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Home > Reports > Chemical & Material > Global Temporary Wafer Bonding Materials Market Research Report 2025

Global Temporary Wafer Bonding Materials Market Research Report 2025

Global Temporary Wafer Bonding Materials Market Research Report 2025

Industry: Chemical & Material

Published: 2025-04-30

Pages: 97 Pages

Report ld: 3570385

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  • Table of Figures 选中
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Description

The global market for Temporary Wafer Bonding Materials was valued at US$ 261 million in the year 2024 and is projected to reach a revised size of US$ 388 million by 2031, growing at a CAGR of 5.5% during the forecast period.

The 2025 U.S. tariff policies introduce profound uncertainty into the global economic landscape. This report critically examines the implications of recent tariff adjustments and international strategic countermeasures on Temporary Wafer Bonding Materials competitive dynamics, regional economic interdependencies, and supply chain reconfigurations.

Temporary Wafer Bonding Materials Market Size(US$)

M= millions and B=billions

QYRLogo
Temporary wafer bonding materials play a critical role in semiconductor manufacturing. They provide rigid support for ultra-thin wafers during the backside processing, ensuring the wafers can withstand complex back-end processing operations. These materials are characterized by excellent removability and thermal stability, making them suitable for high-temperature and chemical environments. They are widely used in 3D packaging, MEMS device manufacturing, and the production of high-performance semiconductor devices. By employing temporary bonding, wafer thinning and subsequent processes can be performed while preventing damage and deformation of the wafers during handling.

The market for temporary wafer bonding materials is currently in a critical phase of continuous technological evolution. These materials are widely used in advanced packaging and 3D integration processes in semiconductor manufacturing, primarily aiming to support non-destructive bonding and debonding of ultra-thin wafers. The mainstream materials in the market include inorganic substances (e.g., hydrogenated amorphous silicon) and various polymers (e.g., polyimide, PEEK, and PDMS). Their application often corresponds to specific debonding techniques, such as thermal slide debonding, solvent-based debonding, mechanical debonding, and laser debonding, with the maturity and adaptability of these techniques influencing market performance.

In the future, the development of temporary wafer bonding materials will focus on more efficient and lower-damage debonding processes. For instance, improvements in the precision and speed of laser debonding and air-jetting technologies are expected to drive market growth significantly. Additionally, with ongoing innovations in new electronic devices and semiconductor technologies, the demand for higher-performance and more stable temporary bonding materials will continue to rise. Moreover, the push for sustainable development is driving the industry towards environmentally friendly and recyclable materials, which will inject new vitality into the market.

The key drivers for market growth include the increasing demand for advanced packaging technologies in the semiconductor industry and breakthroughs in materials science. However, there are notable barriers, such as the high cost of developing high-performance materials, mismatches between debonding techniques and equipment, and the challenges of promoting emerging technical standards. Furthermore, technical barriers and intellectual property issues among manufacturers limit further integration and development in the industry.

Report Scope
This report aims to provide a comprehensive presentation of the global market for Temporary Wafer Bonding Materials, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Temporary Wafer Bonding Materials.

The Temporary Wafer Bonding Materials market size, estimations, and forecasts are provided in terms of output/shipments (Tons) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Temporary Wafer Bonding Materials market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Temporary Wafer Bonding Materials manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

  • Report Metric

  • Details

  • Report Title

  • Global Temporary Wafer Bonding Materials Market Research Report 2025

  • Forecasted Market Size in 2031

  • US$ 388 million

  • CAGR(2025-2031)

  • 5.5%

  • Market Size Available for Years

  • 2025-2031

  • Global Temporary Wafer Bonding Materials Companies Covered

  • 3M

    Nikka Seiko

    Brewer Science

    Sekisui Chemical

    Tokyo Ohka Kogyo

    AI Technology

    YINCAE Advanced Materials

    Valtech Corporation

    HD MicroSystems

    Samcien Semiconductor Materials

    Hubei Dinglong

    PhiChem Corporation

    Shin-Etsu Chemical

    Micro Materials

  • Global Temporary Wafer Bonding Materials Market, by Region

  • North America (U.S., Canada, Mexico)

    Europe (Germany, France, UK, Italy, etc.)

    Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)

    South America (Brazil, etc.)

    Middle East and Africa (Turkey, GCC Countries, Africa, etc.)

  • Global Temporary Wafer Bonding Materials Market, Segment by Type

  • Thermal Slide Debonding

    Mechanical Peeling

    Laser Ablation

    Chemical Dissolution

  • Global Temporary Wafer Bonding Materials Market, Segment by Application

  • Advanced Packaging

    MEMS

    CIS

    Others

  • Forecast Units

  • USD million in value

  • Report Coverage

  • Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Temporary Wafer Bonding Materials manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Temporary Wafer Bonding Materials by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Temporary Wafer Bonding Materials in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

Table of Contents

1 Temporary Wafer Bonding Materials Market Overview
    1.1 Product Definition
    1.2 Temporary Wafer Bonding Materials by Type
        1.2.1 Global Temporary Wafer Bonding Materials Market Value Growth Rate Analysis by Type: 2024 VS 2031
        1.2.2 Thermal Slide Debonding
        1.2.3 Mechanical Peeling
        1.2.4 Laser Ablation
        1.2.5 Chemical Dissolution
    1.3 Temporary Wafer Bonding Materials by Application
        1.3.1 Global Temporary Wafer Bonding Materials Market Value Growth Rate Analysis by Application: 2024 VS 2031
        1.3.2 Advanced Packaging
        1.3.3 MEMS
        1.3.4 CIS
        1.3.5 Others
    1.4 Global Market Growth Prospects
        1.4.1 Global Temporary Wafer Bonding Materials Production Value Estimates and Forecasts (2020-2031)
        1.4.2 Global Temporary Wafer Bonding Materials Production Capacity Estimates and Forecasts (2020-2031)
        1.4.3 Global Temporary Wafer Bonding Materials Production Estimates and Forecasts (2020-2031)
        1.4.4 Global Temporary Wafer Bonding Materials Market Average Price Estimates and Forecasts (2020-2031)
    1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
    2.1 Global Temporary Wafer Bonding Materials Production Market Share by Manufacturers (2020-2025)
    2.2 Global Temporary Wafer Bonding Materials Production Value Market Share by Manufacturers (2020-2025)
    2.3 Global Key Players of Temporary Wafer Bonding Materials, Industry Ranking, 2023 VS 2024
    2.4 Global Temporary Wafer Bonding Materials Company Type and Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
    2.5 Global Temporary Wafer Bonding Materials Average Price by Manufacturers (2020-2025)
    2.6 Global Key Manufacturers of Temporary Wafer Bonding Materials, Manufacturing Base Distribution and Headquarters
    2.7 Global Key Manufacturers of Temporary Wafer Bonding Materials, Product Offered and Application
    2.8 Global Key Manufacturers of Temporary Wafer Bonding Materials, Date of Enter into This Industry
    2.9 Temporary Wafer Bonding Materials Market Competitive Situation and Trends
        2.9.1 Temporary Wafer Bonding Materials Market Concentration Rate
        2.9.2 Global 5 and 10 Largest Temporary Wafer Bonding Materials Players Market Share by Revenue
    2.10 Mergers & Acquisitions, Expansion
3 Temporary Wafer Bonding Materials Production by Region
    3.1 Global Temporary Wafer Bonding Materials Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
    3.2 Global Temporary Wafer Bonding Materials Production Value by Region (2020-2031)
        3.2.1 Global Temporary Wafer Bonding Materials Production Value by Region (2020-2025)
        3.2.2 Global Forecasted Production Value of Temporary Wafer Bonding Materials by Region (2026-2031)
    3.3 Global Temporary Wafer Bonding Materials Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
    3.4 Global Temporary Wafer Bonding Materials Production Volume by Region (2020-2031)
        3.4.1 Global Temporary Wafer Bonding Materials Production by Region (2020-2025)
        3.4.2 Global Forecasted Production of Temporary Wafer Bonding Materials by Region (2026-2031)
    3.5 Global Temporary Wafer Bonding Materials Market Price Analysis by Region (2020-2025)
    3.6 Global Temporary Wafer Bonding Materials Production and Value, Year-over-Year Growth
        3.6.1 North America Temporary Wafer Bonding Materials Production Value Estimates and Forecasts (2020-2031)
        3.6.2 Europe Temporary Wafer Bonding Materials Production Value Estimates and Forecasts (2020-2031)
        3.6.3 China Temporary Wafer Bonding Materials Production Value Estimates and Forecasts (2020-2031)
        3.6.4 Japan Temporary Wafer Bonding Materials Production Value Estimates and Forecasts (2020-2031)
4 Temporary Wafer Bonding Materials Consumption by Region
    4.1 Global Temporary Wafer Bonding Materials Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
    4.2 Global Temporary Wafer Bonding Materials Consumption by Region (2020-2031)
        4.2.1 Global Temporary Wafer Bonding Materials Consumption by Region (2020-2025)
        4.2.2 Global Temporary Wafer Bonding Materials Forecasted Consumption by Region (2026-2031)
    4.3 North America
        4.3.1 North America Temporary Wafer Bonding Materials Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
        4.3.2 North America Temporary Wafer Bonding Materials Consumption by Country (2020-2031)
        4.3.3 U.S.
        4.3.4 Canada
    4.4 Europe
        4.4.1 Europe Temporary Wafer Bonding Materials Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
        4.4.2 Europe Temporary Wafer Bonding Materials Consumption by Country (2020-2031)
        4.4.3 Germany
        4.4.4 France
        4.4.5 U.K.
        4.4.6 Italy
        4.4.7 Russia
    4.5 Asia Pacific
        4.5.1 Asia Pacific Temporary Wafer Bonding Materials Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
        4.5.2 Asia Pacific Temporary Wafer Bonding Materials Consumption by Region (2020-2031)
        4.5.3 China
        4.5.4 Japan
        4.5.5 South Korea
        4.5.6 China Taiwan
        4.5.7 Southeast Asia
        4.5.8 India
    4.6 Latin America, Middle East & Africa
        4.6.1 Latin America, Middle East & Africa Temporary Wafer Bonding Materials Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
        4.6.2 Latin America, Middle East & Africa Temporary Wafer Bonding Materials Consumption by Country (2020-2031)
        4.6.3 Mexico
        4.6.4 Brazil
        4.6.5 Turkey
        4.6.6 GCC Countries
5 Segment by Type
    5.1 Global Temporary Wafer Bonding Materials Production by Type (2020-2031)
        5.1.1 Global Temporary Wafer Bonding Materials Production by Type (2020-2025)
        5.1.2 Global Temporary Wafer Bonding Materials Production by Type (2026-2031)
        5.1.3 Global Temporary Wafer Bonding Materials Production Market Share by Type (2020-2031)
    5.2 Global Temporary Wafer Bonding Materials Production Value by Type (2020-2031)
        5.2.1 Global Temporary Wafer Bonding Materials Production Value by Type (2020-2025)
        5.2.2 Global Temporary Wafer Bonding Materials Production Value by Type (2026-2031)
        5.2.3 Global Temporary Wafer Bonding Materials Production Value Market Share by Type (2020-2031)
    5.3 Global Temporary Wafer Bonding Materials Price by Type (2020-2031)
6 Segment by Application
    6.1 Global Temporary Wafer Bonding Materials Production by Application (2020-2031)
        6.1.1 Global Temporary Wafer Bonding Materials Production by Application (2020-2025)
        6.1.2 Global Temporary Wafer Bonding Materials Production by Application (2026-2031)
        6.1.3 Global Temporary Wafer Bonding Materials Production Market Share by Application (2020-2031)
    6.2 Global Temporary Wafer Bonding Materials Production Value by Application (2020-2031)
        6.2.1 Global Temporary Wafer Bonding Materials Production Value by Application (2020-2025)
        6.2.2 Global Temporary Wafer Bonding Materials Production Value by Application (2026-2031)
        6.2.3 Global Temporary Wafer Bonding Materials Production Value Market Share by Application (2020-2031)
    6.3 Global Temporary Wafer Bonding Materials Price by Application (2020-2031)
7 Key Companies Profiled
    7.1 3M
        7.1.1 3M Temporary Wafer Bonding Materials Company Information
        7.1.2 3M Temporary Wafer Bonding Materials Product Portfolio
        7.1.3 3M Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2020-2025)
        7.1.4 3M Main Business and Markets Served
        7.1.5 3M Recent Developments/Updates
    7.2 Nikka Seiko
        7.2.1 Nikka Seiko Temporary Wafer Bonding Materials Company Information
        7.2.2 Nikka Seiko Temporary Wafer Bonding Materials Product Portfolio
        7.2.3 Nikka Seiko Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2020-2025)
        7.2.4 Nikka Seiko Main Business and Markets Served
        7.2.5 Nikka Seiko Recent Developments/Updates
    7.3 Brewer Science
        7.3.1 Brewer Science Temporary Wafer Bonding Materials Company Information
        7.3.2 Brewer Science Temporary Wafer Bonding Materials Product Portfolio
        7.3.3 Brewer Science Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2020-2025)
        7.3.4 Brewer Science Main Business and Markets Served
        7.3.5 Brewer Science Recent Developments/Updates
    7.4 Sekisui Chemical
        7.4.1 Sekisui Chemical Temporary Wafer Bonding Materials Company Information
        7.4.2 Sekisui Chemical Temporary Wafer Bonding Materials Product Portfolio
        7.4.3 Sekisui Chemical Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2020-2025)
        7.4.4 Sekisui Chemical Main Business and Markets Served
        7.4.5 Sekisui Chemical Recent Developments/Updates
    7.5 Tokyo Ohka Kogyo
        7.5.1 Tokyo Ohka Kogyo Temporary Wafer Bonding Materials Company Information
        7.5.2 Tokyo Ohka Kogyo Temporary Wafer Bonding Materials Product Portfolio
        7.5.3 Tokyo Ohka Kogyo Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2020-2025)
        7.5.4 Tokyo Ohka Kogyo Main Business and Markets Served
        7.5.5 Tokyo Ohka Kogyo Recent Developments/Updates
    7.6 AI Technology
        7.6.1 AI Technology Temporary Wafer Bonding Materials Company Information
        7.6.2 AI Technology Temporary Wafer Bonding Materials Product Portfolio
        7.6.3 AI Technology Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2020-2025)
        7.6.4 AI Technology Main Business and Markets Served
        7.6.5 AI Technology Recent Developments/Updates
    7.7 YINCAE Advanced Materials
        7.7.1 YINCAE Advanced Materials Temporary Wafer Bonding Materials Company Information
        7.7.2 YINCAE Advanced Materials Temporary Wafer Bonding Materials Product Portfolio
        7.7.3 YINCAE Advanced Materials Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2020-2025)
        7.7.4 YINCAE Advanced Materials Main Business and Markets Served
        7.7.5 YINCAE Advanced Materials Recent Developments/Updates
    7.8 Valtech Corporation
        7.8.1 Valtech Corporation Temporary Wafer Bonding Materials Company Information
        7.8.2 Valtech Corporation Temporary Wafer Bonding Materials Product Portfolio
        7.8.3 Valtech Corporation Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2020-2025)
        7.8.4 Valtech Corporation Main Business and Markets Served
        7.8.5 Valtech Corporation Recent Developments/Updates
    7.9 HD MicroSystems
        7.9.1 HD MicroSystems Temporary Wafer Bonding Materials Company Information
        7.9.2 HD MicroSystems Temporary Wafer Bonding Materials Product Portfolio
        7.9.3 HD MicroSystems Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2020-2025)
        7.9.4 HD MicroSystems Main Business and Markets Served
        7.9.5 HD MicroSystems Recent Developments/Updates
    7.10 Samcien Semiconductor Materials
        7.10.1 Samcien Semiconductor Materials Temporary Wafer Bonding Materials Company Information
        7.10.2 Samcien Semiconductor Materials Temporary Wafer Bonding Materials Product Portfolio
        7.10.3 Samcien Semiconductor Materials Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2020-2025)
        7.10.4 Samcien Semiconductor Materials Main Business and Markets Served
        7.10.5 Samcien Semiconductor Materials Recent Developments/Updates
    7.11 Hubei Dinglong
        7.11.1 Hubei Dinglong Temporary Wafer Bonding Materials Company Information
        7.11.2 Hubei Dinglong Temporary Wafer Bonding Materials Product Portfolio
        7.11.3 Hubei Dinglong Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2020-2025)
        7.11.4 Hubei Dinglong Main Business and Markets Served
        7.11.5 Hubei Dinglong Recent Developments/Updates
    7.12 PhiChem Corporation
        7.12.1 PhiChem Corporation Temporary Wafer Bonding Materials Company Information
        7.12.2 PhiChem Corporation Temporary Wafer Bonding Materials Product Portfolio
        7.12.3 PhiChem Corporation Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2020-2025)
        7.12.4 PhiChem Corporation Main Business and Markets Served
        7.12.5 PhiChem Corporation Recent Developments/Updates
    7.13 Shin-Etsu Chemical
        7.13.1 Shin-Etsu Chemical Temporary Wafer Bonding Materials Company Information
        7.13.2 Shin-Etsu Chemical Temporary Wafer Bonding Materials Product Portfolio
        7.13.3 Shin-Etsu Chemical Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2020-2025)
        7.13.4 Shin-Etsu Chemical Main Business and Markets Served
        7.13.5 Shin-Etsu Chemical Recent Developments/Updates
    7.14 Micro Materials
        7.14.1 Micro Materials Temporary Wafer Bonding Materials Company Information
        7.14.2 Micro Materials Temporary Wafer Bonding Materials Product Portfolio
        7.14.3 Micro Materials Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2020-2025)
        7.14.4 Micro Materials Main Business and Markets Served
        7.14.5 Micro Materials Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
    8.1 Temporary Wafer Bonding Materials Industry Chain Analysis
    8.2 Temporary Wafer Bonding Materials Raw Material Supply Analysis
        8.2.1 Key Raw Materials
        8.2.2 Raw Materials Key Suppliers
    8.3 Temporary Wafer Bonding Materials Production Mode & Process Analysis
    8.4 Temporary Wafer Bonding Materials Sales and Marketing
        8.4.1 Temporary Wafer Bonding Materials Sales Channels
        8.4.2 Temporary Wafer Bonding Materials Distributors
    8.5 Temporary Wafer Bonding Materials Customer Analysis
9 Temporary Wafer Bonding Materials Market Dynamics
    9.1 Temporary Wafer Bonding Materials Industry Trends
    9.2 Temporary Wafer Bonding Materials Market Drivers
    9.3 Temporary Wafer Bonding Materials Market Challenges
    9.4 Temporary Wafer Bonding Materials Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
    11.1 Methodology/Research Approach
        11.1.1 Research Programs/Design
        11.1.2 Market Size Estimation
        11.1.3 Market Breakdown and Data Triangulation
    11.2 Data Source
        11.2.1 Secondary Sources
        11.2.2 Primary Sources
    11.3 Author List
    11.4 Disclaimer

Table of Figures

List of Tables
 Table 1. Global Temporary Wafer Bonding Materials Market Value by Type, (US$ Million) & (2024 VS 2031)
 Table 2. Global Temporary Wafer Bonding Materials Market Value by Application, (US$ Million) & (2024 VS 2031)
 Table 3. Global Temporary Wafer Bonding Materials Production Capacity (Tons) by Manufacturers in 2024
 Table 4. Global Temporary Wafer Bonding Materials Production by Manufacturers (2020-2025) & (Tons)
 Table 5. Global Temporary Wafer Bonding Materials Production Market Share by Manufacturers (2020-2025)
 Table 6. Global Temporary Wafer Bonding Materials Production Value by Manufacturers (2020-2025) & (US$ Million)
 Table 7. Global Temporary Wafer Bonding Materials Production Value Share by Manufacturers (2020-2025)
 Table 8. Global Key Players of Temporary Wafer Bonding Materials, Industry Ranking, 2023 VS 2024
 Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Temporary Wafer Bonding Materials as of 2024)
 Table 10. Global Market Temporary Wafer Bonding Materials Average Price by Manufacturers (US$/kg) & (2020-2025)
 Table 11. Global Key Manufacturers of Temporary Wafer Bonding Materials, Manufacturing Base Distribution and Headquarters
 Table 12. Global Key Manufacturers of Temporary Wafer Bonding Materials, Product Offered and Application
 Table 13. Global Key Manufacturers of Temporary Wafer Bonding Materials, Date of Enter into This Industry
 Table 14. Global Temporary Wafer Bonding Materials Manufacturers Market Concentration Ratio (CR5 and HHI)
 Table 15. Mergers & Acquisitions, Expansion Plans
 Table 16. Global Temporary Wafer Bonding Materials Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Table 17. Global Temporary Wafer Bonding Materials Production Value (US$ Million) by Region (2020-2025)
 Table 18. Global Temporary Wafer Bonding Materials Production Value Market Share by Region (2020-2025)
 Table 19. Global Temporary Wafer Bonding Materials Production Value (US$ Million) Forecast by Region (2026-2031)
 Table 20. Global Temporary Wafer Bonding Materials Production Value Market Share Forecast by Region (2026-2031)
 Table 21. Global Temporary Wafer Bonding Materials Production Comparison by Region: 2020 VS 2024 VS 2031 (Tons)
 Table 22. Global Temporary Wafer Bonding Materials Production (Tons) by Region (2020-2025)
 Table 23. Global Temporary Wafer Bonding Materials Production Market Share by Region (2020-2025)
 Table 24. Global Temporary Wafer Bonding Materials Production (Tons) Forecast by Region (2026-2031)
 Table 25. Global Temporary Wafer Bonding Materials Production Market Share Forecast by Region (2026-2031)
 Table 26. Global Temporary Wafer Bonding Materials Market Average Price (US$/kg) by Region (2020-2025)
 Table 27. Global Temporary Wafer Bonding Materials Market Average Price (US$/kg) by Region (2026-2031)
 Table 28. Global Temporary Wafer Bonding Materials Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Tons)
 Table 29. Global Temporary Wafer Bonding Materials Consumption by Region (2020-2025) & (Tons)
 Table 30. Global Temporary Wafer Bonding Materials Consumption Market Share by Region (2020-2025)
 Table 31. Global Temporary Wafer Bonding Materials Forecasted Consumption by Region (2026-2031) & (Tons)
 Table 32. Global Temporary Wafer Bonding Materials Forecasted Consumption Market Share by Region (2026-2031)
 Table 33. North America Temporary Wafer Bonding Materials Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Tons)
 Table 34. North America Temporary Wafer Bonding Materials Consumption by Country (2020-2025) & (Tons)
 Table 35. North America Temporary Wafer Bonding Materials Consumption by Country (2026-2031) & (Tons)
 Table 36. Europe Temporary Wafer Bonding Materials Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Tons)
 Table 37. Europe Temporary Wafer Bonding Materials Consumption by Country (2020-2025) & (Tons)
 Table 38. Europe Temporary Wafer Bonding Materials Consumption by Country (2026-2031) & (Tons)
 Table 39. Asia Pacific Temporary Wafer Bonding Materials Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Tons)
 Table 40. Asia Pacific Temporary Wafer Bonding Materials Consumption by Region (2020-2025) & (Tons)
 Table 41. Asia Pacific Temporary Wafer Bonding Materials Consumption by Region (2026-2031) & (Tons)
 Table 42. Latin America, Middle East & Africa Temporary Wafer Bonding Materials Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Tons)
 Table 43. Latin America, Middle East & Africa Temporary Wafer Bonding Materials Consumption by Country (2020-2025) & (Tons)
 Table 44. Latin America, Middle East & Africa Temporary Wafer Bonding Materials Consumption by Country (2026-2031) & (Tons)
 Table 45. Global Temporary Wafer Bonding Materials Production (Tons) by Type (2020-2025)
 Table 46. Global Temporary Wafer Bonding Materials Production (Tons) by Type (2026-2031)
 Table 47. Global Temporary Wafer Bonding Materials Production Market Share by Type (2020-2025)
 Table 48. Global Temporary Wafer Bonding Materials Production Market Share by Type (2026-2031)
 Table 49. Global Temporary Wafer Bonding Materials Production Value (US$ Million) by Type (2020-2025)
 Table 50. Global Temporary Wafer Bonding Materials Production Value (US$ Million) by Type (2026-2031)
 Table 51. Global Temporary Wafer Bonding Materials Production Value Market Share by Type (2020-2025)
 Table 52. Global Temporary Wafer Bonding Materials Production Value Market Share by Type (2026-2031)
 Table 53. Global Temporary Wafer Bonding Materials Price (US$/kg) by Type (2020-2025)
 Table 54. Global Temporary Wafer Bonding Materials Price (US$/kg) by Type (2026-2031)
 Table 55. Global Temporary Wafer Bonding Materials Production (Tons) by Application (2020-2025)
 Table 56. Global Temporary Wafer Bonding Materials Production (Tons) by Application (2026-2031)
 Table 57. Global Temporary Wafer Bonding Materials Production Market Share by Application (2020-2025)
 Table 58. Global Temporary Wafer Bonding Materials Production Market Share by Application (2026-2031)
 Table 59. Global Temporary Wafer Bonding Materials Production Value (US$ Million) by Application (2020-2025)
 Table 60. Global Temporary Wafer Bonding Materials Production Value (US$ Million) by Application (2026-2031)
 Table 61. Global Temporary Wafer Bonding Materials Production Value Market Share by Application (2020-2025)
 Table 62. Global Temporary Wafer Bonding Materials Production Value Market Share by Application (2026-2031)
 Table 63. Global Temporary Wafer Bonding Materials Price (US$/kg) by Application (2020-2025)
 Table 64. Global Temporary Wafer Bonding Materials Price (US$/kg) by Application (2026-2031)
 Table 65. 3M Temporary Wafer Bonding Materials Company Information
 Table 66. 3M Temporary Wafer Bonding Materials Specification and Application
 Table 67. 3M Temporary Wafer Bonding Materials Production (Tons), Value (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
 Table 68. 3M Main Business and Markets Served
 Table 69. 3M Recent Developments/Updates
 Table 70. Nikka Seiko Temporary Wafer Bonding Materials Company Information
 Table 71. Nikka Seiko Temporary Wafer Bonding Materials Specification and Application
 Table 72. Nikka Seiko Temporary Wafer Bonding Materials Production (Tons), Value (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
 Table 73. Nikka Seiko Main Business and Markets Served
 Table 74. Nikka Seiko Recent Developments/Updates
 Table 75. Brewer Science Temporary Wafer Bonding Materials Company Information
 Table 76. Brewer Science Temporary Wafer Bonding Materials Specification and Application
 Table 77. Brewer Science Temporary Wafer Bonding Materials Production (Tons), Value (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
 Table 78. Brewer Science Main Business and Markets Served
 Table 79. Brewer Science Recent Developments/Updates
 Table 80. Sekisui Chemical Temporary Wafer Bonding Materials Company Information
 Table 81. Sekisui Chemical Temporary Wafer Bonding Materials Specification and Application
 Table 82. Sekisui Chemical Temporary Wafer Bonding Materials Production (Tons), Value (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
 Table 83. Sekisui Chemical Main Business and Markets Served
 Table 84. Sekisui Chemical Recent Developments/Updates
 Table 85. Tokyo Ohka Kogyo Temporary Wafer Bonding Materials Company Information
 Table 86. Tokyo Ohka Kogyo Temporary Wafer Bonding Materials Specification and Application
 Table 87. Tokyo Ohka Kogyo Temporary Wafer Bonding Materials Production (Tons), Value (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
 Table 88. Tokyo Ohka Kogyo Main Business and Markets Served
 Table 89. Tokyo Ohka Kogyo Recent Developments/Updates
 Table 90. AI Technology Temporary Wafer Bonding Materials Company Information
 Table 91. AI Technology Temporary Wafer Bonding Materials Specification and Application
 Table 92. AI Technology Temporary Wafer Bonding Materials Production (Tons), Value (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
 Table 93. AI Technology Main Business and Markets Served
 Table 94. AI Technology Recent Developments/Updates
 Table 95. YINCAE Advanced Materials Temporary Wafer Bonding Materials Company Information
 Table 96. YINCAE Advanced Materials Temporary Wafer Bonding Materials Specification and Application
 Table 97. YINCAE Advanced Materials Temporary Wafer Bonding Materials Production (Tons), Value (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
 Table 98. YINCAE Advanced Materials Main Business and Markets Served
 Table 99. YINCAE Advanced Materials Recent Developments/Updates
 Table 100. Valtech Corporation Temporary Wafer Bonding Materials Company Information
 Table 101. Valtech Corporation Temporary Wafer Bonding Materials Specification and Application
 Table 102. Valtech Corporation Temporary Wafer Bonding Materials Production (Tons), Value (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
 Table 103. Valtech Corporation Main Business and Markets Served
 Table 104. Valtech Corporation Recent Developments/Updates
 Table 105. HD MicroSystems Temporary Wafer Bonding Materials Company Information
 Table 106. HD MicroSystems Temporary Wafer Bonding Materials Specification and Application
 Table 107. HD MicroSystems Temporary Wafer Bonding Materials Production (Tons), Value (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
 Table 108. HD MicroSystems Main Business and Markets Served
 Table 109. HD MicroSystems Recent Developments/Updates
 Table 110. Samcien Semiconductor Materials Temporary Wafer Bonding Materials Company Information
 Table 111. Samcien Semiconductor Materials Temporary Wafer Bonding Materials Specification and Application
 Table 112. Samcien Semiconductor Materials Temporary Wafer Bonding Materials Production (Tons), Value (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
 Table 113. Samcien Semiconductor Materials Main Business and Markets Served
 Table 114. Samcien Semiconductor Materials Recent Developments/Updates
 Table 115. Hubei Dinglong Temporary Wafer Bonding Materials Company Information
 Table 116. Hubei Dinglong Temporary Wafer Bonding Materials Specification and Application
 Table 117. Hubei Dinglong Temporary Wafer Bonding Materials Production (Tons), Value (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
 Table 118. Hubei Dinglong Main Business and Markets Served
 Table 119. Hubei Dinglong Recent Developments/Updates
 Table 120. PhiChem Corporation Temporary Wafer Bonding Materials Company Information
 Table 121. PhiChem Corporation Temporary Wafer Bonding Materials Specification and Application
 Table 122. PhiChem Corporation Temporary Wafer Bonding Materials Production (Tons), Value (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
 Table 123. PhiChem Corporation Main Business and Markets Served
 Table 124. PhiChem Corporation Recent Developments/Updates
 Table 125. Shin-Etsu Chemical Temporary Wafer Bonding Materials Company Information
 Table 126. Shin-Etsu Chemical Temporary Wafer Bonding Materials Specification and Application
 Table 127. Shin-Etsu Chemical Temporary Wafer Bonding Materials Production (Tons), Value (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
 Table 128. Shin-Etsu Chemical Main Business and Markets Served
 Table 129. Shin-Etsu Chemical Recent Developments/Updates
 Table 130. Micro Materials Temporary Wafer Bonding Materials Company Information
 Table 131. Micro Materials Temporary Wafer Bonding Materials Specification and Application
 Table 132. Micro Materials Temporary Wafer Bonding Materials Production (Tons), Value (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
 Table 133. Micro Materials Main Business and Markets Served
 Table 134. Micro Materials Recent Developments/Updates
 Table 135. Key Raw Materials Lists
 Table 136. Raw Materials Key Suppliers Lists
 Table 137. Temporary Wafer Bonding Materials Distributors List
 Table 138. Temporary Wafer Bonding Materials Customers List
 Table 139. Temporary Wafer Bonding Materials Market Trends
 Table 140. Temporary Wafer Bonding Materials Market Drivers
 Table 141. Temporary Wafer Bonding Materials Market Challenges
 Table 142. Temporary Wafer Bonding Materials Market Restraints
 Table 143. Research Programs/Design for This Report
 Table 144. Key Data Information from Secondary Sources
 Table 145. Key Data Information from Primary Sources
 Table 146. Authors List of This Report


List of Figures
 Figure 1. Product Picture of Temporary Wafer Bonding Materials
 Figure 2. Global Temporary Wafer Bonding Materials Market Value by Type, (US$ Million) & (2020-2031)
 Figure 3. Global Temporary Wafer Bonding Materials Market Share by Type: 2024 VS 2031
 Figure 4. Thermal Slide Debonding Product Picture
 Figure 5. Mechanical Peeling Product Picture
 Figure 6. Laser Ablation Product Picture
 Figure 7. Chemical Dissolution Product Picture
 Figure 8. Global Temporary Wafer Bonding Materials Market Value by Application, (US$ Million) & (2020-2031)
 Figure 9. Global Temporary Wafer Bonding Materials Market Share by Application: 2024 VS 2031
 Figure 10. Advanced Packaging
 Figure 11. MEMS
 Figure 12. CIS
 Figure 13. Others
 Figure 14. Global Temporary Wafer Bonding Materials Production Value (US$ Million), 2020 VS 2024 VS 2031
 Figure 15. Global Temporary Wafer Bonding Materials Production Value (US$ Million) & (2020-2031)
 Figure 16. Global Temporary Wafer Bonding Materials Production Capacity (Tons) & (2020-2031)
 Figure 17. Global Temporary Wafer Bonding Materials Production (Tons) & (2020-2031)
 Figure 18. Global Temporary Wafer Bonding Materials Average Price (US$/kg) & (2020-2031)
 Figure 19. Temporary Wafer Bonding Materials Report Years Considered
 Figure 20. Temporary Wafer Bonding Materials Production Share by Manufacturers in 2024
 Figure 21. Global Temporary Wafer Bonding Materials Production Value Share by Manufacturers (2024)
 Figure 22. Temporary Wafer Bonding Materials Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
 Figure 23. The Global 5 and 10 Largest Players: Market Share by Temporary Wafer Bonding Materials Revenue in 2024
 Figure 24. Global Temporary Wafer Bonding Materials Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Figure 25. Global Temporary Wafer Bonding Materials Production Value Market Share by Region: 2020 VS 2024 VS 2031
 Figure 26. Global Temporary Wafer Bonding Materials Production Comparison by Region: 2020 VS 2024 VS 2031 (Tons)
 Figure 27. Global Temporary Wafer Bonding Materials Production Market Share by Region: 2020 VS 2024 VS 2031
 Figure 28. North America Temporary Wafer Bonding Materials Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 29. Europe Temporary Wafer Bonding Materials Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 30. China Temporary Wafer Bonding Materials Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 31. Japan Temporary Wafer Bonding Materials Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 32. Global Temporary Wafer Bonding Materials Consumption by Region: 2020 VS 2024 VS 2031 (Tons)
 Figure 33. Global Temporary Wafer Bonding Materials Consumption Market Share by Region: 2020 VS 2024 VS 2031
 Figure 34. North America Temporary Wafer Bonding Materials Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 35. North America Temporary Wafer Bonding Materials Consumption Market Share by Country (2020-2031)
 Figure 36. U.S. Temporary Wafer Bonding Materials Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 37. Canada Temporary Wafer Bonding Materials Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 38. Europe Temporary Wafer Bonding Materials Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 39. Europe Temporary Wafer Bonding Materials Consumption Market Share by Country (2020-2031)
 Figure 40. Germany Temporary Wafer Bonding Materials Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 41. France Temporary Wafer Bonding Materials Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 42. U.K. Temporary Wafer Bonding Materials Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 43. Italy Temporary Wafer Bonding Materials Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 44. Russia Temporary Wafer Bonding Materials Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 45. Asia Pacific Temporary Wafer Bonding Materials Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 46. Asia Pacific Temporary Wafer Bonding Materials Consumption Market Share by Region (2020-2031)
 Figure 47. China Temporary Wafer Bonding Materials Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 48. Japan Temporary Wafer Bonding Materials Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 49. South Korea Temporary Wafer Bonding Materials Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 50. China Taiwan Temporary Wafer Bonding Materials Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 51. Southeast Asia Temporary Wafer Bonding Materials Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 52. India Temporary Wafer Bonding Materials Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 53. Latin America, Middle East & Africa Temporary Wafer Bonding Materials Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 54. Latin America, Middle East & Africa Temporary Wafer Bonding Materials Consumption Market Share by Country (2020-2031)
 Figure 55. Mexico Temporary Wafer Bonding Materials Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 56. Brazil Temporary Wafer Bonding Materials Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 57. Turkey Temporary Wafer Bonding Materials Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 58. GCC Countries Temporary Wafer Bonding Materials Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 59. Global Production Market Share of Temporary Wafer Bonding Materials by Type (2020-2031)
 Figure 60. Global Production Value Market Share of Temporary Wafer Bonding Materials by Type (2020-2031)
 Figure 61. Global Temporary Wafer Bonding Materials Price (US$/kg) by Type (2020-2031)
 Figure 62. Global Production Market Share of Temporary Wafer Bonding Materials by Application (2020-2031)
 Figure 63. Global Production Value Market Share of Temporary Wafer Bonding Materials by Application (2020-2031)
 Figure 64. Global Temporary Wafer Bonding Materials Price (US$/kg) by Application (2020-2031)
 Figure 65. Temporary Wafer Bonding Materials Value Chain
 Figure 66. Channels of Distribution (Direct Vs Distribution)
 Figure 67. Bottom-up and Top-down Approaches for This Report
 Figure 68. Data Triangulation

Description

The global market for Temporary Wafer Bonding Materials was valued at US$ 261 million in the year 2024 and is projected to reach a revised size of US$ 388 million by 2031, growing at a CAGR of 5.5% during the forecast period.

The 2025 U.S. tariff policies introduce profound uncertainty into the global economic landscape. This report critically examines the implications of recent tariff adjustments and international strategic countermeasures on Temporary Wafer Bonding Materials competitive dynamics, regional economic interdependencies, and supply chain reconfigurations.
Temporary wafer bonding materials play a critical role in semiconductor manufacturing. They provide rigid support for ultra-thin wafers during the backside processing, ensuring the wafers can withstand complex back-end processing operations. These materials are characterized by excellent removability and thermal stability, making them suitable for high-temperature and chemical environments. They are widely used in 3D packaging, MEMS device manufacturing, and the production of high-performance semiconductor devices. By employing temporary bonding, wafer thinning and subsequent processes can be performed while preventing damage and deformation of the wafers during handling.

The market for temporary wafer bonding materials is currently in a critical phase of continuous technological evolution. These materials are widely used in advanced packaging and 3D integration processes in semiconductor manufacturing, primarily aiming to support non-destructive bonding and debonding of ultra-thin wafers. The mainstream materials in the market include inorganic substances (e.g., hydrogenated amorphous silicon) and various polymers (e.g., polyimide, PEEK, and PDMS). Their application often corresponds to specific debonding techniques, such as thermal slide debonding, solvent-based debonding, mechanical debonding, and laser debonding, with the maturity and adaptability of these techniques influencing market performance.

In the future, the development of temporary wafer bonding materials will focus on more efficient and lower-damage debonding processes. For instance, improvements in the precision and speed of laser debonding and air-jetting technologies are expected to drive market growth significantly. Additionally, with ongoing innovations in new electronic devices and semiconductor technologies, the demand for higher-performance and more stable temporary bonding materials will continue to rise. Moreover, the push for sustainable development is driving the industry towards environmentally friendly and recyclable materials, which will inject new vitality into the market.

The key drivers for market growth include the increasing demand for advanced packaging technologies in the semiconductor industry and breakthroughs in materials science. However, there are notable barriers, such as the high cost of developing high-performance materials, mismatches between debonding techniques and equipment, and the challenges of promoting emerging technical standards. Furthermore, technical barriers and intellectual property issues among manufacturers limit further integration and development in the industry.

Report Scope
This report aims to provide a comprehensive presentation of the global market for Temporary Wafer Bonding Materials, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Temporary Wafer Bonding Materials.

The Temporary Wafer Bonding Materials market size, estimations, and forecasts are provided in terms of output/shipments (Tons) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Temporary Wafer Bonding Materials market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Temporary Wafer Bonding Materials manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Temporary Wafer Bonding Materials manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Temporary Wafer Bonding Materials by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Temporary Wafer Bonding Materials in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

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Global Temporary Wafer Bonding Materials Market Research Report 2025

Industry: Chemical & Material

Published: 2025-04-30

Pages: 97 Pages

Report ld: 3570385

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