Industry: Machinery & Equipment
Published Date: 2024-04-17
Pages: 149 Pages
Report ld: 2695779
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Flip Chip Bonder Market Size(US$)

CAGR 2024-2030
1.2%
Market Size,2030
USD 315.6
Million
Market Snapshot
Source: Secondary research, interviews with experts, and QYResearch analysis
Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made through conductive bumps placed on the surface of the die. The placing process amounts to the following:
1. Die is picked up and place on a "flipping device"
2. Die is "flipped" and moved to hover over the substrate (or board or carrier) where bumps reside - precisely positioned in their previously defined positions
3. The tool then places the die on the bump with a programmed amount of force
Flip chip bumping is a vital step to the process. The bump provides the necessary electrical connection between the die and the substrate, provides thermal conduction through the two materials, acts as a "spacer" to prevent electrical shorts and provides mechanical support.
Flip chips avoid wire bonding and therefore are able to be much smaller than their counterparts. Flip chip processes have been around for more than 40 years. Since then, thousands of applications have taken advantage of the size and cost benefits enabled by the flip chip assembly method.
The global Flip Chip Bonder market size was US$ 290 million in 2023 and is forecast to a readjusted size of US$ 315.6 million by 2030 with a CAGR of 1.2% during the forecast period 2024-2030.
Global Flip Chip Bonder key players include Besi, ASM Pacific Technology, Shibaura, Kulicke & Soffa, etc. Global top four manufacturers hold a share nearly 70%.
China is the largest market, with a share about 25%, followed by United States, and Taiwan, both have a share about 30 percent.
In terms of product, Fully Automatic is the largest segment, with a share over 75%. And in terms of application, the largest application is IDMs, followed by OSAT.
In terms of production side, this report researches the Flip Chip Bonder capacity, production, growth rate, market share by manufacturers, region level and country level, from 2019 to 2024, and forecast to 2030.
In terms of sales (consumption) side, this report focuses on the sales of Flip Chip Bonder by region (Countries), company, type and application. from 2019 to 2024 and forecast to 2030.
The global Flip Chip Bonder market is thoroughly, accurately, and comprehensively assessed in the report with a large focus on market dynamics, market competition, regional growth, segmental analysis, and key growth strategies. Buyers of the report will have access to verified market figures, including global market size in terms of revenue and volume. As part of production analysis, the authors of the report have provided reliable estimations and calculations for global revenue and volume by type segment of the global Flip Chip Bonder market. These figures have been provided in terms of both revenue and volume for the period 2019-2030. Additionally, the report provides accurate figures for production by region in terms of revenue as well as volume for the same period. The report also includes production capacity statistics for the same period.
MARKET SEGMENTATION
CHAPTER OUTLINE
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by type and by application, etc.), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Sales (consumption), revenue of Flip Chip Bonder in global, regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 3: Flip Chip Bonder production/output of global and key producers (regions/countries). It provides a quantitative analysis of the production, and development potential of each producer in the next six years.
Chapter 4: Detailed analysis of Flip Chip Bonder manufacturers competitive landscape, price, sales, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 5: Provides the analysis of various market segments by type, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: North America by company, by type, by application and by country, sales, and revenue for each segment.
Chapter 8: Europe by company, by type, by application and by country, sales, and revenue for each segment.
Chapter 9: China by company, by type and by application, sales, and revenue for each segment.
Chapter 10: APAC (excluding China) by company, by type, by application and by region, sales, and revenue for each segment.
Chapter 11: Middle East, Africa, and Latin America by company, by type, by application and by country, sales, and revenue for each segment.
Chapter 12: Provides profiles of key manufacturers, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Flip Chip Bonder sales, revenue, price, gross margin, and recent development, etc.
Chapter 13: Analysis of industrial chain, sales channel, key raw materials, distributors, and customers.
Chapter 14: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 15: The main points and conclusions of the report.
QYRESEARCH'S STRENGTHS
Unlike generic global market reports, this study combines macro-level industry trends with hyper-local operational intelligence, empowering data-driven decisions across the Compound Chocolate value chain, addressing:
We identify regional market threats and growth prospects to guide your overseas layout.
We adjust product portfolios in line with local consumption habits.
We unpack rivals’ operation strategies for scattered and highly concentrated industries.
We cover competition landscape, full supply chain and quantified market size data, and deliver tailor-made customized surveys to meet your unique business demands.
We own self-owned massive exclusive databases, backed by 19 years of global market research experience across thousands of sectors.
Our team operates 24 hours a day, 365 days a year, enabling ultra-fast report turnaround to respond to your research needs efficiently.
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All data is cross-verified from multiple industry sources to deliver thorough, precise analysis that supports reliable corporate strategic decisions.
We provide responsive, dedicated after-sales support to resolve all follow-up inquiries about reports, data and industry interpretation.
TABLE OF CONTENTS
1 Report Overview
1.1 Flip Chip Bonder Definition
1.2 Market by Type
1.2.1 Global Flip Chip Bonder Market Size Growth Rate by Type, 2019 VS 2023 VS 2030
1.2.2 Fully Automatic
1.2.3 Semi-Automatic
1.3 Market by Application
1.3.1 Global Flip Chip Bonder Market Size Growth Rate by Application, 2019 VS 2023 VS 2030
1.3.2 IDMs
1.3.3 OSAT
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Flip Chip Bonder Sales
2.1 Global Flip Chip Bonder Revenue Estimates and Forecasts 2019-2030
2.2 Global Flip Chip Bonder Revenue by Region: 2019 VS 2023 VS 2030
2.3 Global Flip Chip Bonder Revenue by Region
2.3.1 Global Flip Chip Bonder Revenue by Region (2019-2024)
2.3.2 Global Flip Chip Bonder Revenue by Region (2025-2030)
2.4 Global Flip Chip Bonder Sales Quantity Estimates and Forecasts 2019-2030
2.5 Global Flip Chip Bonder Sales Quantity by Region: 2019 VS 2023 VS 2030
2.6 Global Flip Chip Bonder Sales Quantity by Region
2.6.1 Global Flip Chip Bonder Sales Quantity by Region (2019-2024)
2.6.2 Global Flip Chip Bonder Sales Quantity by Region (2025-2030)
2.7 North America
2.8 Europe
2.9 China
2.10 APAC (excluding China)
2.11 Middle East, Africa and Latin America
3 Global Production (Based on Production Site)
3.1 Global Flip Chip Bonder Production Value by Region: 2019 VS 2023 VS 2030
3.2 Global Flip Chip Bonder Production Value by Region
3.2.1 Global Flip Chip Bonder Historic Production Value by Region (2019-2024)
3.2.2 Global Flip Chip Bonder Forecasted Production Value by Region (2025-2030)
3.3 Global Flip Chip Bonder Production Capacity (2019-2030)
3.4 Global Flip Chip Bonder Production by Region: 2019 VS 2023 VS 2030
3.5 Global Flip Chip Bonder Production by Region
3.5.1 Global Flip Chip Bonder Historic Production by Region (2019-2024)
3.5.2 Global Flip Chip Bonder Forecasted Production by Region (2025-2030)
3.5.3 North America
3.5.4 Europe
3.5.5 Japan
3.5.6 China
3.5.7 South Korea
3.5.8 India
4 Competition by Manufacturers
4.1 Global Flip Chip Bonder Sales Quantity by Manufacturers
4.1.1 Global Flip Chip Bonder Sales Quantity by Manufacturers (2019-2024)
4.1.2 Global Flip Chip Bonder Sales Quantity Share by Manufacturers (2019-2024)
4.1.3 Global Top 10 and Top 5 Companies by Flip Chip Bonder Sales in 2023
4.2 Global Flip Chip Bonder Revenue by Manufacturers
4.2.1 Global Flip Chip Bonder Revenue by Manufacturers (2019-2024)
4.2.2 Global Flip Chip Bonder Revenue Share by Manufacturers (2019-2024)
4.2.3 Global Top 10 and Top 5 Companies by Flip Chip Bonder Revenue in 2023
4.3 Global Flip Chip Bonder Sales Price by Manufacturers
4.4 Global Key Players of Flip Chip Bonder, Industry Ranking, 2022 VS 2023
4.5 Analysis of Competitive Landscape
4.5.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
4.5.2 Global Flip Chip Bonder Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
4.6 Global Key Manufacturers of Flip Chip Bonder, Manufacturing Base Distribution and Headquarters
4.7 Global Key Manufacturers of Flip Chip Bonder, Product Offered and Application
4.8 Global Key Manufacturers of Flip Chip Bonder, Date of Enter into This Industry
4.9 Mergers & Acquisitions, Expansion Plans
5 Estimates and Forecasts by Type
5.1 Global Flip Chip Bonder Sales Quantity by Type
5.1.1 Global Flip Chip Bonder Historical Sales Quantity by Type (2019-2024)
5.1.2 Global Flip Chip Bonder Forecasted Sales Quantity by Type (2025-2030)
5.1.3 Global Flip Chip Bonder Sales Quantity Market Share by Type (2019-2030)
5.2 Global Flip Chip Bonder Revenue by Type
5.2.1 Global Flip Chip Bonder Historical Revenue by Type (2019-2024)
5.2.2 Global Flip Chip Bonder Forecasted Revenue by Type (2025-2030)
5.2.3 Global Flip Chip Bonder Revenue Market Share by Type (2019-2030)
5.3 Global Flip Chip Bonder Price by Type
5.3.1 Global Flip Chip Bonder Price by Type (2019-2024)
5.3.2 Global Flip Chip Bonder Price Forecast by Type (2025-2030)
6 Market Size by Application
6.1 Global Flip Chip Bonder Sales Quantity by Application
6.1.1 Global Flip Chip Bonder Historical Sales Quantity by Application (2019-2024)
6.1.2 Global Flip Chip Bonder Forecasted Sales Quantity by Application (2025-2030)
6.1.3 Global Flip Chip Bonder Sales Quantity Market Share by Application (2019-2030)
6.2 Global Flip Chip Bonder Revenue by Application
6.2.1 Global Flip Chip Bonder Historical Revenue by Application (2019-2024)
6.2.2 Global Flip Chip Bonder Forecasted Revenue by Application (2025-2030)
6.2.3 Global Flip Chip Bonder Revenue Market Share by Application (2019-2030)
6.3 Global Flip Chip Bonder Price by Application
6.3.1 Global Flip Chip Bonder Price by Application (2019-2024)
6.3.2 Global Flip Chip Bonder Price Forecast by Application (2025-2030)
7 North America
7.1 North America Flip Chip Bonder Sales by Company
7.1.1 North America Flip Chip Bonder Revenue by Company (2019-2024)
7.1.2 North America Flip Chip Bonder Sales Quantity by Company (2019-2024)
7.2 North America Flip Chip Bonder Market Size by Type
7.2.1 North America Flip Chip Bonder Sales Quantity by Type (2019-2030)
7.2.2 North America Flip Chip Bonder Revenue by Type (2019-2030)
7.3 North America Flip Chip Bonder Market Size by Application
7.3.1 North America Flip Chip Bonder Sales Quantity by Application (2019-2030)
7.3.2 North America Flip Chip Bonder Revenue by Application (2019-2030)
7.4 North America Flip Chip Bonder Market Size by Country
7.4.1 North America Flip Chip Bonder Revenue by Country: 2019 VS 2023 VS 2030
7.4.2 North America Flip Chip Bonder Revenue by Country (2019-2030)
7.4.3 North America Flip Chip Bonder Sales Quantity by Country (2019-2030)
7.4.4 U.S.
7.4.5 Canada
8 Europe
8.1 Europe Flip Chip Bonder Sales by Company
8.1.1 Europe Flip Chip Bonder Sales Quantity by Company (2019-2024)
8.1.2 Europe Flip Chip Bonder Revenue by Company (2019-2024)
8.2 Europe Flip Chip Bonder Market Size by Type
8.2.1 Europe Flip Chip Bonder Sales Quantity by Type (2019-2030)
8.2.2 Europe Flip Chip Bonder Revenue by Type (2019-2030)
8.3 Europe Flip Chip Bonder Market Size by Application
8.3.1 Europe Flip Chip Bonder Sales Quantity by Application (2019-2030)
8.3.2 Europe Flip Chip Bonder Revenue by Application (2019-2030)
8.4 Europe Flip Chip Bonder Market Size by Country
8.4.1 Europe Flip Chip Bonder Revenue by Country: 2019 VS 2023 VS 2030
8.4.2 Europe Flip Chip Bonder Revenue by Country (2019-2030)
8.4.3 Europe Flip Chip Bonder Sales Quantity by Country (2019-2030)
8.4.4 Germany
8.4.5 France
8.4.6 U.K.
8.4.7 Italy
8.4.8 Russia
9 China
9.1 China Flip Chip Bonder Sales by Company
9.1.1 China Flip Chip Bonder Sales Quantity by Company (2019-2024)
9.1.2 China Flip Chip Bonder Revenue by Company (2019-2024)
9.2 China Flip Chip Bonder Market Size by Type
9.2.1 China Flip Chip Bonder Sales Quantity by Type (2019-2030)
9.2.2 China Flip Chip Bonder Revenue by Type (2019-2030)
9.3 China Flip Chip Bonder Market Size by Application
9.3.1 China Flip Chip Bonder Sales Quantity by Application (2019-2030)
9.3.2 China Flip Chip Bonder Revenue by Application (2019-2030)
10 APAC (excluding China)
10.1 APAC Flip Chip Bonder Sales by Company
10.1.1 APAC Flip Chip Bonder Sales Quantity by Company (2019-2024)
10.1.2 APAC Flip Chip Bonder Revenue by Company (2019-2024)
10.2 APAC Flip Chip Bonder Market Size by Type
10.2.1 APAC Flip Chip Bonder Sales Quantity by Type (2019-2030)
10.2.2 APAC Flip Chip Bonder Revenue by Type (2019-2030)
10.3 APAC Flip Chip Bonder Market Size by Application
10.3.1 APAC Flip Chip Bonder Sales Quantity by Application (2019-2030)
10.3.2 APAC Flip Chip Bonder Revenue by Application (2019-2030)
10.4 APAC Flip Chip Bonder Market Size by Region
10.4.1 APAC Flip Chip Bonder Revenue by Region: 2019 VS 2023 VS 2030
10.4.2 APAC Flip Chip Bonder Revenue by Region (2019-2030)
10.4.3 APAC Flip Chip Bonder Sales Quantity by Region (2019-2030)
10.4.4 Japan
10.4.5 South Korea
10.4.6 China Taiwan
10.4.7 Southeast Asia
10.4.8 India
11 Middle East, Africa and Latin America
11.1 Middle East, Africa and Latin America Flip Chip Bonder Sales by Company
11.1.1 Middle East, Africa and Latin America Flip Chip Bonder Sales Quantity by Company (2019-2024)
11.1.2 Middle East, Africa and Latin America Flip Chip Bonder Revenue by Company (2019-2024)
11.2 Middle East, Africa and Latin America Flip Chip Bonder Market Size by Type
11.2.1 Middle East, Africa and Latin America Flip Chip Bonder Sales Quantity by Type (2019-2030)
11.2.2 Middle East, Africa and Latin America Flip Chip Bonder Revenue by Type (2019-2030)
11.3 Middle East, Africa and Latin America Flip Chip Bonder Market Size by Application
11.3.1 Middle East, Africa and Latin America Flip Chip Bonder Sales Quantity by Application (2019-2030)
11.3.2 Middle East, Africa and Latin America Flip Chip Bonder Revenue by Application (2019-2030)
11.4 Middle East, Africa and Latin America Flip Chip Bonder Market Size by Country
11.4.1 Middle East, Africa and Latin America Flip Chip Bonder Revenue by Country: 2019 VS 2023 VS 2030
11.4.2 Middle East, Africa and Latin America Flip Chip Bonder Revenue by Country (2019-2030)
11.4.3 Middle East, Africa and Latin America Flip Chip Bonder Sales Quantity by Country (2019-2030)
11.4.4 Brazil
11.4.5 Mexico
11.4.6 Turkey
11.4.7 Israel
11.4.8 GCC Countries
12 Company Profiles
12.1 BESI
12.1.1 BESI Company Information
12.1.2 BESI Overview
12.1.3 BESI Flip Chip Bonder Sales Quantity, Revenue, Price and Gross Margin (2019-2024)
12.1.4 BESI Flip Chip Bonder Products and Services
12.1.5 BESI Flip Chip Bonder SWOT Analysis
12.1.6 BESI Recent Developments
12.2 ASMPT
12.2.1 ASMPT Company Information
12.2.2 ASMPT Overview
12.2.3 ASMPT Flip Chip Bonder Sales Quantity, Revenue, Price and Gross Margin (2019-2024)
12.2.4 ASMPT Flip Chip Bonder Products and Services
12.2.5 ASMPT Flip Chip Bonder SWOT Analysis
12.2.6 ASMPT Recent Developments
12.3 Shibaura
12.3.1 Shibaura Company Information
12.3.2 Shibaura Overview
12.3.3 Shibaura Flip Chip Bonder Sales Quantity, Revenue, Price and Gross Margin (2019-2024)
12.3.4 Shibaura Flip Chip Bonder Products and Services
12.3.5 Shibaura Flip Chip Bonder SWOT Analysis
12.3.6 Shibaura Recent Developments
12.4 Muehlbauer
12.4.1 Muehlbauer Company Information
12.4.2 Muehlbauer Overview
12.4.3 Muehlbauer Flip Chip Bonder Sales Quantity, Revenue, Price and Gross Margin (2019-2024)
12.4.4 Muehlbauer Flip Chip Bonder Products and Services
12.4.5 Muehlbauer Flip Chip Bonder SWOT Analysis
12.4.6 Muehlbauer Recent Developments
12.5 K&S
12.5.1 K&S Company Information
12.5.2 K&S Overview
12.5.3 K&S Flip Chip Bonder Sales Quantity, Revenue, Price and Gross Margin (2019-2024)
12.5.4 K&S Flip Chip Bonder Products and Services
12.5.5 K&S Flip Chip Bonder SWOT Analysis
12.5.6 K&S Recent Developments
12.6 Hamni
12.6.1 Hamni Company Information
12.6.2 Hamni Overview
12.6.3 Hamni Flip Chip Bonder Sales Quantity, Revenue, Price and Gross Margin (2019-2024)
12.6.4 Hamni Flip Chip Bonder Products and Services
12.6.5 Hamni Flip Chip Bonder SWOT Analysis
12.6.6 Hamni Recent Developments
12.7 AMICRA Microtechnologies
12.7.1 AMICRA Microtechnologies Company Information
12.7.2 AMICRA Microtechnologies Overview
12.7.3 AMICRA Microtechnologies Flip Chip Bonder Sales Quantity, Revenue, Price and Gross Margin (2019-2024)
12.7.4 AMICRA Microtechnologies Flip Chip Bonder Products and Services
12.7.5 AMICRA Microtechnologies Flip Chip Bonder SWOT Analysis
12.7.6 AMICRA Microtechnologies Recent Developments
12.8 SET
12.8.1 SET Company Information
12.8.2 SET Overview
12.8.3 SET Flip Chip Bonder Sales Quantity, Revenue, Price and Gross Margin (2019-2024)
12.8.4 SET Flip Chip Bonder Products and Services
12.8.5 SET Flip Chip Bonder SWOT Analysis
12.8.6 SET Recent Developments
12.9 Athlete FA
12.9.1 Athlete FA Company Information
12.9.2 Athlete FA Overview
12.9.3 Athlete FA Flip Chip Bonder Sales Quantity, Revenue, Price and Gross Margin (2019-2024)
12.9.4 Athlete FA Flip Chip Bonder Products and Services
12.9.5 Athlete FA Flip Chip Bonder SWOT Analysis
12.9.6 Athlete FA Recent Developments
13 Value Chain and Sales Channels Analysis
13.1 Flip Chip Bonder Value Chain Analysis
13.2 Flip Chip Bonder Key Raw Materials
13.2.1 Key Raw Materials
13.2.2 Raw Materials Key Suppliers
13.3 Flip Chip Bonder Production Mode & Process
13.4 Flip Chip Bonder Sales and Marketing
13.4.1 Flip Chip Bonder Sales Channels
13.4.2 Flip Chip Bonder Distributors
13.5 Flip Chip Bonder Customers
14 Market Dynamics
14.1 Flip Chip Bonder Industry Trends
14.2 Flip Chip Bonder Market Drivers
14.3 Flip Chip Bonder Market Challenges
14.4 Flip Chip Bonder Market Restraints
15 Key Findings
16 Appendix
16.1 Research Methodology
16.1.1 Methodology/Research Approach
16.1.2 Data Source
16.2 Author Details
16.3 Disclaimer
TABLE OF FIGURES
List of Tables
List of Figures
KEY QUESTIONS ADDRESSED BY THE REPORT
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REPORT COVERAGE
DESCRIPTION
OVERVIEW
MARKET SEGMENTATION
CHAPTER OUTLINE
QYRESEARCH'S STRENGTHS
TABLE OF CONTENTS
TABLE OF FIGURES
RLEATED REPORTS
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