Industry: Electronics & Semiconductor
Published Date: 2025-02-21
Pages: 108 Pages
Report ld: 4074291
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Wafer Grinding Wheel Market Size(US$)

CAGR 2025-2031
5.1%
Market Size,2031
USD 493
Million
Market Snapshot
Source: Secondary research, interviews with experts, and QYResearch analysis
The global Wafer Grinding Wheel market size was US$ 350 million in 2024 and is forecast to a readjusted size of US$ 493 million by 2031 with a CAGR of 5.1% during the forecast period 2025-2031.
Wafer grinding wheels are used in the in-feed grinding process of semiconductor wafers such as TSV package (Cu/compound), SiC, sapphire, Si and reclaimed wafers etc. The in-feed grinding process consists of rough and fine grinding processes. Wafer grinding wheels are made of diamond abrasives and customized vitrified bond in a unique porous microstructure. The diamond size for rough and finish grinding processes are #325~#1000 and #2000~#8000 respectively. The features of these wafer grinding wheels are stable high removal rate, long lifetime and lower grinding resistance.
According to WSTS data, the industry experienced major ups and downs in 2022. Although chip sales reached their highest annual total ever in 2022, a slowdown in the second half of the year greatly limited growth. In 2022, global semiconductor sales reached $574 billion, of which US semiconductor companies' sales totaled $275 billion, accounting for 48% of the global market. In 2023, due to the impact of the market economy and weakening terminal demand, semiconductor sales for the whole year fell to $526.8 billion. It is expected that in 2024, as downstream demand picks up, semiconductor market sales will reach about $550 billion.
With the continuous expansion of the semiconductor market scale and the continuous advancement of technology, its application in electronics, communications, computers and other fields has become increasingly extensive, which has not only promoted the vigorous development of the semiconductor industry, but also correspondingly driven the growth in demand for semiconductor wafer grinding wheels. As an indispensable part of the semiconductor manufacturing process, the quality and performance of wafer grinding wheels directly affect the quality and production efficiency of semiconductor products. Therefore, with the expansion of the semiconductor market scale, the demand for wafer grinding wheels has also increased, providing strong support for the development of its market.
The world's core wafer grinding wheel companies are mainly distributed in Japan, China and other countries. The leading companies are Disco Corporation, Kinik Company, Tokyo Diamond Tools Mfg, Saint-Gobain, Asahi Diamond Industrial, and ALMT Corp. Among them, the top 5 companies have a share of nearly 40%.
The global Wafer Grinding Wheel market is segmented by company, region (country), by Type, and by Application. Players, stakeholders, and other participants in the global Wafer Grinding Wheel market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), by Type and by Application for the period 2020-2031.
MARKET SEGMENTATION
CHAPTER OUTLINE
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, and by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Sales and revenue of Wafer Grinding Wheel in global, regional level and country level. It provides a quantitative analysis of the market size and development potential of each region.
Chapter 3: Detailed analysis of Wafer Grinding Wheel manufacturers competitive landscape, sales, revenue, price, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the sales, revenue, price, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the sales, revenue, price, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Region analysis by company, by customer, by Type, by Application, sales, revenue, and price for each segment,
Chapter 7: Provides profiles of key manufacturers, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Wafer Grinding Wheel revenue, gross margin, and recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Sales channels analysis
Chapter 10: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 11: The main points and conclusions of the report.
QYRESEARCH'S STRENGTHS
Unlike generic global market reports, this study combines macro-level industry trends with hyper-local operational intelligence, empowering data-driven decisions across the Compound Chocolate value chain, addressing:
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TABLE OF CONTENTS
1 Market Overview
1.1 Wafer Grinding Wheel Product Scope
1.2 Wafer Grinding Wheel by Type
1.2.1 Global Wafer Grinding Wheel Sales by Type (2020 & 2024 & 2031)
1.2.2 Coarse Grinding
1.2.3 Fine Grinding
1.3 Wafer Grinding Wheel by Application
1.3.1 Global Wafer Grinding Wheel Sales Comparison by Application (2020 & 2024 & 2031)
1.3.2 8 Inch Wafer
1.3.3 12 Inch Wafer
1.3.4 Others
1.4 Global Wafer Grinding Wheel Market Estimates and Forecasts (2020-2031)
1.4.1 Global Wafer Grinding Wheel Market Size in Value Growth Rate (2020-2031)
1.4.2 Global Wafer Grinding Wheel Market Size in Volume Growth Rate (2020-2031)
1.4.3 Global Wafer Grinding Wheel Price Trends (2020-2031)
1.5 Assumptions and Limitations
2 Market Size and Prospective by Region
2.1 Global Wafer Grinding Wheel Market Size by Region: 2020 VS 2024 VS 2031
2.2 Global Wafer Grinding Wheel Retrospective Market Scenario by Region (2020-2025)
2.2.1 Global Wafer Grinding Wheel Sales Market Share by Region (2020-2025)
2.2.2 Global Wafer Grinding Wheel Revenue Market Share by Region (2020-2025)
2.3 Global Wafer Grinding Wheel Market Estimates and Forecasts by Region (2026-2031)
2.3.1 Global Wafer Grinding Wheel Sales Estimates and Forecasts by Region (2026-2031)
2.3.2 Global Wafer Grinding Wheel Revenue Forecast by Region (2026-2031)
2.4 Major Region and Emerging Market Analysis
2.4.1 North America Wafer Grinding Wheel Market Size and Prospective (2020-2031)
2.4.2 Europe Wafer Grinding Wheel Market Size and Prospective (2020-2031)
2.4.3 China Wafer Grinding Wheel Market Size and Prospective (2020-2031)
2.4.4 Japan Wafer Grinding Wheel Market Size and Prospective (2020-2031)
3 Global Market Size by Type
3.1 Global Wafer Grinding Wheel Historic Market Review by Type (2020-2025)
3.1.1 Global Wafer Grinding Wheel Sales by Type (2020-2025)
3.1.2 Global Wafer Grinding Wheel Revenue by Type (2020-2025)
3.1.3 Global Wafer Grinding Wheel Price by Type (2020-2025)
3.2 Global Wafer Grinding Wheel Market Estimates and Forecasts by Type (2026-2031)
3.2.1 Global Wafer Grinding Wheel Sales Forecast by Type (2026-2031)
3.2.2 Global Wafer Grinding Wheel Revenue Forecast by Type (2026-2031)
3.2.3 Global Wafer Grinding Wheel Price Forecast by Type (2026-2031)
3.3 Different Types Wafer Grinding Wheel Representative Players
4 Global Market Size by Application
4.1 Global Wafer Grinding Wheel Historic Market Review by Application (2020-2025)
4.1.1 Global Wafer Grinding Wheel Sales by Application (2020-2025)
4.1.2 Global Wafer Grinding Wheel Revenue by Application (2020-2025)
4.1.3 Global Wafer Grinding Wheel Price by Application (2020-2025)
4.2 Global Wafer Grinding Wheel Market Estimates and Forecasts by Application (2026-2031)
4.2.1 Global Wafer Grinding Wheel Sales Forecast by Application (2026-2031)
4.2.2 Global Wafer Grinding Wheel Revenue Forecast by Application (2026-2031)
4.2.3 Global Wafer Grinding Wheel Price Forecast by Application (2026-2031)
4.3 New Sources of Growth in Wafer Grinding Wheel Application
5 Competition Landscape by Players
5.1 Global Wafer Grinding Wheel Sales by Players (2020-2025)
5.2 Global Top Wafer Grinding Wheel Players by Revenue (2020-2025)
5.3 Global Wafer Grinding Wheel Market Share by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Wafer Grinding Wheel as of 2024)
5.4 Global Wafer Grinding Wheel Average Price by Company (2020-2025)
5.5 Global Key Manufacturers of Wafer Grinding Wheel, Manufacturing Sites & Headquarters
5.6 Global Key Manufacturers of Wafer Grinding Wheel, Product Type & Application
5.7 Global Key Manufacturers of Wafer Grinding Wheel, Date of Enter into This Industry
5.8 Manufacturers Mergers & Acquisitions, Expansion Plans
6 Region Analysis
6.1 North America Market: Players, Segments, Downstream and Major Customers
6.1.1 North America Wafer Grinding Wheel Sales by Company
6.1.1.1 North America Wafer Grinding Wheel Sales by Company (2020-2025)
6.1.1.2 North America Wafer Grinding Wheel Revenue by Company (2020-2025)
6.1.2 North America Wafer Grinding Wheel Sales Breakdown by Type (2020-2025)
6.1.3 North America Wafer Grinding Wheel Sales Breakdown by Application (2020-2025)
6.1.4 North America Wafer Grinding Wheel Major Customer
6.1.5 North America Market Trend and Opportunities
6.2 Europe Market: Players, Segments, Downstream and Major Customers
6.2.1 Europe Wafer Grinding Wheel Sales by Company
6.2.1.1 Europe Wafer Grinding Wheel Sales by Company (2020-2025)
6.2.1.2 Europe Wafer Grinding Wheel Revenue by Company (2020-2025)
6.2.2 Europe Wafer Grinding Wheel Sales Breakdown by Type (2020-2025)
6.2.3 Europe Wafer Grinding Wheel Sales Breakdown by Application (2020-2025)
6.2.4 Europe Wafer Grinding Wheel Major Customer
6.2.5 Europe Market Trend and Opportunities
6.3 China Market: Players, Segments, Downstream and Major Customers
6.3.1 China Wafer Grinding Wheel Sales by Company
6.3.1.1 China Wafer Grinding Wheel Sales by Company (2020-2025)
6.3.1.2 China Wafer Grinding Wheel Revenue by Company (2020-2025)
6.3.2 China Wafer Grinding Wheel Sales Breakdown by Type (2020-2025)
6.3.3 China Wafer Grinding Wheel Sales Breakdown by Application (2020-2025)
6.3.4 China Wafer Grinding Wheel Major Customer
6.3.5 China Market Trend and Opportunities
6.4 Japan Market: Players, Segments, Downstream and Major Customers
6.4.1 Japan Wafer Grinding Wheel Sales by Company
6.4.1.1 Japan Wafer Grinding Wheel Sales by Company (2020-2025)
6.4.1.2 Japan Wafer Grinding Wheel Revenue by Company (2020-2025)
6.4.2 Japan Wafer Grinding Wheel Sales Breakdown by Type (2020-2025)
6.4.3 Japan Wafer Grinding Wheel Sales Breakdown by Application (2020-2025)
6.4.4 Japan Wafer Grinding Wheel Major Customer
6.4.5 Japan Market Trend and Opportunities
7 Company Profiles and Key Figures
7.1 Disco Corporation
7.1.1 Disco Corporation Company Information
7.1.2 Disco Corporation Business Overview
7.1.3 Disco Corporation Wafer Grinding Wheel Sales, Revenue and Gross Margin (2020-2025)
7.1.4 Disco Corporation Wafer Grinding Wheel Products Offered
7.1.5 Disco Corporation Recent Development
7.2 Kinik Company
7.2.1 Kinik Company Company Information
7.2.2 Kinik Company Business Overview
7.2.3 Kinik Company Wafer Grinding Wheel Sales, Revenue and Gross Margin (2020-2025)
7.2.4 Kinik Company Wafer Grinding Wheel Products Offered
7.2.5 Kinik Company Recent Development
7.3 Tokyo Diamond Tools Mfg
7.3.1 Tokyo Diamond Tools Mfg Company Information
7.3.2 Tokyo Diamond Tools Mfg Business Overview
7.3.3 Tokyo Diamond Tools Mfg Wafer Grinding Wheel Sales, Revenue and Gross Margin (2020-2025)
7.3.4 Tokyo Diamond Tools Mfg Wafer Grinding Wheel Products Offered
7.3.5 Tokyo Diamond Tools Mfg Recent Development
7.4 Saint-Gobain
7.4.1 Saint-Gobain Company Information
7.4.2 Saint-Gobain Business Overview
7.4.3 Saint-Gobain Wafer Grinding Wheel Sales, Revenue and Gross Margin (2020-2025)
7.4.4 Saint-Gobain Wafer Grinding Wheel Products Offered
7.4.5 Saint-Gobain Recent Development
7.5 Asahi Diamond Industrial
7.5.1 Asahi Diamond Industrial Company Information
7.5.2 Asahi Diamond Industrial Business Overview
7.5.3 Asahi Diamond Industrial Wafer Grinding Wheel Sales, Revenue and Gross Margin (2020-2025)
7.5.4 Asahi Diamond Industrial Wafer Grinding Wheel Products Offered
7.5.5 Asahi Diamond Industrial Recent Development
7.6 ALMT Corp
7.6.1 ALMT Corp Company Information
7.6.2 ALMT Corp Business Overview
7.6.3 ALMT Corp Wafer Grinding Wheel Sales, Revenue and Gross Margin (2020-2025)
7.6.4 ALMT Corp Wafer Grinding Wheel Products Offered
7.6.5 ALMT Corp Recent Development
7.7 Nippon Pulse Motor
7.7.1 Nippon Pulse Motor Company Information
7.7.2 Nippon Pulse Motor Business Overview
7.7.3 Nippon Pulse Motor Wafer Grinding Wheel Sales, Revenue and Gross Margin (2020-2025)
7.7.4 Nippon Pulse Motor Wafer Grinding Wheel Products Offered
7.7.5 Nippon Pulse Motor Recent Development
7.8 KURE GRINDING WHEEL
7.8.1 KURE GRINDING WHEEL Company Information
7.8.2 KURE GRINDING WHEEL Business Overview
7.8.3 KURE GRINDING WHEEL Wafer Grinding Wheel Sales, Revenue and Gross Margin (2020-2025)
7.8.4 KURE GRINDING WHEEL Wafer Grinding Wheel Products Offered
7.8.5 KURE GRINDING WHEEL Recent Development
7.9 EHWA DIAMOND
7.9.1 EHWA DIAMOND Company Information
7.9.2 EHWA DIAMOND Business Overview
7.9.3 EHWA DIAMOND Wafer Grinding Wheel Sales, Revenue and Gross Margin (2020-2025)
7.9.4 EHWA DIAMOND Wafer Grinding Wheel Products Offered
7.9.5 EHWA DIAMOND Recent Development
7.10 Meister Abrasives
7.10.1 Meister Abrasives Company Information
7.10.2 Meister Abrasives Business Overview
7.10.3 Meister Abrasives Wafer Grinding Wheel Sales, Revenue and Gross Margin (2020-2025)
7.10.4 Meister Abrasives Wafer Grinding Wheel Products Offered
7.10.5 Meister Abrasives Recent Development
7.11 Noritake
7.11.1 Noritake Company Information
7.11.2 Noritake Business Overview
7.11.3 Noritake Wafer Grinding Wheel Sales, Revenue and Gross Margin (2020-2025)
7.11.4 Noritake Wafer Grinding Wheel Products Offered
7.11.5 Noritake Recent Development
7.12 Co-Max Machinery Tools Ltd
7.12.1 Co-Max Machinery Tools Ltd Company Information
7.12.2 Co-Max Machinery Tools Ltd Business Overview
7.12.3 Co-Max Machinery Tools Ltd Wafer Grinding Wheel Sales, Revenue and Gross Margin (2020-2025)
7.12.4 Co-Max Machinery Tools Ltd Wafer Grinding Wheel Products Offered
7.12.5 Co-Max Machinery Tools Ltd Recent Development
7.13 Shinhan Diamond
7.13.1 Shinhan Diamond Company Information
7.13.2 Shinhan Diamond Business Overview
7.13.3 Shinhan Diamond Wafer Grinding Wheel Sales, Revenue and Gross Margin (2020-2025)
7.13.4 Shinhan Diamond Wafer Grinding Wheel Products Offered
7.13.5 Shinhan Diamond Recent Development
7.14 Nanjing Sanchao Advanced Materials
7.14.1 Nanjing Sanchao Advanced Materials Company Information
7.14.2 Nanjing Sanchao Advanced Materials Business Overview
7.14.3 Nanjing Sanchao Advanced Materials Wafer Grinding Wheel Sales, Revenue and Gross Margin (2020-2025)
7.14.4 Nanjing Sanchao Advanced Materials Wafer Grinding Wheel Products Offered
7.14.5 Nanjing Sanchao Advanced Materials Recent Development
7.15 Xiamen Chiaping
7.15.1 Xiamen Chiaping Company Information
7.15.2 Xiamen Chiaping Business Overview
7.15.3 Xiamen Chiaping Wafer Grinding Wheel Sales, Revenue and Gross Margin (2020-2025)
7.15.4 Xiamen Chiaping Wafer Grinding Wheel Products Offered
7.15.5 Xiamen Chiaping Recent Development
7.16 Super Hard Products Co
7.16.1 Super Hard Products Co Company Information
7.16.2 Super Hard Products Co Business Overview
7.16.3 Super Hard Products Co Wafer Grinding Wheel Sales, Revenue and Gross Margin (2020-2025)
7.16.4 Super Hard Products Co Wafer Grinding Wheel Products Offered
7.16.5 Super Hard Products Co Recent Development
7.17 Carbo Tzujan Industrial
7.17.1 Carbo Tzujan Industrial Company Information
7.17.2 Carbo Tzujan Industrial Business Overview
7.17.3 Carbo Tzujan Industrial Wafer Grinding Wheel Sales, Revenue and Gross Margin (2020-2025)
7.17.4 Carbo Tzujan Industrial Wafer Grinding Wheel Products Offered
7.17.5 Carbo Tzujan Industrial Recent Development
8 Wafer Grinding Wheel Manufacturing Cost Analysis
8.1 Wafer Grinding Wheel Key Raw Materials Analysis
8.1.1 Key Raw Materials
8.1.2 Key Suppliers of Raw Materials
8.2 Proportion of Manufacturing Cost Structure
8.3 Manufacturing Process Analysis of Wafer Grinding Wheel
8.4 Wafer Grinding Wheel Industrial Chain Analysis
9 Marketing Channel, Distributors and Customers
9.1 Marketing Channel
9.2 Wafer Grinding Wheel Distributors List
9.3 Wafer Grinding Wheel Customers
10 Wafer Grinding Wheel Market Dynamics
10.1 Wafer Grinding Wheel Industry Trends
10.2 Wafer Grinding Wheel Market Drivers
10.3 Wafer Grinding Wheel Market Challenges
10.4 Wafer Grinding Wheel Market Restraints
11 Research Findings and Conclusion
12 Appendix
12.1 Research Methodology
12.1.1 Methodology/Research Approach
12.1.1.1 Research Programs/Design
12.1.1.2 Market Size Estimation
12.1.1.3 Market Breakdown and Data Triangulation
12.1.2 Data Source
12.1.2.1 Secondary Sources
12.1.2.2 Primary Sources
12.2 Author Details
12.3 Disclaimer
TABLE OF FIGURES
List of Tables
List of Figures
KEY QUESTIONS ADDRESSED BY THE REPORT
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Wafer grinding wheels are used in the in-feed grinding process of semiconductor wafers such as TSV package (Cu/compound), SiC, sapphire, Si and reclaimed wafers etc. The in-feed grinding process consists of rough and fine grinding processes. Wafer grinding wheels are made of diamond abrasives and customized vitrified bond in a unique porous microstructure. The diamond size for rough and finish grinding processes are #325~#1000 and #2000~#8000 respectively. The features of these wafer grinding wheels are stable high removal rate, long lifetime and lower grinding resistance.
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Wafer grinding wheels are used in the in-feed grinding process of semiconductor wafers such as TSV package (Cu/compound), SiC, sapphire, Si and reclaimed wafers etc. The in-feed grinding process consists of rough and fine grinding processes. Wafer grinding wheels are made of diamond abrasives and customized vitrified bond in a unique porous microstructure. The diamond size for rough and finish grinding processes are #325~#1000 and #2000~#8000 respectively. The features of these wafer grinding wheels are stable high removal rate, long lifetime and lower grinding resistance.
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REPORT COVERAGE
DESCRIPTION
OVERVIEW
MARKET SEGMENTATION
CHAPTER OUTLINE
QYRESEARCH'S STRENGTHS
TABLE OF CONTENTS
TABLE OF FIGURES
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