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Home > Reports > Chemical & Material > Temporary Wafer Bonding Materials- Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031

Temporary Wafer Bonding Materials- Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031

Temporary Wafer Bonding Materials- Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031

Industry: Chemical & Material

Published: 2025-02-15

Pages: 111 Pages

Report ld: 3570383

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Description

The global market for Temporary Wafer Bonding Materials was estimated to be worth US$ 118 million in 2024 and is forecast to a readjusted size of US$ 179 million by 2031 with a CAGR of 6.3% during the forecast period 2025-2031.

Temporary wafer bonding materials play a critical role in semiconductor manufacturing. They provide rigid support for ultra-thin wafers during the backside processing, ensuring the wafers can withstand complex back-end processing operations. These materials are characterized by excellent removability and thermal stability, making them suitable for high-temperature and chemical environments. They are widely used in 3D packaging, MEMS device manufacturing, and the production of high-performance semiconductor devices. By employing temporary bonding, wafer thinning and subsequent processes can be performed while preventing damage and deformation of the wafers during handling.

Temporary Wafer Bonding Materials Market Size(US$)

M= millions and B=billions

QYRLogo
The market for temporary wafer bonding materials is currently in a critical phase of continuous technological evolution. These materials are widely used in advanced packaging and 3D integration processes in semiconductor manufacturing, primarily aiming to support non-destructive bonding and debonding of ultra-thin wafers. The mainstream materials in the market include inorganic substances (e.g., hydrogenated amorphous silicon) and various polymers (e.g., polyimide, PEEK, and PDMS). Their application often corresponds to specific debonding techniques, such as thermal slide debonding, solvent-based debonding, mechanical debonding, and laser debonding, with the maturity and adaptability of these techniques influencing market performance.

In the future, the development of temporary wafer bonding materials will focus on more efficient and lower-damage debonding processes. For instance, improvements in the precision and speed of laser debonding and air-jetting technologies are expected to drive market growth significantly. Additionally, with ongoing innovations in new electronic devices and semiconductor technologies, the demand for higher-performance and more stable temporary bonding materials will continue to rise. Moreover, the push for sustainable development is driving the industry towards environmentally friendly and recyclable materials, which will inject new vitality into the market.

The key drivers for market growth include the increasing demand for advanced packaging technologies in the semiconductor industry and breakthroughs in materials science. However, there are notable barriers, such as the high cost of developing high-performance materials, mismatches between debonding techniques and equipment, and the challenges of promoting emerging technical standards. Furthermore, technical barriers and intellectual property issues among manufacturers limit further integration and development in the industry.

This report aims to provide a comprehensive presentation of the global market for Temporary Wafer Bonding Materials, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Temporary Wafer Bonding Materials by region & country, by Type, and by Application.

The Temporary Wafer Bonding Materials market size, estimations, and forecasts are provided in terms of sales volume (Tons) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Temporary Wafer Bonding Materials.

Market Segmentation

  • Report Metric

  • Details

  • Report Title

  • Temporary Wafer Bonding Materials- Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031

  • Forecasted Market Size in 2031

  • US$ 179 million

  • CAGR(2025-2031)

  • 6.3%

  • Market Size Available for Years

  • 2025-2031

  • Global Temporary Wafer Bonding Materials Companies Covered

  • 3M

    Nikka Seiko

    Brewer Science

    Sekisui Chemical

    Tokyo Ohka Kogyo

    AI Technology

    YINCAE Advanced Materials

    Valtech Corporation

    HD MicroSystems

    Samcien Semiconductor Materials

    Hubei Dinglong

    PhiChem Corporation

  • Global Temporary Wafer Bonding Materials Market, by Region

  • North America (U.S., Canada, Mexico)

    Europe (Germany, France, UK, Italy, etc.)

    Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)

    South America (Brazil, etc.)

    Middle East and Africa (Turkey, GCC Countries, Africa, etc.)

  • Global Temporary Wafer Bonding Materials Market, Segment by Type

  • Thermal Slide Debonding

    Mechanical Peeling

    Laser Ablation

    Chemical Dissolution

  • Global Temporary Wafer Bonding Materials Market, Segment by Application

  • Advanced Packaging

    MEMS

    CIS

    Others

  • Forecast Units

  • USD million in value

  • Report Coverage

  • Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Temporary Wafer Bonding Materials manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Temporary Wafer Bonding Materials in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Temporary Wafer Bonding Materials in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

Table of Contents

1 Market Overview
    1.1 Temporary Wafer Bonding Materials Product Introduction
    1.2 Global Temporary Wafer Bonding Materials Market Size Forecast
        1.2.1 Global Temporary Wafer Bonding Materials Sales Value (2020-2031)
        1.2.2 Global Temporary Wafer Bonding Materials Sales Volume (2020-2031)
        1.2.3 Global Temporary Wafer Bonding Materials Sales Price (2020-2031)
    1.3 Temporary Wafer Bonding Materials Market Trends & Drivers
        1.3.1 Temporary Wafer Bonding Materials Industry Trends
        1.3.2 Temporary Wafer Bonding Materials Market Drivers & Opportunity
        1.3.3 Temporary Wafer Bonding Materials Market Challenges
        1.3.4 Temporary Wafer Bonding Materials Market Restraints
    1.4 Assumptions and Limitations
    1.5 Study Objectives
    1.6 Years Considered
2 Competitive Analysis by Company
    2.1 Global Temporary Wafer Bonding Materials Players Revenue Ranking (2024)
    2.2 Global Temporary Wafer Bonding Materials Revenue by Company (2020-2025)
    2.3 Global Temporary Wafer Bonding Materials Players Sales Volume Ranking (2024)
    2.4 Global Temporary Wafer Bonding Materials Sales Volume by Company Players (2020-2025)
    2.5 Global Temporary Wafer Bonding Materials Average Price by Company (2020-2025)
    2.6 Key Manufacturers Temporary Wafer Bonding Materials Manufacturing Base and Headquarters
    2.7 Key Manufacturers Temporary Wafer Bonding Materials Product Offered
    2.8 Key Manufacturers Time to Begin Mass Production of Temporary Wafer Bonding Materials
    2.9 Temporary Wafer Bonding Materials Market Competitive Analysis
        2.9.1 Temporary Wafer Bonding Materials Market Concentration Rate (2020-2025)
        2.9.2 Global 5 and 10 Largest Manufacturers by Temporary Wafer Bonding Materials Revenue in 2024
        2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Temporary Wafer Bonding Materials as of 2024)
    2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
    3.1 Introduction by Type
        3.1.1 Thermal Slide Debonding
        3.1.2 Mechanical Peeling
        3.1.3 Laser Ablation
        3.1.4 Chemical Dissolution
    3.2 Global Temporary Wafer Bonding Materials Sales Value by Type
        3.2.1 Global Temporary Wafer Bonding Materials Sales Value by Type (2020 VS 2024 VS 2031)
        3.2.2 Global Temporary Wafer Bonding Materials Sales Value, by Type (2020-2031)
        3.2.3 Global Temporary Wafer Bonding Materials Sales Value, by Type (%) (2020-2031)
    3.3 Global Temporary Wafer Bonding Materials Sales Volume by Type
        3.3.1 Global Temporary Wafer Bonding Materials Sales Volume by Type (2020 VS 2024 VS 2031)
        3.3.2 Global Temporary Wafer Bonding Materials Sales Volume, by Type (2020-2031)
        3.3.3 Global Temporary Wafer Bonding Materials Sales Volume, by Type (%) (2020-2031)
    3.4 Global Temporary Wafer Bonding Materials Average Price by Type (2020-2031)
4 Segmentation by Application
    4.1 Introduction by Application
        4.1.1 Advanced Packaging
        4.1.2 MEMS
        4.1.3 CIS
        4.1.4 Others
    4.2 Global Temporary Wafer Bonding Materials Sales Value by Application
        4.2.1 Global Temporary Wafer Bonding Materials Sales Value by Application (2020 VS 2024 VS 2031)
        4.2.2 Global Temporary Wafer Bonding Materials Sales Value, by Application (2020-2031)
        4.2.3 Global Temporary Wafer Bonding Materials Sales Value, by Application (%) (2020-2031)
    4.3 Global Temporary Wafer Bonding Materials Sales Volume by Application
        4.3.1 Global Temporary Wafer Bonding Materials Sales Volume by Application (2020 VS 2024 VS 2031)
        4.3.2 Global Temporary Wafer Bonding Materials Sales Volume, by Application (2020-2031)
        4.3.3 Global Temporary Wafer Bonding Materials Sales Volume, by Application (%) (2020-2031)
    4.4 Global Temporary Wafer Bonding Materials Average Price by Application (2020-2031)
5 Segmentation by Region
    5.1 Global Temporary Wafer Bonding Materials Sales Value by Region
        5.1.1 Global Temporary Wafer Bonding Materials Sales Value by Region: 2020 VS 2024 VS 2031
        5.1.2 Global Temporary Wafer Bonding Materials Sales Value by Region (2020-2025)
        5.1.3 Global Temporary Wafer Bonding Materials Sales Value by Region (2026-2031)
        5.1.4 Global Temporary Wafer Bonding Materials Sales Value by Region (%), (2020-2031)
    5.2 Global Temporary Wafer Bonding Materials Sales Volume by Region
        5.2.1 Global Temporary Wafer Bonding Materials Sales Volume by Region: 2020 VS 2024 VS 2031
        5.2.2 Global Temporary Wafer Bonding Materials Sales Volume by Region (2020-2025)
        5.2.3 Global Temporary Wafer Bonding Materials Sales Volume by Region (2026-2031)
        5.2.4 Global Temporary Wafer Bonding Materials Sales Volume by Region (%), (2020-2031)
    5.3 Global Temporary Wafer Bonding Materials Average Price by Region (2020-2031)
    5.4 North America
        5.4.1 North America Temporary Wafer Bonding Materials Sales Value, 2020-2031
        5.4.2 North America Temporary Wafer Bonding Materials Sales Value by Country (%), 2024 VS 2031
    5.5 Europe
        5.5.1 Europe Temporary Wafer Bonding Materials Sales Value, 2020-2031
        5.5.2 Europe Temporary Wafer Bonding Materials Sales Value by Country (%), 2024 VS 2031
    5.6 Asia Pacific
        5.6.1 Asia Pacific Temporary Wafer Bonding Materials Sales Value, 2020-2031
        5.6.2 Asia Pacific Temporary Wafer Bonding Materials Sales Value by Region (%), 2024 VS 2031
    5.7 South America
        5.7.1 South America Temporary Wafer Bonding Materials Sales Value, 2020-2031
        5.7.2 South America Temporary Wafer Bonding Materials Sales Value by Country (%), 2024 VS 2031
    5.8 Middle East & Africa
        5.8.1 Middle East & Africa Temporary Wafer Bonding Materials Sales Value, 2020-2031
        5.8.2 Middle East & Africa Temporary Wafer Bonding Materials Sales Value by Country (%), 2024 VS 2031
6 Segmentation by Key Countries/Regions
    6.1 Key Countries/Regions Temporary Wafer Bonding Materials Sales Value Growth Trends, 2020 VS 2024 VS 2031
    6.2 Key Countries/Regions Temporary Wafer Bonding Materials Sales Value and Sales Volume
        6.2.1 Key Countries/Regions Temporary Wafer Bonding Materials Sales Value, 2020-2031
        6.2.2 Key Countries/Regions Temporary Wafer Bonding Materials Sales Volume, 2020-2031
    6.3 United States
        6.3.1 United States Temporary Wafer Bonding Materials Sales Value, 2020-2031
        6.3.2 United States Temporary Wafer Bonding Materials Sales Value by Type (%), 2024 VS 2031
        6.3.3 United States Temporary Wafer Bonding Materials Sales Value by Application, 2024 VS 2031
    6.4 Europe
        6.4.1 Europe Temporary Wafer Bonding Materials Sales Value, 2020-2031
        6.4.2 Europe Temporary Wafer Bonding Materials Sales Value by Type (%), 2024 VS 2031
        6.4.3 Europe Temporary Wafer Bonding Materials Sales Value by Application, 2024 VS 2031
    6.5 China
        6.5.1 China Temporary Wafer Bonding Materials Sales Value, 2020-2031
        6.5.2 China Temporary Wafer Bonding Materials Sales Value by Type (%), 2024 VS 2031
        6.5.3 China Temporary Wafer Bonding Materials Sales Value by Application, 2024 VS 2031
    6.6 Japan
        6.6.1 Japan Temporary Wafer Bonding Materials Sales Value, 2020-2031
        6.6.2 Japan Temporary Wafer Bonding Materials Sales Value by Type (%), 2024 VS 2031
        6.6.3 Japan Temporary Wafer Bonding Materials Sales Value by Application, 2024 VS 2031
    6.7 South Korea
        6.7.1 South Korea Temporary Wafer Bonding Materials Sales Value, 2020-2031
        6.7.2 South Korea Temporary Wafer Bonding Materials Sales Value by Type (%), 2024 VS 2031
        6.7.3 South Korea Temporary Wafer Bonding Materials Sales Value by Application, 2024 VS 2031
    6.8 Southeast Asia
        6.8.1 Southeast Asia Temporary Wafer Bonding Materials Sales Value, 2020-2031
        6.8.2 Southeast Asia Temporary Wafer Bonding Materials Sales Value by Type (%), 2024 VS 2031
        6.8.3 Southeast Asia Temporary Wafer Bonding Materials Sales Value by Application, 2024 VS 2031
    6.9 India
        6.9.1 India Temporary Wafer Bonding Materials Sales Value, 2020-2031
        6.9.2 India Temporary Wafer Bonding Materials Sales Value by Type (%), 2024 VS 2031
        6.9.3 India Temporary Wafer Bonding Materials Sales Value by Application, 2024 VS 2031
7 Company Profiles
    7.1 3M
        7.1.1 3M Company Information
        7.1.2 3M Introduction and Business Overview
        7.1.3 3M Temporary Wafer Bonding Materials Sales, Revenue, Price and Gross Margin (2020-2025)
        7.1.4 3M Temporary Wafer Bonding Materials Product Offerings
        7.1.5 3M Recent Development
    7.2 Nikka Seiko
        7.2.1 Nikka Seiko Company Information
        7.2.2 Nikka Seiko Introduction and Business Overview
        7.2.3 Nikka Seiko Temporary Wafer Bonding Materials Sales, Revenue, Price and Gross Margin (2020-2025)
        7.2.4 Nikka Seiko Temporary Wafer Bonding Materials Product Offerings
        7.2.5 Nikka Seiko Recent Development
    7.3 Brewer Science
        7.3.1 Brewer Science Company Information
        7.3.2 Brewer Science Introduction and Business Overview
        7.3.3 Brewer Science Temporary Wafer Bonding Materials Sales, Revenue, Price and Gross Margin (2020-2025)
        7.3.4 Brewer Science Temporary Wafer Bonding Materials Product Offerings
        7.3.5 Brewer Science Recent Development
    7.4 Sekisui Chemical
        7.4.1 Sekisui Chemical Company Information
        7.4.2 Sekisui Chemical Introduction and Business Overview
        7.4.3 Sekisui Chemical Temporary Wafer Bonding Materials Sales, Revenue, Price and Gross Margin (2020-2025)
        7.4.4 Sekisui Chemical Temporary Wafer Bonding Materials Product Offerings
        7.4.5 Sekisui Chemical Recent Development
    7.5 Tokyo Ohka Kogyo
        7.5.1 Tokyo Ohka Kogyo Company Information
        7.5.2 Tokyo Ohka Kogyo Introduction and Business Overview
        7.5.3 Tokyo Ohka Kogyo Temporary Wafer Bonding Materials Sales, Revenue, Price and Gross Margin (2020-2025)
        7.5.4 Tokyo Ohka Kogyo Temporary Wafer Bonding Materials Product Offerings
        7.5.5 Tokyo Ohka Kogyo Recent Development
    7.6 AI Technology
        7.6.1 AI Technology Company Information
        7.6.2 AI Technology Introduction and Business Overview
        7.6.3 AI Technology Temporary Wafer Bonding Materials Sales, Revenue, Price and Gross Margin (2020-2025)
        7.6.4 AI Technology Temporary Wafer Bonding Materials Product Offerings
        7.6.5 AI Technology Recent Development
    7.7 YINCAE Advanced Materials
        7.7.1 YINCAE Advanced Materials Company Information
        7.7.2 YINCAE Advanced Materials Introduction and Business Overview
        7.7.3 YINCAE Advanced Materials Temporary Wafer Bonding Materials Sales, Revenue, Price and Gross Margin (2020-2025)
        7.7.4 YINCAE Advanced Materials Temporary Wafer Bonding Materials Product Offerings
        7.7.5 YINCAE Advanced Materials Recent Development
    7.8 Valtech Corporation
        7.8.1 Valtech Corporation Company Information
        7.8.2 Valtech Corporation Introduction and Business Overview
        7.8.3 Valtech Corporation Temporary Wafer Bonding Materials Sales, Revenue, Price and Gross Margin (2020-2025)
        7.8.4 Valtech Corporation Temporary Wafer Bonding Materials Product Offerings
        7.8.5 Valtech Corporation Recent Development
    7.9 HD MicroSystems
        7.9.1 HD MicroSystems Company Information
        7.9.2 HD MicroSystems Introduction and Business Overview
        7.9.3 HD MicroSystems Temporary Wafer Bonding Materials Sales, Revenue, Price and Gross Margin (2020-2025)
        7.9.4 HD MicroSystems Temporary Wafer Bonding Materials Product Offerings
        7.9.5 HD MicroSystems Recent Development
    7.10 Samcien Semiconductor Materials
        7.10.1 Samcien Semiconductor Materials Company Information
        7.10.2 Samcien Semiconductor Materials Introduction and Business Overview
        7.10.3 Samcien Semiconductor Materials Temporary Wafer Bonding Materials Sales, Revenue, Price and Gross Margin (2020-2025)
        7.10.4 Samcien Semiconductor Materials Temporary Wafer Bonding Materials Product Offerings
        7.10.5 Samcien Semiconductor Materials Recent Development
    7.11 Hubei Dinglong
        7.11.1 Hubei Dinglong Company Information
        7.11.2 Hubei Dinglong Introduction and Business Overview
        7.11.3 Hubei Dinglong Temporary Wafer Bonding Materials Sales, Revenue, Price and Gross Margin (2020-2025)
        7.11.4 Hubei Dinglong Temporary Wafer Bonding Materials Product Offerings
        7.11.5 Hubei Dinglong Recent Development
    7.12 PhiChem Corporation
        7.12.1 PhiChem Corporation Company Information
        7.12.2 PhiChem Corporation Introduction and Business Overview
        7.12.3 PhiChem Corporation Temporary Wafer Bonding Materials Sales, Revenue, Price and Gross Margin (2020-2025)
        7.12.4 PhiChem Corporation Temporary Wafer Bonding Materials Product Offerings
        7.12.5 PhiChem Corporation Recent Development
8 Industry Chain Analysis
    8.1 Temporary Wafer Bonding Materials Industrial Chain
    8.2 Temporary Wafer Bonding Materials Upstream Analysis
        8.2.1 Key Raw Materials
        8.2.2 Raw Materials Key Suppliers
        8.2.3 Manufacturing Cost Structure
    8.3 Midstream Analysis
    8.4 Downstream Analysis (Customers Analysis)
    8.5 Sales Model and Sales Channels
        8.5.1 Temporary Wafer Bonding Materials Sales Model
        8.5.2 Sales Channel
        8.5.3 Temporary Wafer Bonding Materials Distributors
9 Research Findings and Conclusion
10 Appendix
    10.1 Research Methodology
        10.1.1 Methodology/Research Approach
            10.1.1.1 Research Programs/Design
            10.1.1.2 Market Size Estimation
            10.1.1.3 Market Breakdown and Data Triangulation
        10.1.2 Data Source
            10.1.2.1 Secondary Sources
            10.1.2.2 Primary Sources
    10.2 Author Details
    10.3 Disclaimer

Table of Figures

List of Tables
 Table 1. Temporary Wafer Bonding Materials Market Trends
 Table 2. Temporary Wafer Bonding Materials Market Drivers & Opportunity
 Table 3. Temporary Wafer Bonding Materials Market Challenges
 Table 4. Temporary Wafer Bonding Materials Market Restraints
 Table 5. Global Temporary Wafer Bonding Materials Revenue by Company (2020-2025) & (US$ Million)
 Table 6. Global Temporary Wafer Bonding Materials Revenue Market Share by Company (2020-2025)
 Table 7. Global Temporary Wafer Bonding Materials Sales Volume by Company (2020-2025) & (Tons)
 Table 8. Global Temporary Wafer Bonding Materials Sales Volume Market Share by Company (2020-2025)
 Table 9. Global Market Temporary Wafer Bonding Materials Price by Company (2020-2025) & (US$/kg)
 Table 10. Key Manufacturers Temporary Wafer Bonding Materials Manufacturing Base and Headquarters
 Table 11. Key Manufacturers Temporary Wafer Bonding Materials Product Type
 Table 12. Key Manufacturers Time to Begin Mass Production of Temporary Wafer Bonding Materials
 Table 13. Global Temporary Wafer Bonding Materials Manufacturers Market Concentration Ratio (CR5 and HHI)
 Table 14. Global Top Manufacturers Market Share by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Temporary Wafer Bonding Materials as of 2024)
 Table 15. Mergers & Acquisitions, Expansion Plans
 Table 16. Global Temporary Wafer Bonding Materials Sales Value by Type: 2020 VS 2024 VS 2031 (US$ Million)
 Table 17. Global Temporary Wafer Bonding Materials Sales Value by Type (2020-2025) & (US$ Million)
 Table 18. Global Temporary Wafer Bonding Materials Sales Value by Type (2026-2031) & (US$ Million)
 Table 19. Global Temporary Wafer Bonding Materials Sales Market Share in Value by Type (2020-2025)
 Table 20. Global Temporary Wafer Bonding Materials Sales Market Share in Value by Type (2026-2031)
 Table 21. Global Temporary Wafer Bonding Materials Sales Volume by Type: 2020 VS 2024 VS 2031 (Tons)
 Table 22. Global Temporary Wafer Bonding Materials Sales Volume by Type (2020-2025) & (Tons)
 Table 23. Global Temporary Wafer Bonding Materials Sales Volume by Type (2026-2031) & (Tons)
 Table 24. Global Temporary Wafer Bonding Materials Sales Volume Market Share by Type (2020-2025)
 Table 25. Global Temporary Wafer Bonding Materials Sales Volume Market Share by Type (2026-2031)
 Table 26. Global Temporary Wafer Bonding Materials Price by Type (2020-2025) & (US$/kg)
 Table 27. Global Temporary Wafer Bonding Materials Price by Type (2026-2031) & (US$/kg)
 Table 28. Global Temporary Wafer Bonding Materials Sales Value by Application: 2020 VS 2024 VS 2031 (US$ Million)
 Table 29. Global Temporary Wafer Bonding Materials Sales Value by Application (2020-2025) & (US$ Million)
 Table 30. Global Temporary Wafer Bonding Materials Sales Value by Application (2026-2031) & (US$ Million)
 Table 31. Global Temporary Wafer Bonding Materials Sales Market Share in Value by Application (2020-2025)
 Table 32. Global Temporary Wafer Bonding Materials Sales Market Share in Value by Application (2026-2031)
 Table 33. Global Temporary Wafer Bonding Materials Sales Volume by Application: 2020 VS 2024 VS 2031 (Tons)
 Table 34. Global Temporary Wafer Bonding Materials Sales Volume by Application (2020-2025) & (Tons)
 Table 35. Global Temporary Wafer Bonding Materials Sales Volume by Application (2026-2031) & (Tons)
 Table 36. Global Temporary Wafer Bonding Materials Sales Volume Market Share by Application (2020-2025)
 Table 37. Global Temporary Wafer Bonding Materials Sales Volume Market Share by Application (2026-2031)
 Table 38. Global Temporary Wafer Bonding Materials Price by Application (2020-2025) & (US$/kg)
 Table 39. Global Temporary Wafer Bonding Materials Price by Application (2026-2031) & (US$/kg)
 Table 40. Global Temporary Wafer Bonding Materials Sales Value by Region, (2020 VS 2024 VS 2031) & (US$ Million)
 Table 41. Global Temporary Wafer Bonding Materials Sales Value by Region (2020-2025) & (US$ Million)
 Table 42. Global Temporary Wafer Bonding Materials Sales Value by Region (2026-2031) & (US$ Million)
 Table 43. Global Temporary Wafer Bonding Materials Sales Value by Region (2020-2025) & (%)
 Table 44. Global Temporary Wafer Bonding Materials Sales Value by Region (2026-2031) & (%)
 Table 45. Global Temporary Wafer Bonding Materials Sales Volume by Region (Tons): 2020 VS 2024 VS 2031
 Table 46. Global Temporary Wafer Bonding Materials Sales Volume by Region (2020-2025) & (Tons)
 Table 47. Global Temporary Wafer Bonding Materials Sales Volume by Region (2026-2031) & (Tons)
 Table 48. Global Temporary Wafer Bonding Materials Sales Volume by Region (2020-2025) & (%)
 Table 49. Global Temporary Wafer Bonding Materials Sales Volume by Region (2026-2031) & (%)
 Table 50. Global Temporary Wafer Bonding Materials Average Price by Region (2020-2025) & (US$/kg)
 Table 51. Global Temporary Wafer Bonding Materials Average Price by Region (2026-2031) & (US$/kg)
 Table 52. Key Countries/Regions Temporary Wafer Bonding Materials Sales Value Growth Trends, (US$ Million): 2020 VS 2024 VS 2031
 Table 53. Key Countries/Regions Temporary Wafer Bonding Materials Sales Value, (2020-2025) & (US$ Million)
 Table 54. Key Countries/Regions Temporary Wafer Bonding Materials Sales Value, (2026-2031) & (US$ Million)
 Table 55. Key Countries/Regions Temporary Wafer Bonding Materials Sales Volume, (2020-2025) & (Tons)
 Table 56. Key Countries/Regions Temporary Wafer Bonding Materials Sales Volume, (2026-2031) & (Tons)
 Table 57. 3M Company Information
 Table 58. 3M Introduction and Business Overview
 Table 59. 3M Temporary Wafer Bonding Materials Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
 Table 60. 3M Temporary Wafer Bonding Materials Product Offerings
 Table 61. 3M Recent Development
 Table 62. Nikka Seiko Company Information
 Table 63. Nikka Seiko Introduction and Business Overview
 Table 64. Nikka Seiko Temporary Wafer Bonding Materials Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
 Table 65. Nikka Seiko Temporary Wafer Bonding Materials Product Offerings
 Table 66. Nikka Seiko Recent Development
 Table 67. Brewer Science Company Information
 Table 68. Brewer Science Introduction and Business Overview
 Table 69. Brewer Science Temporary Wafer Bonding Materials Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
 Table 70. Brewer Science Temporary Wafer Bonding Materials Product Offerings
 Table 71. Brewer Science Recent Development
 Table 72. Sekisui Chemical Company Information
 Table 73. Sekisui Chemical Introduction and Business Overview
 Table 74. Sekisui Chemical Temporary Wafer Bonding Materials Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
 Table 75. Sekisui Chemical Temporary Wafer Bonding Materials Product Offerings
 Table 76. Sekisui Chemical Recent Development
 Table 77. Tokyo Ohka Kogyo Company Information
 Table 78. Tokyo Ohka Kogyo Introduction and Business Overview
 Table 79. Tokyo Ohka Kogyo Temporary Wafer Bonding Materials Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
 Table 80. Tokyo Ohka Kogyo Temporary Wafer Bonding Materials Product Offerings
 Table 81. Tokyo Ohka Kogyo Recent Development
 Table 82. AI Technology Company Information
 Table 83. AI Technology Introduction and Business Overview
 Table 84. AI Technology Temporary Wafer Bonding Materials Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
 Table 85. AI Technology Temporary Wafer Bonding Materials Product Offerings
 Table 86. AI Technology Recent Development
 Table 87. YINCAE Advanced Materials Company Information
 Table 88. YINCAE Advanced Materials Introduction and Business Overview
 Table 89. YINCAE Advanced Materials Temporary Wafer Bonding Materials Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
 Table 90. YINCAE Advanced Materials Temporary Wafer Bonding Materials Product Offerings
 Table 91. YINCAE Advanced Materials Recent Development
 Table 92. Valtech Corporation Company Information
 Table 93. Valtech Corporation Introduction and Business Overview
 Table 94. Valtech Corporation Temporary Wafer Bonding Materials Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
 Table 95. Valtech Corporation Temporary Wafer Bonding Materials Product Offerings
 Table 96. Valtech Corporation Recent Development
 Table 97. HD MicroSystems Company Information
 Table 98. HD MicroSystems Introduction and Business Overview
 Table 99. HD MicroSystems Temporary Wafer Bonding Materials Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
 Table 100. HD MicroSystems Temporary Wafer Bonding Materials Product Offerings
 Table 101. HD MicroSystems Recent Development
 Table 102. Samcien Semiconductor Materials Company Information
 Table 103. Samcien Semiconductor Materials Introduction and Business Overview
 Table 104. Samcien Semiconductor Materials Temporary Wafer Bonding Materials Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
 Table 105. Samcien Semiconductor Materials Temporary Wafer Bonding Materials Product Offerings
 Table 106. Samcien Semiconductor Materials Recent Development
 Table 107. Hubei Dinglong Company Information
 Table 108. Hubei Dinglong Introduction and Business Overview
 Table 109. Hubei Dinglong Temporary Wafer Bonding Materials Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
 Table 110. Hubei Dinglong Temporary Wafer Bonding Materials Product Offerings
 Table 111. Hubei Dinglong Recent Development
 Table 112. PhiChem Corporation Company Information
 Table 113. PhiChem Corporation Introduction and Business Overview
 Table 114. PhiChem Corporation Temporary Wafer Bonding Materials Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
 Table 115. PhiChem Corporation Temporary Wafer Bonding Materials Product Offerings
 Table 116. PhiChem Corporation Recent Development
 Table 117. Key Raw Materials Lists
 Table 118. Raw Materials Key Suppliers Lists
 Table 119. Temporary Wafer Bonding Materials Downstream Customers
 Table 120. Temporary Wafer Bonding Materials Distributors List
 Table 121. Research Programs/Design for This Report
 Table 122. Key Data Information from Secondary Sources
 Table 123. Key Data Information from Primary Sources


List of Figures
 Figure 1. Temporary Wafer Bonding Materials Product Picture
 Figure 2. Global Temporary Wafer Bonding Materials Sales Value, 2020 VS 2024 VS 2031 (US$ Million)
 Figure 3. Global Temporary Wafer Bonding Materials Sales Value (2020-2031) & (US$ Million)
 Figure 4. Global Temporary Wafer Bonding Materials Sales Volume (2020-2031) & (Tons)
 Figure 5. Global Temporary Wafer Bonding Materials Sales Price (2020-2031) & (US$/kg)
 Figure 6. Temporary Wafer Bonding Materials Report Years Considered
 Figure 7. Global Temporary Wafer Bonding Materials Players Revenue Ranking (2024) & (US$ Million)
 Figure 8. Global Temporary Wafer Bonding Materials Players Sales Volume Ranking (2024) & (Tons)
 Figure 9. The 5 and 10 Largest Manufacturers in the World: Market Share by Temporary Wafer Bonding Materials Revenue in 2024
 Figure 10. Temporary Wafer Bonding Materials Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
 Figure 11. Thermal Slide Debonding Picture
 Figure 12. Mechanical Peeling Picture
 Figure 13. Laser Ablation Picture
 Figure 14. Chemical Dissolution Picture
 Figure 15. Global Temporary Wafer Bonding Materials Sales Value by Type (2020 VS 2024 VS 2031) & (US$ Million)
 Figure 16. Global Temporary Wafer Bonding Materials Sales Value Market Share by Type, 2024 & 2031
 Figure 17. Global Temporary Wafer Bonding Materials Sales Volume by Type (2020 VS 2024 VS 2031) & (Tons)
 Figure 18. Global Temporary Wafer Bonding Materials Sales Volume Market Share by Type, 2024 & 2031
 Figure 19. Global Temporary Wafer Bonding Materials Price by Type (2020-2031) & (US$/kg)
 Figure 20. Product Picture of Advanced Packaging
 Figure 21. Product Picture of MEMS
 Figure 22. Product Picture of CIS
 Figure 23. Product Picture of Others
 Figure 24. Global Temporary Wafer Bonding Materials Sales Value by Application (2020 VS 2024 VS 2031) & (US$ Million)
 Figure 25. Global Temporary Wafer Bonding Materials Sales Value Market Share by Application, 2024 & 2031
 Figure 26. Global Temporary Wafer Bonding Materials Sales Volume by Application (2020 VS 2024 VS 2031) & (Tons)
 Figure 27. Global Temporary Wafer Bonding Materials Sales Volume Market Share by Application, 2024 & 2031
 Figure 28. Global Temporary Wafer Bonding Materials Price by Application (2020-2031) & (US$/kg)
 Figure 29. North America Temporary Wafer Bonding Materials Sales Value (2020-2031) & (US$ Million)
 Figure 30. North America Temporary Wafer Bonding Materials Sales Value by Country (%), 2024 VS 2031
 Figure 31. Europe Temporary Wafer Bonding Materials Sales Value, (2020-2031) & (US$ Million)
 Figure 32. Europe Temporary Wafer Bonding Materials Sales Value by Country (%), 2024 VS 2031
 Figure 33. Asia Pacific Temporary Wafer Bonding Materials Sales Value, (2020-2031) & (US$ Million)
 Figure 34. Asia Pacific Temporary Wafer Bonding Materials Sales Value by Region (%), 2024 VS 2031
 Figure 35. South America Temporary Wafer Bonding Materials Sales Value, (2020-2031) & (US$ Million)
 Figure 36. South America Temporary Wafer Bonding Materials Sales Value by Country (%), 2024 VS 2031
 Figure 37. Middle East & Africa Temporary Wafer Bonding Materials Sales Value, (2020-2031) & (US$ Million)
 Figure 38. Middle East & Africa Temporary Wafer Bonding Materials Sales Value by Country (%), 2024 VS 2031
 Figure 39. Key Countries/Regions Temporary Wafer Bonding Materials Sales Value (%), (2020-2031)
 Figure 40. Key Countries/Regions Temporary Wafer Bonding Materials Sales Volume (%), (2020-2031)
 Figure 41. United States Temporary Wafer Bonding Materials Sales Value, (2020-2031) & (US$ Million)
 Figure 42. United States Temporary Wafer Bonding Materials Sales Value by Type (%), 2024 VS 2031
 Figure 43. United States Temporary Wafer Bonding Materials Sales Value by Application (%), 2024 VS 2031
 Figure 44. Europe Temporary Wafer Bonding Materials Sales Value, (2020-2031) & (US$ Million)
 Figure 45. Europe Temporary Wafer Bonding Materials Sales Value by Type (%), 2024 VS 2031
 Figure 46. Europe Temporary Wafer Bonding Materials Sales Value by Application (%), 2024 VS 2031
 Figure 47. China Temporary Wafer Bonding Materials Sales Value, (2020-2031) & (US$ Million)
 Figure 48. China Temporary Wafer Bonding Materials Sales Value by Type (%), 2024 VS 2031
 Figure 49. China Temporary Wafer Bonding Materials Sales Value by Application (%), 2024 VS 2031
 Figure 50. Japan Temporary Wafer Bonding Materials Sales Value, (2020-2031) & (US$ Million)
 Figure 51. Japan Temporary Wafer Bonding Materials Sales Value by Type (%), 2024 VS 2031
 Figure 52. Japan Temporary Wafer Bonding Materials Sales Value by Application (%), 2024 VS 2031
 Figure 53. South Korea Temporary Wafer Bonding Materials Sales Value, (2020-2031) & (US$ Million)
 Figure 54. South Korea Temporary Wafer Bonding Materials Sales Value by Type (%), 2024 VS 2031
 Figure 55. South Korea Temporary Wafer Bonding Materials Sales Value by Application (%), 2024 VS 2031
 Figure 56. Southeast Asia Temporary Wafer Bonding Materials Sales Value, (2020-2031) & (US$ Million)
 Figure 57. Southeast Asia Temporary Wafer Bonding Materials Sales Value by Type (%), 2024 VS 2031
 Figure 58. Southeast Asia Temporary Wafer Bonding Materials Sales Value by Application (%), 2024 VS 2031
 Figure 59. India Temporary Wafer Bonding Materials Sales Value, (2020-2031) & (US$ Million)
 Figure 60. India Temporary Wafer Bonding Materials Sales Value by Type (%), 2024 VS 2031
 Figure 61. India Temporary Wafer Bonding Materials Sales Value by Application (%), 2024 VS 2031
 Figure 62. Temporary Wafer Bonding Materials Industrial Chain
 Figure 63. Temporary Wafer Bonding Materials Manufacturing Cost Structure
 Figure 64. Channels of Distribution (Direct Sales, and Distribution)
 Figure 65. Bottom-up and Top-down Approaches for This Report
 Figure 66. Data Triangulation
 Figure 67. Key Executives Interviewed

Description

The global market for Temporary Wafer Bonding Materials was estimated to be worth US$ 118 million in 2024 and is forecast to a readjusted size of US$ 179 million by 2031 with a CAGR of 6.3% during the forecast period 2025-2031.

Temporary wafer bonding materials play a critical role in semiconductor manufacturing. They provide rigid support for ultra-thin wafers during the backside processing, ensuring the wafers can withstand complex back-end processing operations. These materials are characterized by excellent removability and thermal stability, making them suitable for high-temperature and chemical environments. They are widely used in 3D packaging, MEMS device manufacturing, and the production of high-performance semiconductor devices. By employing temporary bonding, wafer thinning and subsequent processes can be performed while preventing damage and deformation of the wafers during handling.
The market for temporary wafer bonding materials is currently in a critical phase of continuous technological evolution. These materials are widely used in advanced packaging and 3D integration processes in semiconductor manufacturing, primarily aiming to support non-destructive bonding and debonding of ultra-thin wafers. The mainstream materials in the market include inorganic substances (e.g., hydrogenated amorphous silicon) and various polymers (e.g., polyimide, PEEK, and PDMS). Their application often corresponds to specific debonding techniques, such as thermal slide debonding, solvent-based debonding, mechanical debonding, and laser debonding, with the maturity and adaptability of these techniques influencing market performance.

In the future, the development of temporary wafer bonding materials will focus on more efficient and lower-damage debonding processes. For instance, improvements in the precision and speed of laser debonding and air-jetting technologies are expected to drive market growth significantly. Additionally, with ongoing innovations in new electronic devices and semiconductor technologies, the demand for higher-performance and more stable temporary bonding materials will continue to rise. Moreover, the push for sustainable development is driving the industry towards environmentally friendly and recyclable materials, which will inject new vitality into the market.

The key drivers for market growth include the increasing demand for advanced packaging technologies in the semiconductor industry and breakthroughs in materials science. However, there are notable barriers, such as the high cost of developing high-performance materials, mismatches between debonding techniques and equipment, and the challenges of promoting emerging technical standards. Furthermore, technical barriers and intellectual property issues among manufacturers limit further integration and development in the industry.

This report aims to provide a comprehensive presentation of the global market for Temporary Wafer Bonding Materials, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Temporary Wafer Bonding Materials by region & country, by Type, and by Application.

The Temporary Wafer Bonding Materials market size, estimations, and forecasts are provided in terms of sales volume (Tons) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Temporary Wafer Bonding Materials.

Market Segmentation
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Temporary Wafer Bonding Materials manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Temporary Wafer Bonding Materials in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Temporary Wafer Bonding Materials in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

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Temporary Wafer Bonding Materials- Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031

Industry: Chemical & Material

Published: 2025-02-15

Pages: 111 Pages

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