Price by Manufacturer (2018-2023)
4.2 Global Molded Interconnect Device (MID) Concentration Ratio (CR)
4.2.1 Molded Interconnect Device (MID) Market Concentration Ratio (CR)
4.2.2 Global Top 5 and Top 10 Largest Manufacturers of Molded Interconnect Device (MID) in 2022
4.2.3 Global Molded Interconnect Device (MID) Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
4.3 Global Key Manufacturers of Molded Interconnect Device (MID), Manufacturing Base Distribution and Headquarters
4.4 Global Key Manufacturers of Molded Interconnect Device (MID), Product Offered and Application
4.5 Global Key Manufacturers of Molded Interconnect Device (MID), Date of Enter into This Industry
4.6 Manufacturers Mergers & Acquisitions, Expansion Plans
4.7 United States Molded Interconnect Device (MID) Market Size by Company
4.7.1 Key Players of Molded Interconnect Device (MID) in United States, Ranked by Revenue (2022)
4.7.2 United States Molded Interconnect Device (MID) Revenue by Players (2018-2023)
4.7.3 United States Molded Interconnect Device (MID) Sales by Players (2018-2023)
5 Global Molded Interconnect Device (MID) Market Size by Region
5.1 Global Molded Interconnect Device (MID) Market Size by Region: 2018 VS 2022 VS 2029
5.2 Global Molded Interconnect Device (MID) Market Size in Volume by Region (2018-2029)
5.2.1 Global Molded Interconnect Device (MID) Sales in Volume by Region: 2018-2023
5.2.2 Global Molded Interconnect Device (MID) Sales in Volume Forecast by Region (2024-2029)
5.3 Global Molded Interconnect Device (MID) Market Size in Value by Region (2018-2029)
5.3.1 Global Molded Interconnect Device (MID) Sales in Value by Region: 2018-2023
5.3.2 Global Molded Interconnect Device (MID) Sales in Value by Region: 2024-2029
6 Americas
6.1 Americas Molded Interconnect Device (MID) Market Size YoY Growth 2018-2029
6.2 Americas Molded Interconnect Device (MID) Sales in Volume, by Type (2018, 2022 & 2029)
6.3 Americas Molded Interconnect Device (MID) Sales in Volume, by Application (2018, 2022 & 2029)
6.4 Americas Molded Interconnect Device (MID) Market Facts & Figures by Country (2018, 2022 & 2029)
6.4.1 Americas Molded Interconnect Device (MID) Sales in Value by Country (2018, 2022 & 2029)
6.4.2 Americas Molded Interconnect Device (MID) Sales in Volume by Country (2018, 2022 & 2029)
6.4.3 United States
6.4.4 Canada
6.4.5 Mexico
6.4.6 Brazil
7 EMEA
7.1 EMEA Molded Interconnect Device (MID) Market Size YoY Growth 2018-2029
7.2 EMEA Molded Interconnect Device (MID) Sales in Volume, by Type (2018, 2022 & 2029)
7.3 EMEA Molded Interconnect Device (MID) Sales in Volume, by Application (2018, 2022 & 2029)
7.4 EMEA Molded Interconnect Device (MID) Market Facts & Figures by Country (2018, 2022 & 2029)
7.4.1 EMEA Molded Interconnect Device (MID) Sales in Value by Country (2018, 2022 & 2029)
7.4.2 EMEA Molded Interconnect Device (MID) Sales in Volume by Country (2018, 2022 & 2029)
7.4.3 Europe
7.4.4 Middle East
7.4.5 Africa
8 China
8.1 China Molded Interconnect Device (MID) Market Size YoY Growth 2018-2029
8.2 China Molded Interconnect Device (MID) Sales in Volume, by Type (2018, 2022 & 2029)
8.3 China Molded Interconnect Device (MID) Sales in Volume, by Application (2018, 2022 & 2029)
9 APAC
9.1 APAC Molded Interconnect Device (MID) Market Size YoY Growth 2018-2029
9.2 APAC Molded Interconnect Device (MID) Sales in Volume, by Type (2018, 2022 & 2029)
9.3 APAC Molded Interconnect Device (MID) Sales in Volume, by Application (2018, 2022 & 2029)
9.4 APAC Molded Interconnect Device (MID) Market Facts & Figures by Region (2018, 2022 & 2029)
9.4.1 APAC Molded Interconnect Device (MID) Sales in Value by Region (2018, 2022 & 2029)
9.4.2 APAC Molded Interconnect Device (MID) Sales in Volume by Region (2018, 2022 & 2029)
9.4.3 Japan
9.4.4 South Korea
9.4.5 China Taiwan
9.4.6 Southeast Asia
9.4.7 India
10 Company Profiles
10.1 Molex LLC
10.1.1 Molex LLC Company Information
10.1.2 Molex LLC Description and Business Overview
10.1.3 Molex LLC Molded Interconnect Device (MID) Sales, Revenue and Gross Margin (2018-2023)
10.1.4 Molex LLC Molded Interconnect Device (MID) Products Offered
10.1.5 Molex LLC Recent Development
10.2 TE Connectivity
10.2.1 TE Connectivity Company Information
10.2.2 TE Connectivity Description and Business Overview
10.2.3 TE Connectivity Molded Interconnect Device (MID) Sales, Revenue and Gross Margin (2018-2023)
10.2.4 TE Connectivity Molded Interconnect Device (MID) Products Offered
10.2.5 TE Connectivity Recent Development
10.3 Amphenol Corporation
10.3.1 Amphenol Corporation Company Information
10.3.2 Amphenol Corporation Description and Business Overview
10.3.3 Amphenol Corporation Molded Interconnect Device (MID) Sales, Revenue and Gross Margin (2018-2023)
10.3.4 Amphenol Corporation Molded Interconnect Device (MID) Products Offered
10.3.5 Amphenol Corporation Recent Development
10.4 LPKF Laser & Electronics AG
10.4.1 LPKF Laser & Electronics AG Company Information
10.4.2 LPKF Laser & Electronics AG Description and Business Overview
10.4.3 LPKF Laser & Electronics AG Molded Interconnect Device (MID) Sales, Revenue and Gross Margin (2018-2023)
10.4.4 LPKF Laser & Electronics AG Molded Interconnect Device (MID) Products Offered
10.4.5 LPKF Laser & Electronics AG Recent Development
10.5 2E mechatronic GmbH & Co. KG
10.5.1 2E mechatronic GmbH & Co. KG Company Information
10.5.2 2E mechatronic GmbH & Co. KG Description and Business Overview
10.5.3 2E mechatronic GmbH & Co. KG Molded Interconnect Device (MID) Sales, Revenue and Gross Margin (2018-2023)
10.5.4 2E mechatronic GmbH & Co. KG Molded Interconnect Device (MID) Products Offered
10.5.5 2E mechatronic GmbH & Co. KG Recent Development
10.6 Harting Technologiegruppe
10.6.1 Harting Technologiegruppe Company Information
10.6.2 Harting Technologiegruppe Description and Business Overview
10.6.3 Harting Technologiegruppe Molded Interconnect Device (MID) Sales, Revenue and Gross Margin (2018-2023)
10.6.4 Harting Technologiegruppe Molded Interconnect Device (MID) Products Offered
10.6.5 Harting Technologiegruppe Recent Development
10.7 Arlington Plating Company
10.7.1 Arlington Plating Company Company Information
10.7.2 Arlington Plating Company Description and Business Overview
10.7.3 Arlington Plating Company Molded Interconnect Device (MID) Sales, Revenue and Gross Margin (2018-2023)
10.7.4 Arlington Plating Company Molded Interconnect Device (MID) Products Offered
10.7.5 Arlington Plating Company Recent Development
10.8 MID Solutions
10.8.1 MID Solutions Company Information
10.8.2 MID Solutions Description and Business Overview
10.8.3 MID Solutions Molded Interconnect Device (MID) Sales, Revenue and Gross Margin (2018-2023)
10.8.4 MID Solutions Molded Interconnect Device (MID) Products Offered
10.8.5 MID Solutions Recent Development
10.9 MacDermid Inc.
10.9.1 MacDermid Inc. Company Information
10.9.2 MacDermid Inc. Description and Business Overview
10.9.3 MacDermid Inc. Molded Interconnect Device (MID) Sales, Revenue and Gross Margin (2018-2023)
10.9.4 MacDermid Inc. Molded Interconnect Device (MID) Products Offered
10.9.5 MacDermid Inc. Recent Development
10.10 JOHNAN Corporation
10.10.1 JOHNAN Corporation Company Information
10.10.2 JOHNAN Corporation Description and Business Overview
10.10.3 JOHNAN Corporation Molded Interconnect Device (MID) Sales, Revenue and Gross Margin (2018-2023)
10.10.4 JOHNAN Corporation Molded Interconnect Device (MID) Products Offered
10.10.5 JOHNAN Corporation Recent Development
10.11 TactoTek Oy
10.11.1 TactoTek Oy Company Information
10.11.2 TactoTek Oy Description and Business Overview
10.11.3 TactoTek Oy Molded Interconnect Device (MID) Sales, Revenue and Gross Margin (2018-2023)
10.11.4 TactoTek Oy Molded Interconnect Device (MID) Products Offered
10.11.5 TactoTek Oy Recent Development
10.12 Axon' Cable S.A.S
10.12.1 Axon' Cable S.A.S Company Information
10.12.2 Axon' Cable S.A.S Description and Business Overview
10.12.3 Axon' Cable S.A.S Molded Interconnect Device (MID) Sales, Revenue and Gross Margin (2018-2023)
10.12.4 Axon' Cable S.A.S Molded Interconnect Device (MID) Products Offered
10.12.5 Axon' Cable S.A.S Recent Development
10.13 S2P Solutions
10.13.1 S2P Solutions Company Information
10.13.2 S2P Solutions Description and Business Overview
10.13.3 S2P Solutions Molded Interconnect Device (MID) Sales, Revenue and Gross Margin (2018-2023)
10.13.4 S2P Solutions Molded Interconnect Device (MID) Products Offered
10.13.5 S2P Solutions Recent Development
10.14 Suzhou Cicor Technology Co. Ltd.
10.14.1 Suzhou Cicor Technology Co. Ltd. Company Information
10.14.2 Suzhou Cicor Technology Co. Ltd. Description and Business Overview
10.14.3 Suzhou Cicor Technology Co. Ltd. Molded Interconnect Device (MID) Sales, Revenue and Gross Margin (2018-2023)
10.14.4 Suzhou Cicor Technology Co. Ltd. Molded Interconnect Device (MID) Products Offered
10.14.5 Suzhou Cicor Technology Co. Ltd. Recent Development
10.15 Chogori Technology
10.15.1 Chogori Technology Company Information
10.15.2 Chogori Technology Description and Business Overview
10.15.3 Chogori Technology Molded Interconnect Device (MID) Sales, Revenue and Gross Margin (2018-2023)
10.15.4 Chogori Technology Molded Interconnect Device (MID) Products Offered
10.15.5 Chogori Technology Recent Development
11 Industry Chain and Sales Channels Analysis
11.1 Molded Interconnect Device (MID) Industry Chain Analysis
11.2 Molded Interconnect Device (MID) Key Raw Materials
11.2.1 Key Raw Materials
11.2.2 Raw Materials Key Suppliers
11.3 Molded Interconnect Device (MID) Production Mode & Process
11.4 Molded Interconnect Device (MID) Sales and Marketing
11.4.1 Molded Interconnect Device (MID) Sales Channels
11.4.2 Molded Interconnect Device (MID) Distributors
11.5 Molded Interconnect Device (MID) Customers
12 Research Findings and Conclusion
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Author Details
13.3 Disclaimer
List of Tables Table 1. Molded Interconnect Device (MID) CAGR in Value, United States VS Global, 2018 VS 2022 VS 2029 Table 2. Molded Interconnect Device (MID) Market Trends Table 3. Molded Interconnect Device (MID) Market Drivers Table 4. Molded Interconnect Device (MID) Market Challenges Table 5. Molded Interconnect Device (MID) Market Restraints Table 6. Global Molded Interconnect Device (MID) Sales Growth Rate (CAGR) by Type: 2018 VS 2022 VS 2029 (US$ Million) Table 7. United States Molded Interconnect Device (MID) Sales Growth Rate (CAGR) by Type: 2018 VS 2022 VS 2029 (US$ Million) Table 8. Global Molded Interconnect Device (MID) Sales Growth Rate (CAGR) by Application: 2018 VS 2022 VS 2029 (US$ Million) Table 9. United States Molded Interconnect Device (MID) Sales Growth Rate (CAGR) by Application: 2018 VS 2022 VS 2029 (US$ Million) Table 10. Global Key Manufacturers of Molded Interconnect Device (MID), Ranked by Revenue (2022) & (US$ Million) Table 11. Global Molded Interconnect Device (MID) Revenue by Manufacturer, (US$ Million), 2018-2023 Table 12. Global Molded Interconnect Device (MID) Revenue Share by Manufacturer, 2018-2023 Table 13. Global Molded Interconnect Device (MID) Sales by Manufacturer, (K Units), 2018-2023 Table 14. Global Molded Interconnect Device (MID) Sales Share by Manufacturer, 2018-2023 Table 15. Global Molded Interconnect Device (MID) Price by Manufacturer (2018-2023) & (US$/Unit) Table 16. Global Molded Interconnect Device (MID) Manufacturers Market Concentration Ratio (CR5 and HHI) Table 17. Global Molded Interconnect Device (MID) by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Molded Interconnect Device (MID) as of 2022) Table 18. Global Key Manufacturers of Molded Interconnect Device (MID), Manufacturing Base Distribution and Headquarters Table 19. Global Key Manufacturers of Molded Interconnect Device (MID), Product Offered and Application Table 20. Global Key Manufacturers of Molded Interconnect Device (MID), Date of Enter into This Industry Table 21. Manufacturers Mergers & Acquisitions, Expansion Plans Table 22. Key Players of Molded Interconnect Device (MID) in United States, Ranked by Revenue (2022) & (US$ million) Table 23. United States Molded Interconnect Device (MID) Revenue by Players, (US$ Million), (2018-2023) Table 24. United States Molded Interconnect Device (MID) Revenue Share by Players, (2018-2023) Table 25. United States Molded Interconnect Device (MID) Sales by Players, (K Units), (2018-2023) Table 26. United States Molded Interconnect Device (MID) Sales Share by Players, (2018-2023) Table 27. Global Molded Interconnect Device (MID) Market Size Growth Rate (CAGR) by Region (US$ Million): 2018 VS 2022 VS 2029 Table 28. Global Molded Interconnect Device (MID) Sales in Volume by Region (2018-2023) & (K Units) Table 29. Global Molded Interconnect Device (MID) Sales in Volume Forecast by Region (2024-2029) & (K Units) Table 30. Global Molded Interconnect Device (MID) Sales in Value by Region (2018-2023) & (US$ Million) Table 31. Global Molded Interconnect Device (MID) Sales in Value Forecast by Region (2024-2029) & (US$ Million) Table 32. Americas Molded Interconnect Device (MID) Market Size Growth Rate (CAGR) by Country (US$ Million): 2018 VS 2022 VS 2029 Table 33. Americas Molded Interconnect Device (MID) Sales in Value by Country (2018-2023) & (US$ Million) Table 34. Americas Molded Interconnect Device (MID) Sales in Value by Country (2024-2029) & (US$ Million) Table 35. Americas Molded Interconnect Device (MID) Sales in Volume by Country (2018-2023) & (K Units) Table 36. Americas Molded Interconnect Device (MID) Sales in Volume by Country (2024-2029) & (K Units) Table 37. EMEA Molded Interconnect Device (MID) Market Size Growth Rate (CAGR) by Country (US$ Million): 2018 VS 2022 VS 2029 Table 38. EMEA Molded Interconnect Device (MID) Sales in Value by Country (2018-2023) & (US$ Million) Table 39. EMEA Molded Interconnect Device (MID) Sales in Value by Country (2024-2029) & (US$ Million) Table 40. EMEA Molded Interconnect Device (MID) Sales in Volume by Country (2018-2023) & (K Units) Table 41. EMEA Molded Interconnect Device (MID) Sales in Volume by Country (2024-2029) & (K Units) Table 42. APAC Molded Interconnect Device (MID) Market Size Growth Rate (CAGR) by Country (US$ Million): 2018 VS 2022 VS 2029 Table 43. APAC Molded Interconnect Device (MID) Sales in Value by Country (2018-2023) & (US$ Million) Table 44. APAC Molded Interconnect Device (MID) Sales in Value by Country (2024-2029) & (US$ Million) Table 45. APAC Molded Interconnect Device (MID) Sales in Volume by Country (2018-2023) & (K Units) Table 46. APAC Molded Interconnect Device (MID) Sales in Volume by Country (2024-2029) & (K Units) Table 47. Molex LLC Company Information Table 48. Molex LLC Description and Business Overview Table 49. Molex LLC Molded Interconnect Device (MID) Sales (K Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023) Table 50. Molex LLC Molded Interconnect Device (MID) Product Table 51. Molex LLC Recent Development Table 52. TE Connectivity Company Information Table 53. TE Connectivity Description and Business Overview Table 54. TE Connectivity Molded Interconnect Device (MID) Sales (K Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023) Table 55. TE Connectivity Molded Interconnect Device (MID) Product Table 56. TE Connectivity Recent Development Table 57. Amphenol Corporation Company Information Table 58. Amphenol Corporation Description and Business Overview Table 59. Amphenol Corporation Molded Interconnect Device (MID) Sales (K Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023) Table 60. Amphenol Corporation Molded Interconnect Device (MID) Product Table 61. Amphenol Corporation Recent Development Table 62. LPKF Laser & Electronics AG Company Information Table 63. LPKF Laser & Electronics AG Description and Business Overview Table 64. LPKF Laser & Electronics AG Molded Interconnect Device (MID) Sales (K Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023) Table 65. LPKF Laser & Electronics AG Molded Interconnect Device (MID) Product Table 66. LPKF Laser & Electronics AG Recent Development Table 67. 2E mechatronic GmbH & Co. KG Company Information Table 68. 2E mechatronic GmbH & Co. KG Description and Business Overview Table 69. 2E mechatronic GmbH & Co. KG Molded Interconnect Device (MID) Sales (K Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023) Table 70. 2E mechatronic GmbH & Co. KG Molded Interconnect Device (MID) Product Table 71. 2E mechatronic GmbH & Co. KG Recent Development Table 72. Harting Technologiegruppe Company Information Table 73. Harting Technologiegruppe Description and Business Overview Table 74. Harting Technologiegruppe Molded Interconnect Device (MID) Sales (K Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023) Table 75. Harting Technologiegruppe Molded Interconnect Device (MID) Product Table 76. Harting Technologiegruppe Recent Development Table 77. Arlington Plating Company Company Information Table 78. Arlington Plating Company Description and Business Overview Table 79. Arlington Plating Company Molded Interconnect Device (MID) Sales (K Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023) Table 80. Arlington Plating Company Molded Interconnect Device (MID) Product Table 81. Arlington Plating Company Recent Development Table 82. MID Solutions Company Information Table 83. MID Solutions Description and Business Overview Table 84. MID Solutions Molded Interconnect Device (MID) Sales (K Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023) Table 85. MID Solutions Molded Interconnect Device (MID) Product Table 86. MID Solutions Recent Development Table 87. MacDermid Inc. Company Information Table 88. MacDermid Inc. Description and Business Overview Table 89. MacDermid Inc. Molded Interconnect Device (MID) Sales (K Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023) Table 90. MacDermid Inc. Molded Interconnect Device (MID) Product Table 91. MacDermid Inc. Recent Development Table 92. JOHNAN Corporation Company Information Table 93. JOHNAN Corporation Description and Business Overview Table 94. JOHNAN Corporation Molded Interconnect Device (MID) Sales (K Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023) Table 95. JOHNAN Corporation Molded Interconnect Device (MID) Product Table 96. JOHNAN Corporation Recent Development Table 97. TactoTek Oy Company Information Table 98. TactoTek Oy Description and Business Overview Table 99. TactoTek Oy Molded Interconnect Device (MID) Sales (K Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023) Table 100. TactoTek Oy Molded Interconnect Device (MID) Product Table 101. TactoTek Oy Recent Development Table 102. Axon' Cable S.A.S Company Information Table 103. Axon' Cable S.A.S Description and Business Overview Table 104. Axon' Cable S.A.S Molded Interconnect Device (MID) Sales (K Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023) Table 105. Axon' Cable S.A.S Molded Interconnect Device (MID) Product Table 106. Axon' Cable S.A.S Recent Development Table 107. S2P Solutions Company Information Table 108. S2P Solutions Description and Business Overview Table 109. S2P Solutions Molded Interconnect Device (MID) Sales (K Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023) Table 110. S2P Solutions Molded Interconnect Device (MID) Product Table 111. S2P Solutions Recent Development Table 112. Suzhou Cicor Technology Co. Ltd. Company Information Table 113. Suzhou Cicor Technology Co. Ltd. Description and Business Overview Table 114. Suzhou Cicor Technology Co. Ltd. Molded Interconnect Device (MID) Sales (K Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023) Table 115. Suzhou Cicor Technology Co. Ltd. Molded Interconnect Device (MID) Product Table 116. Suzhou Cicor Technology Co. Ltd. Recent Development Table 117. Chogori Technology Company Information Table 118. Chogori Technology Description and Business Overview Table 119. Chogori Technology Molded Interconnect Device (MID) Sales (K Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023) Table 120. Chogori Technology Molded Interconnect Device (MID) Product Table 121. Chogori Technology Recent Development Table 122. Key Raw Materials Lists Table 123. Raw Materials Key Suppliers Lists Table 124. Molded Interconnect Device (MID) Customers List Table 125. Molded Interconnect Device (MID) Distributors List Table 126. Research Programs/Design for This Report Table 127. Key Data Information from Secondary Sources Table 128. Key Data Information from Primary Sources List of Figures Figure 1. Molded Interconnect Device (MID) Product Picture Figure 2. Global Molded Interconnect Device (MID) Revenue, (US$ Million), 2018 VS 2022 VS 2029 Figure 3. Global Molded Interconnect Device (MID) Market Size 2018-2029 (US$ Million) Figure 4. Global Molded Interconnect Device (MID) Sales 2018-2029 (K Units) Figure 5. United States Molded Interconnect Device (MID) Revenue, (US$ Million), 2018 VS 2022 VS 2029 Figure 6. United States Molded Interconnect Device (MID) Market Size 2018-2029 (US$ Million) Figure 7. United States Molded Interconnect Device (MID) Sales 2018-2029 (K Units) Figure 8. United States Molded Interconnect Device (MID) Market Share in Global, in Value (US$ Million) 2018-2029 Figure 9. United States Molded Interconnect Device (MID) Market Share in Global, in Volume (K Units) 2018-2029 Figure 10. Molded Interconnect Device (MID) Report Years Considered Figure 11. Product Picture of Antenna and Connectivity Modules Figure 12. Product Picture of Connectors and Switches Figure 13. Product Picture of Sensors Figure 14. Product Picture of Lighting Figure 15. Global Molded Interconnect Device (MID) Market Share by Type in 2022 & 2029 Figure 16. Global Molded Interconnect Device (MID) Sales in Value by Type (2018-2029) & (US$ Million) Figure 17. Global Molded Interconnect Device (MID) Sales Market Share in Value by Type (2018-2029) Figure 18. Global Molded Interconnect Device (MID) Sales by Type (2018-2029) & (K Units) Figure 19. Global Molded Interconnect Device (MID) Sales Market Share in Volume by Type (2018-2029) Figure 20. Global Molded Interconnect Device (MID) Price by Type (2018-2029) & (US$/Unit) Figure 21. United States Molded Interconnect Device (MID) Market Share by Type in 2022 & 2029 Figure 22. United States Molded Interconnect Device (MID) Sales in Value by Type (2018-2029) & (US$ Million) Figure 23. United States Molded Interconnect Device (MID) Sales Market Share in Value by Type (2018-2029) Figure 24. United States Molded Interconnect Device (MID) Sales by Type (2018-2029) & (K Units) Figure 25. United States Molded Interconnect Device (MID) Sales Market Share in Volume by Type (2018-2029) Figure 26. United States Molded Interconnect Device (MID) Price by Type (2018-2029) & (US$/Unit) Figure 27. Product Picture of Automotive Figure 28. Product Picture of Healthcare Figure 29. Product Picture of Industrial Figure 30. Product Picture of Military Figure 31. Product Picture of Aerospace Figure 32. Global Molded Interconnect Device (MID) Market Share by Application in 2022 & 2029 Figure 33. Global Molded Interconnect Device (MID) Sales in Value by Application (2018-2029) & (US$ Million) Figure 34. Global Molded Interconnect Device (MID) Sales Market Share in Value by Application (2018-2029) Figure 35. Global Molded Interconnect Device (MID) Sales by Application (2018-2029) & (K Units) Figure 36. Global Molded Interconnect Device (MID) Sales Market Share in Volume by Application (2018-2029) Figure 37. Global Molded Interconnect Device (MID) Price by Application (2018-2029) & (US$/Unit) Figure 38. United States Molded Interconnect Device (MID) Market Share by Application in 2022 & 2029 Figure 39. United States Molded Interconnect Device (MID) Sales in Value by Application (2018-2029) & (US$ Million) Figure 40. United States Molded Interconnect Device (MID) Sales Market Share in Value by Application (2018-2029) Figure 41. United States Molded Interconnect Device (MID) Sales by Application (2018-2029) & (K Units) Figure 42. United States Molded Interconnect Device (MID) Sales Market Share in Volume by Application (2018-2029) Figure 43. United States Molded Interconnect Device (MID) Price by Application (2018-2029) & (US$/Unit) Figure 44. Americas Molded Interconnect Device (MID) Sales in Volume Growth Rate 2018-2029 (K Units) Figure 45. Americas Molded Interconnect Device (MID) Sales in Value Growth Rate 2018-2029 (US$ Million) Figure 46. Americas Molded Interconnect Device (MID) Sales by Type (2018-2029) & (K Units) Figure 47. Americas Molded Interconnect Device (MID) Sales Market Share in Volume by Type (2018-2029) Figure 48. Americas Molded Interconnect Device (MID) Sales by Application (2018-2029) & (K Units) Figure 49. Americas Molded Interconnect Device (MID) Sales Market Share in Volume by Application (2018-2029) Figure 50. United States Molded Interconnect Device (MID) Sales in Value Growth Rate (2018-2029) & (US$ Million) Figure 51. Canada Molded Interconnect Device (MID) Sales in Value Growth Rate (2018-2029) & (US$ Million) Figure 52. Mexico Molded Interconnect Device (MID) Sales in Value Growth Rate (2018-2029) & (US$ Million) Figure 53. Brazil Molded Interconnect Device (MID) Sales in Value Growth Rate (2018-2029) & (US$ Million) Figure 54. EMEA Molded Interconnect Device (MID) Sales in Volume Growth Rate 2018-2029 (K Units) Figure 55. EMEA Molded Interconnect Device (MID) Sales in Value Growth Rate 2018-2029 (US$ Million) Figure 56. EMEA Molded Interconnect Device (MID) Sales by Type (2018-2029) & (K Units) Figure 57. EMEA Molded Interconnect Device (MID) Sales Market Share in Volume by Type (2018-2029) Figure 58. EMEA Molded Interconnect Device (MID) Sales by Application (2018-2029) & (K Units) Figure 59. EMEA Molded Interconnect Device (MID) Sales Market Share in Volume by Application (2018-2029) Figure 60. Europe Molded Interconnect Device (MID) Sales in Value Growth Rate (2018-2029) & (US$ Million) Figure 61. Middle East Molded Interconnect Device (MID) Sales in Value Growth Rate (2018-2029) & (US$ Million) Figure 62. Africa Molded Interconnect Device (MID) Sales in Value Growth Rate (2018-2029) & (US$ Million) Figure 63. China Molded Interconnect Device (MID) Sales in Volume Growth Rate 2018-2029 (K Units) Figure 64. China Molded Interconnect Device (MID) Sales in Value Growth Rate 2018-2029 (US$ Million) Figure 65. China Molded Interconnect Device (MID) Sales by Type (2018-2029) & (K Units) Figure 66. China Molded Interconnect Device (MID) Sales Market Share in Volume by Type (2018-2029) Figure 67. China Molded Interconnect Device (MID) Sales by Application (2018-2029) & (K Units) Figure 68. China Molded Interconnect Device (MID) Sales Market Share in Volume by Application (2018-2029) Figure 69. APAC Molded Interconnect Device (MID) Sales in Volume Growth Rate 2018-2029 (K Units) Figure 70. APAC Molded Interconnect Device (MID) Sales in Value Growth Rate 2018-2029 (US$ Million) Figure 71. APAC Molded Interconnect Device (MID) Sales by Type (2018-2029) & (K Units) Figure 72. APAC Molded Interconnect Device (MID) Sales Market Share in Volume by Type (2018-2029) Figure 73. APAC Molded Interconnect Device (MID) Sales by Application (2018-2029) & (K Units) Figure 74. APAC Molded Interconnect Device (MID) Sales Market Share in Volume by Application (2018-2029) Figure 75. Japan Molded Interconnect Device (MID) Sales in Value Growth Rate (2018-2029) & (US$ Million) Figure 76. South Korea Molded Interconnect Device (MID) Sales in Value Growth Rate (2018-2029) & (US$ Million) Figure 77. China Taiwan Molded Interconnect Device (MID) Sales in Value Growth Rate (2018-2029) & (US$ Million) Figure 78. Southeast Asia Molded Interconnect Device (MID) Sales in Value Growth Rate (2018-2029) & (US$ Million) Figure 79. India Molded Interconnect Device (MID) Sales in Value Growth Rate (2018-2029) & (US$ Million) Figure 80. Molded Interconnect Device (MID) Value Chain Figure 81. Molded Interconnect Device (MID) Production Process Figure 82. Channels of Distribution Figure 83. Distributors Profiles Figure 84. Bottom-up and Top-down Approaches for This Report Figure 85. Data Triangulation Figure 86. Key Executives Interviewed
Molded interconnect device refers to three-dimensional electromechanical components that combine the finest of mechanical and electrical engineering. These are used to describe the method of producing selectively plated plastic pieces. Market Analysis and Insights: Global and United States Molded Interconnect Device (MID) Market
This report focuses on global and United States Molded Interconnect Device (MID) market, also covers the segmentation data of other regions in regional level and county level. The global Molded Interconnect Device (MID) revenue was US$ 33600 million in 2022 and is forecast to a readjusted size of US$ 40590 million by 2029 with a CAGR of 2.5% during the forecast period (2023-2029). In United States the Molded Interconnect Device (MID) revenue is expected to grow from US$ million in 2022 to US$ million by 2029, at a CAGR of % during the forecast period (2023-2029). The global key players of Molded Interconnect Device (MID) include Molex LLC, TE Connectivity, Amphenol Corporation, LPKF Laser & Electronics AG, 2E mechatronic GmbH & Co. KG, Harting Technologiegruppe, Arlington Plating Company, MID Solutions and MacDermid Inc., etc. The global five biggest players hold a share of % in 2022. Global Molded Interconnect Device (MID) Scope and Market Size Molded Interconnect Device (MID) market is segmented in regional and country, by players, by type and by application. Companies, stakeholders, and other participants in the global Molded Interconnect Device (MID) market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by type and by application for the period 2018-2029. For United States market, this report focuses on the Molded Interconnect Device (MID) market size by players, by Type and by Application, for the period 2018-2029. The key players include the global and local players, which play important roles in United States. By Company Molex LLC TE Connectivity Amphenol Corporation LPKF Laser & Electronics AG 2E mechatronic GmbH & Co. KG Harting Technologiegruppe Arlington Plating Company MID Solutions MacDermid Inc. JOHNAN Corporation TactoTek Oy Axon' Cable S.A.S S2P Solutions Suzhou Cicor Technology Co. Ltd. Chogori Technology Segment by Type Antenna and Connectivity Modules Connectors and Switches Sensors Lighting Segment by Application Automotive Healthcare Industrial Military Aerospace By Region Americas United States Canada Mexico Brazil China APAC (excluding China) Japan South Korea China Taiwan ASEAN India EMEA Europe Middle East Africa Chapter Introduction Chapter 1: Introduces Molded Interconnect Device (MID) definition, global sales (volume and revenue), United States market size, United States percentage in global market. This section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry. Chapter 2: Provides the analysis of various market segments by type, covering the volume, price, revenue, and development potential of each market segment, to help readers find the blue ocean market in different market segments. Chapter 3: Provides the analysis of various market segments by application, covering the revenue, price, volume, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets. Chapter 4: Detailed analysis of Molded Interconnect Device (MID) companies’ competitive landscape, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc. Chapter 5: Revenue and volume of Molded Interconnect Device (MID) in global and regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and capacity of each country in the world. Chapter 6: Americas by type, by application and by country, sales, and revenue for each segment. Chapter 7: EMEA by type, by application and by region, sales, and revenue for each segment. Chapter 8: China by type, by application, sales, and revenue for each segment. Chapter 9: APAC (excluding China) by type, by application and by region, sales, and revenue for each segment. Chapter 10: Provides profiles of key companies, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Molded Interconnect Device (MID) sales, revenue, gross margin, and recent development, etc. Chapter 11: Analysis of industrial chain, sales channel, key raw materials, distributors, and customers. Chapter 12: Research findings and conclusion
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English
Simon Lee
English
Hitesh
Chinese
Damon
Japanese
Tang Xin
Korean
Sung-Bin Yoon
Competition
Key players, new entrants,acquisitions, mergers and expansions,development trends and challenges.
Industry Analysis
Rawmaterial, application, product type, demand,supply,downstream, supply chain etc.
Market Size
Capacity, production, sales, revenue, price, cost etc.
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We can offer customized survey and information to meet ourclient's need.
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English
Simon Lee
English
Hitesh
Chinese
Damon
Japanese
Tang Xin
Korean
Sung-Bin Yoon
Competition
Key players, new entrants,acquisitions, mergers and expansions,development trends and challenges.
Industry Analysis
Rawmaterial, application, product type, demand,supply,downstream, supply chain etc.
Market Size
Capacity, production, sales, revenue, price, cost etc.
Customized Information
We can offer customized survey and information to meet ourclient's need.
Fastest report delivery service
More than 17 years of vast experience
Operation for 24 * 7 & 365 days
In-depth and comprehensive analysis
Professional and timely after-sales service
Owns large database
Add to Cart
Buy Now