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Part 4
Part 5
Description
Temporary Wafer Bonding Materials provide rigid support for ultra-thin wafers during the backside process, enabling them to complete the complex back-end processing of ultra-thin wafers The global market for Temporary Wafer Bonding Materials was estimated to be worth US$ 1264 million in 2023 and is forecast to a readjusted size of US$ 1936.2 million by 2030 with a CAGR of 6.3% during the forecast period 2024-2030
Temporary Wafer Bonding Materials Market Size(US$)
M= millions and B=billions
The market for temporary wafer bonding materials has been growing steadily in recent years. Temporary wafer bonding is a process used in semiconductor manufacturing and advanced packaging technologies. It involves bonding a device wafer to a carrier wafer using a temporary bonding material. This bonding enables subsequent processing steps such as thinning, 3D integration, and back-end processing.
The demand for temporary wafer bonding materials has been driven by several factors, including:
Advanced Packaging Technologies: Temporary wafer bonding materials play a crucial role in advanced packaging technologies such as 3D integration, stacked die packaging, and system-in-package (SiP) solutions. These technologies require temporary bonding to enable the fabrication of multiple layers or the integration of diverse components into a single package.
Wafer Thinning: Temporary bonding materials are essential for thinning the device wafer to achieve desired thicknesses in processes like wafer thinning for backside illumination (BSI) image sensors or through-silicon via (TSV) fabrication for 3D integration.
Yield Improvement: Temporary wafer bonding helps protect delicate or fragile wafers during processing, reducing the risk of damage and improving yield in the manufacturing process.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Temporary Wafer Bonding Materials, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Temporary Wafer Bonding Materials by region & country, by Type, and by Application.
The Temporary Wafer Bonding Materials market size, estimations, and forecasts are provided in terms of sales volume (Kiloton) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Temporary Wafer Bonding Materials.
Market Segmentation
Report Metric
Details
Report Title
Temporary Wafer Bonding Materials - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030
Forecasted Market Size in 2030
US$ 1936.2 million
CAGR(2024-2030)
6.3%
Market Size Available for Years
2024-2030
Global Temporary Wafer Bonding Materials Companies Covered
Brewer Science
Samcien Semiconductor Materials
Sekisui Chemical
3M
HD MicroSystems (DuPont)
Dow
Henkel
Nissan Chemical
TOKYO OHKA KOGYO
AI Technology
Global Temporary Wafer Bonding Materials Market, by Region
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Temporary Wafer Bonding Materials Market, Segment by Type
Thermoplastic Materials
UV Curing Materials
Composite Films
Metallic Materials
Others
Global Temporary Wafer Bonding Materials Market, Segment by Application
Wafer-level Packaging
MEMS
Compound Semiconductor
Others
Forecast Units
USD million in value
Report Coverage
Revenue and volume forecast, company share, competitive landscape, growth factors and trends
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Temporary Wafer Bonding Materials manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Temporary Wafer Bonding Materials in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Temporary Wafer Bonding Materials in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.
Table of Contents
1 Market Overview
1.1 Temporary Wafer Bonding Materials Product Introduction
1.2 Global Temporary Wafer Bonding Materials Market Size Forecast
1.2.1 Global Temporary Wafer Bonding Materials Sales Value (2019-2030)
1.2.2 Global Temporary Wafer Bonding Materials Sales Volume (2019-2030)
1.2.3 Global Temporary Wafer Bonding Materials Sales Price (2019-2030)
1.3 Temporary Wafer Bonding Materials Market Trends & Drivers
1.3.1 Temporary Wafer Bonding Materials Industry Trends
1.3.2 Temporary Wafer Bonding Materials Market Drivers & Opportunity
1.3.3 Temporary Wafer Bonding Materials Market Challenges
1.3.4 Temporary Wafer Bonding Materials Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Temporary Wafer Bonding Materials Players Revenue Ranking (2023)
2.2 Global Temporary Wafer Bonding Materials Revenue by Company (2019-2024)
2.3 Global Temporary Wafer Bonding Materials Players Sales Volume Ranking (2023)
2.4 Global Temporary Wafer Bonding Materials Sales Volume by Company Players (2019-2024)
2.5 Global Temporary Wafer Bonding Materials Average Price by Company (2019-2024)
2.6 Key Manufacturers Temporary Wafer Bonding Materials Manufacturing Base Distribution and Headquarters
2.7 Key Manufacturers Temporary Wafer Bonding Materials Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of Temporary Wafer Bonding Materials
2.9 Temporary Wafer Bonding Materials Market Competitive Analysis
2.9.1 Temporary Wafer Bonding Materials Market Concentration Rate (2019-2024)
2.9.2 Global 5 and 10 Largest Manufacturers by Temporary Wafer Bonding Materials Revenue in 2023
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Temporary Wafer Bonding Materials as of 2023)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 Thermoplastic Materials
3.1.2 UV Curing Materials
3.1.3 Composite Films
3.1.4 Metallic Materials
3.1.5 Others
3.2 Global Temporary Wafer Bonding Materials Sales Value by Type
3.2.1 Global Temporary Wafer Bonding Materials Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global Temporary Wafer Bonding Materials Sales Value, by Type (2019-2030)
3.2.3 Global Temporary Wafer Bonding Materials Sales Value, by Type (%) (2019-2030)
3.3 Global Temporary Wafer Bonding Materials Sales Volume by Type
3.3.1 Global Temporary Wafer Bonding Materials Sales Volume by Type (2019 VS 2023 VS 2030)
3.3.2 Global Temporary Wafer Bonding Materials Sales Volume, by Type (2019-2030)
3.3.3 Global Temporary Wafer Bonding Materials Sales Volume, by Type (%) (2019-2030)
3.4 Global Temporary Wafer Bonding Materials Average Price by Type (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Wafer-level Packaging
4.1.2 MEMS
4.1.3 Compound Semiconductor
4.1.4 Others
4.2 Global Temporary Wafer Bonding Materials Sales Value by Application
4.2.1 Global Temporary Wafer Bonding Materials Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global Temporary Wafer Bonding Materials Sales Value, by Application (2019-2030)
4.2.3 Global Temporary Wafer Bonding Materials Sales Value, by Application (%) (2019-2030)
4.3 Global Temporary Wafer Bonding Materials Sales Volume by Application
4.3.1 Global Temporary Wafer Bonding Materials Sales Volume by Application (2019 VS 2023 VS 2030)
4.3.2 Global Temporary Wafer Bonding Materials Sales Volume, by Application (2019-2030)
4.3.3 Global Temporary Wafer Bonding Materials Sales Volume, by Application (%) (2019-2030)
4.4 Global Temporary Wafer Bonding Materials Average Price by Application (2019-2030)
5 Segmentation by Region
5.1 Global Temporary Wafer Bonding Materials Sales Value by Region
5.1.1 Global Temporary Wafer Bonding Materials Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global Temporary Wafer Bonding Materials Sales Value by Region (2019-2024)
5.1.3 Global Temporary Wafer Bonding Materials Sales Value by Region (2025-2030)
5.1.4 Global Temporary Wafer Bonding Materials Sales Value by Region (%), (2019-2030)
5.2 Global Temporary Wafer Bonding Materials Sales Volume by Region
5.2.1 Global Temporary Wafer Bonding Materials Sales Volume by Region: 2019 VS 2023 VS 2030
5.2.2 Global Temporary Wafer Bonding Materials Sales Volume by Region (2019-2024)
5.2.3 Global Temporary Wafer Bonding Materials Sales Volume by Region (2025-2030)
5.2.4 Global Temporary Wafer Bonding Materials Sales Volume by Region (%), (2019-2030)
5.3 Global Temporary Wafer Bonding Materials Average Price by Region (2019-2030)
5.4 North America
5.4.1 North America Temporary Wafer Bonding Materials Sales Value, 2019-2030
5.4.2 North America Temporary Wafer Bonding Materials Sales Value by Country (%), 2023 VS 2030
5.5 Europe
5.5.1 Europe Temporary Wafer Bonding Materials Sales Value, 2019-2030
5.5.2 Europe Temporary Wafer Bonding Materials Sales Value by Country (%), 2023 VS 2030
5.6 Asia Pacific
5.6.1 Asia Pacific Temporary Wafer Bonding Materials Sales Value, 2019-2030
5.6.2 Asia Pacific Temporary Wafer Bonding Materials Sales Value by Country (%), 2023 VS 2030
5.7 South America
5.7.1 South America Temporary Wafer Bonding Materials Sales Value, 2019-2030
5.7.2 South America Temporary Wafer Bonding Materials Sales Value by Country (%), 2023 VS 2030
5.8 Middle East & Africa
5.8.1 Middle East & Africa Temporary Wafer Bonding Materials Sales Value, 2019-2030
5.8.2 Middle East & Africa Temporary Wafer Bonding Materials Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Temporary Wafer Bonding Materials Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions Temporary Wafer Bonding Materials Sales Value
6.2.1 Key Countries/Regions Temporary Wafer Bonding Materials Sales Value, 2019-2030
6.2.2 Key Countries/Regions Temporary Wafer Bonding Materials Sales Volume, 2019-2030
6.3 United States
6.3.1 United States Temporary Wafer Bonding Materials Sales Value, 2019-2030
6.3.2 United States Temporary Wafer Bonding Materials Sales Value by Type (%), 2023 VS 2030
6.3.3 United States Temporary Wafer Bonding Materials Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe Temporary Wafer Bonding Materials Sales Value, 2019-2030
6.4.2 Europe Temporary Wafer Bonding Materials Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe Temporary Wafer Bonding Materials Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China Temporary Wafer Bonding Materials Sales Value, 2019-2030
6.5.2 China Temporary Wafer Bonding Materials Sales Value by Type (%), 2023 VS 2030
6.5.3 China Temporary Wafer Bonding Materials Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan Temporary Wafer Bonding Materials Sales Value, 2019-2030
6.6.2 Japan Temporary Wafer Bonding Materials Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan Temporary Wafer Bonding Materials Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea Temporary Wafer Bonding Materials Sales Value, 2019-2030
6.7.2 South Korea Temporary Wafer Bonding Materials Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea Temporary Wafer Bonding Materials Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia Temporary Wafer Bonding Materials Sales Value, 2019-2030
6.8.2 Southeast Asia Temporary Wafer Bonding Materials Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia Temporary Wafer Bonding Materials Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India Temporary Wafer Bonding Materials Sales Value, 2019-2030
6.9.2 India Temporary Wafer Bonding Materials Sales Value by Type (%), 2023 VS 2030
6.9.3 India Temporary Wafer Bonding Materials Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 Brewer Science
7.1.1 Brewer Science Company Information
7.1.2 Brewer Science Introduction and Business Overview
7.1.3 Brewer Science Temporary Wafer Bonding Materials Sales, Revenue and Gross Margin (2019-2024)
7.1.4 Brewer Science Temporary Wafer Bonding Materials Product Offerings
7.1.5 Brewer Science Recent Development
7.2 Samcien Semiconductor Materials
7.2.1 Samcien Semiconductor Materials Company Information
7.2.2 Samcien Semiconductor Materials Introduction and Business Overview
7.2.3 Samcien Semiconductor Materials Temporary Wafer Bonding Materials Sales, Revenue and Gross Margin (2019-2024)
7.2.4 Samcien Semiconductor Materials Temporary Wafer Bonding Materials Product Offerings
7.2.5 Samcien Semiconductor Materials Recent Development
7.3 Sekisui Chemical
7.3.1 Sekisui Chemical Company Information
7.3.2 Sekisui Chemical Introduction and Business Overview
7.3.3 Sekisui Chemical Temporary Wafer Bonding Materials Sales, Revenue and Gross Margin (2019-2024)
7.3.4 Sekisui Chemical Temporary Wafer Bonding Materials Product Offerings
7.3.5 Sekisui Chemical Recent Development
7.4 3M
7.4.1 3M Company Information
7.4.2 3M Introduction and Business Overview
7.4.3 3M Temporary Wafer Bonding Materials Sales, Revenue and Gross Margin (2019-2024)
7.4.4 3M Temporary Wafer Bonding Materials Product Offerings
7.4.5 3M Recent Development
7.5 HD MicroSystems (DuPont)
7.5.1 HD MicroSystems (DuPont) Company Information
7.5.2 HD MicroSystems (DuPont) Introduction and Business Overview
7.5.3 HD MicroSystems (DuPont) Temporary Wafer Bonding Materials Sales, Revenue and Gross Margin (2019-2024)
7.5.4 HD MicroSystems (DuPont) Temporary Wafer Bonding Materials Product Offerings
7.5.5 HD MicroSystems (DuPont) Recent Development
7.6 Dow
7.6.1 Dow Company Information
7.6.2 Dow Introduction and Business Overview
7.6.3 Dow Temporary Wafer Bonding Materials Sales, Revenue and Gross Margin (2019-2024)
7.6.4 Dow Temporary Wafer Bonding Materials Product Offerings
7.6.5 Dow Recent Development
7.7 Henkel
7.7.1 Henkel Company Information
7.7.2 Henkel Introduction and Business Overview
7.7.3 Henkel Temporary Wafer Bonding Materials Sales, Revenue and Gross Margin (2019-2024)
7.7.4 Henkel Temporary Wafer Bonding Materials Product Offerings
7.7.5 Henkel Recent Development
7.8 Nissan Chemical
7.8.1 Nissan Chemical Company Information
7.8.2 Nissan Chemical Introduction and Business Overview
7.8.3 Nissan Chemical Temporary Wafer Bonding Materials Sales, Revenue and Gross Margin (2019-2024)
7.8.4 Nissan Chemical Temporary Wafer Bonding Materials Product Offerings
7.8.5 Nissan Chemical Recent Development
7.9 TOKYO OHKA KOGYO
7.9.1 TOKYO OHKA KOGYO Company Information
7.9.2 TOKYO OHKA KOGYO Introduction and Business Overview
7.9.3 TOKYO OHKA KOGYO Temporary Wafer Bonding Materials Sales, Revenue and Gross Margin (2019-2024)
7.9.4 TOKYO OHKA KOGYO Temporary Wafer Bonding Materials Product Offerings
7.9.5 TOKYO OHKA KOGYO Recent Development
7.10 AI Technology
7.10.1 AI Technology Company Information
7.10.2 AI Technology Introduction and Business Overview
7.10.3 AI Technology Temporary Wafer Bonding Materials Sales, Revenue and Gross Margin (2019-2024)
7.10.4 AI Technology Temporary Wafer Bonding Materials Product Offerings
7.10.5 AI Technology Recent Development
8 Industry Chain Analysis
8.1 Temporary Wafer Bonding Materials Industrial Chain
8.2 Temporary Wafer Bonding Materials Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Temporary Wafer Bonding Materials Sales Model
8.5.2 Sales Channel
8.5.3 Temporary Wafer Bonding Materials Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer
Table of Figures
List of Tables
Table 1. Temporary Wafer Bonding Materials Market Trends
Table 2. Temporary Wafer Bonding Materials Market Drivers & Opportunity
Table 3. Temporary Wafer Bonding Materials Market Challenges
Table 4. Temporary Wafer Bonding Materials Market Restraints
Table 5. Global Temporary Wafer Bonding Materials Revenue by Company (2019-2024) & (US$ Million)
Table 6. Global Temporary Wafer Bonding Materials Revenue Market Share by Company (2019-2024)
Table 7. Global Temporary Wafer Bonding Materials Sales Volume by Company (2019-2024) & (Kiloton)
Table 8. Global Temporary Wafer Bonding Materials Sales Volume Market Share by Company (2019-2024)
Table 9. Global Market Temporary Wafer Bonding Materials Price by Company (2019-2024) & (US$/Ton)
Table 10. Key Manufacturers Temporary Wafer Bonding Materials Manufacturing Base Distribution and Headquarters
Table 11. Key Manufacturers Temporary Wafer Bonding Materials Product Type
Table 12. Key Manufacturers Time to Begin Mass Production of Temporary Wafer Bonding Materials
Table 13. Global Temporary Wafer Bonding Materials Manufacturers Market Concentration Ratio (CR5 and HHI)
Table 14. Global Top Manufacturers Market Share by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Temporary Wafer Bonding Materials as of 2023)
Table 15. Mergers & Acquisitions, Expansion Plans
Table 16. Global Temporary Wafer Bonding Materials Sales Value by Type: 2019 VS 2023 VS 2030 (US$ Million)
Table 17. Global Temporary Wafer Bonding Materials Sales Value by Type (2019-2024) & (US$ Million)
Table 18. Global Temporary Wafer Bonding Materials Sales Value by Type (2025-2030) & (US$ Million)
Table 19. Global Temporary Wafer Bonding Materials Sales Market Share in Value by Type (2019-2024) & (%)
Table 20. Global Temporary Wafer Bonding Materials Sales Market Share in Value by Type (2025-2030) & (%)
Table 21. Global Temporary Wafer Bonding Materials Sales Volume by Type: 2019 VS 2023 VS 2030 (Kiloton)
Table 22. Global Temporary Wafer Bonding Materials Sales Volume by Type (2019-2024) & (Kiloton)
Table 23. Global Temporary Wafer Bonding Materials Sales Volume by Type (2025-2030) & (Kiloton)
Table 24. Global Temporary Wafer Bonding Materials Sales Market Share in Volume by Type (2019-2024) & (%)
Table 25. Global Temporary Wafer Bonding Materials Sales Market Share in Volume by Type (2025-2030) & (%)
Table 26. Global Temporary Wafer Bonding Materials Price by Type (2019-2024) & (US$/Ton)
Table 27. Global Temporary Wafer Bonding Materials Price by Type (2025-2030) & (US$/Ton)
Table 28. Global Temporary Wafer Bonding Materials Sales Value by Application: 2019 VS 2023 VS 2030 (US$ Million)
Table 29. Global Temporary Wafer Bonding Materials Sales Value by Application (2019-2024) & (US$ Million)
Table 30. Global Temporary Wafer Bonding Materials Sales Value by Application (2025-2030) & (US$ Million)
Table 31. Global Temporary Wafer Bonding Materials Sales Market Share in Value by Application (2019-2024) & (%)
Table 32. Global Temporary Wafer Bonding Materials Sales Market Share in Value by Application (2025-2030) & (%)
Table 33. Global Temporary Wafer Bonding Materials Sales Volume by Application: 2019 VS 2023 VS 2030 (Kiloton)
Table 34. Global Temporary Wafer Bonding Materials Sales Volume by Application (2019-2024) & (Kiloton)
Table 35. Global Temporary Wafer Bonding Materials Sales Volume by Application (2025-2030) & (Kiloton)
Table 36. Global Temporary Wafer Bonding Materials Sales Market Share in Volume by Application (2019-2024) & (%)
Table 37. Global Temporary Wafer Bonding Materials Sales Market Share in Volume by Application (2025-2030) & (%)
Table 38. Global Temporary Wafer Bonding Materials Price by Application (2019-2024) & (US$/Ton)
Table 39. Global Temporary Wafer Bonding Materials Price by Application (2025-2030) & (US$/Ton)
Table 40. Global Temporary Wafer Bonding Materials Sales Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
Table 41. Global Temporary Wafer Bonding Materials Sales Value by Region (2019-2024) & (US$ Million)
Table 42. Global Temporary Wafer Bonding Materials Sales Value by Region (2025-2030) & (US$ Million)
Table 43. Global Temporary Wafer Bonding Materials Sales Value by Region (2019-2024) & (%)
Table 44. Global Temporary Wafer Bonding Materials Sales Value by Region (2025-2030) & (%)
Table 45. Global Temporary Wafer Bonding Materials Sales Volume by Region (Kiloton): 2019 VS 2023 VS 2030
Table 46. Global Temporary Wafer Bonding Materials Sales Volume by Region (2019-2024) & (Kiloton)
Table 47. Global Temporary Wafer Bonding Materials Sales Volume by Region (2025-2030) & (Kiloton)
Table 48. Global Temporary Wafer Bonding Materials Sales Volume by Region (2019-2024) & (%)
Table 49. Global Temporary Wafer Bonding Materials Sales Volume by Region (2025-2030) & (%)
Table 50. Global Temporary Wafer Bonding Materials Average Price by Region (2019-2024) & (US$/Ton)
Table 51. Global Temporary Wafer Bonding Materials Average Price by Region (2025-2030) & (US$/Ton)
Table 52. Key Countries/Regions Temporary Wafer Bonding Materials Sales Value Growth Trends, (US$ Million): 2019 VS 2023 VS 2030
Table 53. Key Countries/Regions Temporary Wafer Bonding Materials Sales Value, (2019-2024) & (US$ Million)
Table 54. Key Countries/Regions Temporary Wafer Bonding Materials Sales Value, (2025-2030) & (US$ Million)
Table 55. Key Countries/Regions Temporary Wafer Bonding Materials Sales Volume, (2019-2024) & (Kiloton)
Table 56. Key Countries/Regions Temporary Wafer Bonding Materials Sales Volume, (2025-2030) & (Kiloton)
Table 57. Brewer Science Company Information
Table 58. Brewer Science Introduction and Business Overview
Table 59. Brewer Science Temporary Wafer Bonding Materials Sales (Kiloton), Revenue (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 60. Brewer Science Temporary Wafer Bonding Materials Product Offerings
Table 61. Brewer Science Recent Development
Table 62. Samcien Semiconductor Materials Company Information
Table 63. Samcien Semiconductor Materials Introduction and Business Overview
Table 64. Samcien Semiconductor Materials Temporary Wafer Bonding Materials Sales (Kiloton), Revenue (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 65. Samcien Semiconductor Materials Temporary Wafer Bonding Materials Product Offerings
Table 66. Samcien Semiconductor Materials Recent Development
Table 67. Sekisui Chemical Company Information
Table 68. Sekisui Chemical Introduction and Business Overview
Table 69. Sekisui Chemical Temporary Wafer Bonding Materials Sales (Kiloton), Revenue (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 70. Sekisui Chemical Temporary Wafer Bonding Materials Product Offerings
Table 71. Sekisui Chemical Recent Development
Table 72. 3M Company Information
Table 73. 3M Introduction and Business Overview
Table 74. 3M Temporary Wafer Bonding Materials Sales (Kiloton), Revenue (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 75. 3M Temporary Wafer Bonding Materials Product Offerings
Table 76. 3M Recent Development
Table 77. HD MicroSystems (DuPont) Company Information
Table 78. HD MicroSystems (DuPont) Introduction and Business Overview
Table 79. HD MicroSystems (DuPont) Temporary Wafer Bonding Materials Sales (Kiloton), Revenue (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 80. HD MicroSystems (DuPont) Temporary Wafer Bonding Materials Product Offerings
Table 81. HD MicroSystems (DuPont) Recent Development
Table 82. Dow Company Information
Table 83. Dow Introduction and Business Overview
Table 84. Dow Temporary Wafer Bonding Materials Sales (Kiloton), Revenue (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 85. Dow Temporary Wafer Bonding Materials Product Offerings
Table 86. Dow Recent Development
Table 87. Henkel Company Information
Table 88. Henkel Introduction and Business Overview
Table 89. Henkel Temporary Wafer Bonding Materials Sales (Kiloton), Revenue (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 90. Henkel Temporary Wafer Bonding Materials Product Offerings
Table 91. Henkel Recent Development
Table 92. Nissan Chemical Company Information
Table 93. Nissan Chemical Introduction and Business Overview
Table 94. Nissan Chemical Temporary Wafer Bonding Materials Sales (Kiloton), Revenue (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 95. Nissan Chemical Temporary Wafer Bonding Materials Product Offerings
Table 96. Nissan Chemical Recent Development
Table 97. TOKYO OHKA KOGYO Company Information
Table 98. TOKYO OHKA KOGYO Introduction and Business Overview
Table 99. TOKYO OHKA KOGYO Temporary Wafer Bonding Materials Sales (Kiloton), Revenue (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 100. TOKYO OHKA KOGYO Temporary Wafer Bonding Materials Product Offerings
Table 101. TOKYO OHKA KOGYO Recent Development
Table 102. AI Technology Company Information
Table 103. AI Technology Introduction and Business Overview
Table 104. AI Technology Temporary Wafer Bonding Materials Sales (Kiloton), Revenue (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 105. AI Technology Temporary Wafer Bonding Materials Product Offerings
Table 106. AI Technology Recent Development
Table 107. Key Raw Materials Lists
Table 108. Raw Materials Key Suppliers Lists
Table 109. Temporary Wafer Bonding Materials Downstream Customers
Table 110. Temporary Wafer Bonding Materials Distributors List
Table 111. Research Programs/Design for This Report
Table 112. Key Data Information from Secondary Sources
Table 113. Key Data Information from Primary Sources
List of Figures
Figure 1. Temporary Wafer Bonding Materials Product Picture
Figure 2. Global Temporary Wafer Bonding Materials Sales Value, 2019 VS 2023 VS 2030 (US$ Million)
Figure 3. Global Temporary Wafer Bonding Materials Sales Value (2019-2030) & (US$ Million)
Figure 4. Global Temporary Wafer Bonding Materials Sales Volume (2019-2030) & (Kiloton)
Figure 5. Global Temporary Wafer Bonding Materials Sales Price (2019-2030) & (US$/Ton)
Figure 6. Temporary Wafer Bonding Materials Report Years Considered
Figure 7. Global Temporary Wafer Bonding Materials Players Revenue Ranking (2023) & (US$ Million)
Figure 8. Global Temporary Wafer Bonding Materials Players Sales Volume Ranking (2023) & (Kiloton)
Figure 9. The 5 and 10 Largest Manufacturers in the World: Market Share by Temporary Wafer Bonding Materials Revenue in 2023
Figure 10. Temporary Wafer Bonding Materials Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2019 VS 2023
Figure 11. Thermoplastic Materials Picture
Figure 12. UV Curing Materials Picture
Figure 13. Composite Films Picture
Figure 14. Metallic Materials Picture
Figure 15. Others Picture
Figure 16. Global Temporary Wafer Bonding Materials Sales Value by Type (2019 VS 2023 VS 2030) & (US$ Million)
Figure 17. Global Temporary Wafer Bonding Materials Sales Value Market Share by Type, 2023 & 2030
Figure 18. Global Temporary Wafer Bonding Materials Sales Volume by Type (2019 VS 2023 VS 2030) & (Kiloton)
Figure 19. Global Temporary Wafer Bonding Materials Sales Volume Market Share by Type, 2023 & 2030
Figure 20. Global Temporary Wafer Bonding Materials Price by Type (2019-2030) & (US$/Ton)
Figure 21. Product Picture of Wafer-level Packaging
Figure 22. Product Picture of MEMS
Figure 23. Product Picture of Compound Semiconductor
Figure 24. Product Picture of Others
Figure 25. Global Temporary Wafer Bonding Materials Sales Value by Application (2019 VS 2023 VS 2030) & (US$ Million)
Figure 26. Global Temporary Wafer Bonding Materials Sales Value Market Share by Application, 2023 & 2030
Figure 27. Global Temporary Wafer Bonding Materials Sales Volume by Application (2019 VS 2023 VS 2030) & (Kiloton)
Figure 28. Global Temporary Wafer Bonding Materials Sales Volume Market Share by Application, 2023 & 2030
Figure 29. Global Temporary Wafer Bonding Materials Price by Application (2019-2030) & (US$/Ton)
Figure 30. North America Temporary Wafer Bonding Materials Sales Value (2019-2030) & (US$ Million)
Figure 31. North America Temporary Wafer Bonding Materials Sales Value by Country (%), 2023 VS 2030
Figure 32. Europe Temporary Wafer Bonding Materials Sales Value (2019-2030) & (US$ Million)
Figure 33. Europe Temporary Wafer Bonding Materials Sales Value by Country (%), 2023 VS 2030
Figure 34. Asia Pacific Temporary Wafer Bonding Materials Sales Value (2019-2030) & (US$ Million)
Figure 35. Asia Pacific Temporary Wafer Bonding Materials Sales Value by Country (%), 2023 VS 2030
Figure 36. South America Temporary Wafer Bonding Materials Sales Value (2019-2030) & (US$ Million)
Figure 37. South America Temporary Wafer Bonding Materials Sales Value by Country (%), 2023 VS 2030
Figure 38. Middle East & Africa Temporary Wafer Bonding Materials Sales Value (2019-2030) & (US$ Million)
Figure 39. Middle East & Africa Temporary Wafer Bonding Materials Sales Value by Country (%), 2023 VS 2030
Figure 40. Key Countries/Regions Temporary Wafer Bonding Materials Sales Value (%), (2019-2030)
Figure 41. Key Countries/Regions Temporary Wafer Bonding Materials Sales Volume (%), (2019-2030)
Figure 42. United States Temporary Wafer Bonding Materials Sales Value, (2019-2030) & (US$ Million)
Figure 43. United States Temporary Wafer Bonding Materials Sales Value by Type (%), 2023 VS 2030
Figure 44. United States Temporary Wafer Bonding Materials Sales Value by Application (%), 2023 VS 2030
Figure 45. Europe Temporary Wafer Bonding Materials Sales Value, (2019-2030) & (US$ Million)
Figure 46. Europe Temporary Wafer Bonding Materials Sales Value by Type (%), 2023 VS 2030
Figure 47. Europe Temporary Wafer Bonding Materials Sales Value by Application (%), 2023 VS 2030
Figure 48. China Temporary Wafer Bonding Materials Sales Value, (2019-2030) & (US$ Million)
Figure 49. China Temporary Wafer Bonding Materials Sales Value by Type (%), 2023 VS 2030
Figure 50. China Temporary Wafer Bonding Materials Sales Value by Application (%), 2023 VS 2030
Figure 51. Japan Temporary Wafer Bonding Materials Sales Value, (2019-2030) & (US$ Million)
Figure 52. Japan Temporary Wafer Bonding Materials Sales Value by Type (%), 2023 VS 2030
Figure 53. Japan Temporary Wafer Bonding Materials Sales Value by Application (%), 2023 VS 2030
Figure 54. South Korea Temporary Wafer Bonding Materials Sales Value, (2019-2030) & (US$ Million)
Figure 55. South Korea Temporary Wafer Bonding Materials Sales Value by Type (%), 2023 VS 2030
Figure 56. South Korea Temporary Wafer Bonding Materials Sales Value by Application (%), 2023 VS 2030
Figure 57. Southeast Asia Temporary Wafer Bonding Materials Sales Value, (2019-2030) & (US$ Million)
Figure 58. Southeast Asia Temporary Wafer Bonding Materials Sales Value by Type (%), 2023 VS 2030
Figure 59. Southeast Asia Temporary Wafer Bonding Materials Sales Value by Application (%), 2023 VS 2030
Figure 60. India Temporary Wafer Bonding Materials Sales Value, (2019-2030) & (US$ Million)
Figure 61. India Temporary Wafer Bonding Materials Sales Value by Type (%), 2023 VS 2030
Figure 62. India Temporary Wafer Bonding Materials Sales Value by Application (%), 2023 VS 2030
Figure 63. Temporary Wafer Bonding Materials Industrial Chain
Figure 64. Temporary Wafer Bonding Materials Manufacturing Cost Structure
Figure 65. Channels of Distribution (Direct Sales, and Distribution)
Figure 66. Bottom-up and Top-down Approaches for This Report
Figure 67. Data Triangulation
Figure 68. Key Executives Interviewed
Description
Temporary Wafer Bonding Materials provide rigid support for ultra-thin wafers during the backside process, enabling them to complete the complex back-end processing of ultra-thin wafers The global market for Temporary Wafer Bonding Materials was estimated to be worth US$ 1264 million in 2023 and is forecast to a readjusted size of US$ 1936.2 million by 2030 with a CAGR of 6.3% during the forecast period 2024-2030
The market for temporary wafer bonding materials has been growing steadily in recent years. Temporary wafer bonding is a process used in semiconductor manufacturing and advanced packaging technologies. It involves bonding a device wafer to a carrier wafer using a temporary bonding material. This bonding enables subsequent processing steps such as thinning, 3D integration, and back-end processing.
The demand for temporary wafer bonding materials has been driven by several factors, including:
Advanced Packaging Technologies: Temporary wafer bonding materials play a crucial role in advanced packaging technologies such as 3D integration, stacked die packaging, and system-in-package (SiP) solutions. These technologies require temporary bonding to enable the fabrication of multiple layers or the integration of diverse components into a single package.
Wafer Thinning: Temporary bonding materials are essential for thinning the device wafer to achieve desired thicknesses in processes like wafer thinning for backside illumination (BSI) image sensors or through-silicon via (TSV) fabrication for 3D integration.
Yield Improvement: Temporary wafer bonding helps protect delicate or fragile wafers during processing, reducing the risk of damage and improving yield in the manufacturing process.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Temporary Wafer Bonding Materials, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Temporary Wafer Bonding Materials by region & country, by Type, and by Application.
The Temporary Wafer Bonding Materials market size, estimations, and forecasts are provided in terms of sales volume (Kiloton) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Temporary Wafer Bonding Materials.
Market Segmentation
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Temporary Wafer Bonding Materials manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Temporary Wafer Bonding Materials in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Temporary Wafer Bonding Materials in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.
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English
SIMON LEE
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HITESH
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TANG XIN
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SUNG-BIN YOON
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YUJIE TIAN
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DAMON
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