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Description
Temporary Wafer Bonding Materials provide rigid support for ultra-thin wafers during the backside process, enabling them to complete the complex back-end processing of ultra-thin wafers The global Temporary Wafer Bonding Materials market was valued at US$ 1264 million in 2023 and is anticipated to reach US$ 1936.2 million by 2030, witnessing a CAGR of 6.3% during the forecast period 2024-2030.
Temporary Wafer Bonding Materials Market Size(US$)
M= millions and B=billions
The market for temporary wafer bonding materials has been growing steadily in recent years. Temporary wafer bonding is a process used in semiconductor manufacturing and advanced packaging technologies. It involves bonding a device wafer to a carrier wafer using a temporary bonding material. This bonding enables subsequent processing steps such as thinning, 3D integration, and back-end processing.
The demand for temporary wafer bonding materials has been driven by several factors, including:
Advanced Packaging Technologies: Temporary wafer bonding materials play a crucial role in advanced packaging technologies such as 3D integration, stacked die packaging, and system-in-package (SiP) solutions. These technologies require temporary bonding to enable the fabrication of multiple layers or the integration of diverse components into a single package.
Wafer Thinning: Temporary bonding materials are essential for thinning the device wafer to achieve desired thicknesses in processes like wafer thinning for backside illumination (BSI) image sensors or through-silicon via (TSV) fabrication for 3D integration.
Yield Improvement: Temporary wafer bonding helps protect delicate or fragile wafers during processing, reducing the risk of damage and improving yield in the manufacturing process.
This report aims to provide a comprehensive presentation of the global market for Temporary Wafer Bonding Materials, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Temporary Wafer Bonding Materials.
Report Scope
The Temporary Wafer Bonding Materials market size, estimations, and forecasts are provided in terms of output/shipments (Kiloton) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Temporary Wafer Bonding Materials market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Temporary Wafer Bonding Materials manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
Report Metric
Details
Report Title
Global Temporary Wafer Bonding Materials Market Research Report 2024
Forecasted Market Size in 2030
US$ 1936.2 million
CAGR(2024-2030)
6.3%
Market Size Available for Years
2024-2030
Global Temporary Wafer Bonding Materials Companies Covered
Brewer Science
Samcien Semiconductor Materials
Sekisui Chemical
3M
HD MicroSystems (DuPont)
Dow
Henkel
Nissan Chemical
TOKYO OHKA KOGYO
AI Technology
Global Temporary Wafer Bonding Materials Market, by Region
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Temporary Wafer Bonding Materials Market, Segment by Type
Thermoplastic Materials
UV Curing Materials
Composite Films
Metallic Materials
Others
Global Temporary Wafer Bonding Materials Market, Segment by Application
Wafer-level Packaging
MEMS
Compound Semiconductor
Others
Forecast Units
USD million in value
Report Coverage
Revenue and volume forecast, company share, competitive landscape, growth factors and trends
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Temporary Wafer Bonding Materials manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Temporary Wafer Bonding Materials by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Temporary Wafer Bonding Materials in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Table of Contents
1 Temporary Wafer Bonding Materials Market Overview
1.1 Product Definition
1.2 Temporary Wafer Bonding Materials Segment by Type
1.2.1 Global Temporary Wafer Bonding Materials Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Thermoplastic Materials
1.2.3 UV Curing Materials
1.2.4 Composite Films
1.2.5 Metallic Materials
1.2.6 Others
1.3 Temporary Wafer Bonding Materials Segment by Application
1.3.1 Global Temporary Wafer Bonding Materials Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Wafer-level Packaging
1.3.3 MEMS
1.3.4 Compound Semiconductor
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Temporary Wafer Bonding Materials Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Temporary Wafer Bonding Materials Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Temporary Wafer Bonding Materials Production Estimates and Forecasts (2019-2030)
1.4.4 Global Temporary Wafer Bonding Materials Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Temporary Wafer Bonding Materials Production Market Share by Manufacturers (2019-2024)
2.2 Global Temporary Wafer Bonding Materials Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Temporary Wafer Bonding Materials, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Temporary Wafer Bonding Materials Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Temporary Wafer Bonding Materials Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Temporary Wafer Bonding Materials, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Temporary Wafer Bonding Materials, Product Offered and Application
2.8 Global Key Manufacturers of Temporary Wafer Bonding Materials, Date of Enter into This Industry
2.9 Temporary Wafer Bonding Materials Market Competitive Situation and Trends
2.9.1 Temporary Wafer Bonding Materials Market Concentration Rate
2.9.2 Global 5 and 10 Largest Temporary Wafer Bonding Materials Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Temporary Wafer Bonding Materials Production by Region
3.1 Global Temporary Wafer Bonding Materials Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Temporary Wafer Bonding Materials Production Value by Region (2019-2030)
3.2.1 Global Temporary Wafer Bonding Materials Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Temporary Wafer Bonding Materials by Region (2025-2030)
3.3 Global Temporary Wafer Bonding Materials Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Temporary Wafer Bonding Materials Production by Region (2019-2030)
3.4.1 Global Temporary Wafer Bonding Materials Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Temporary Wafer Bonding Materials by Region (2025-2030)
3.5 Global Temporary Wafer Bonding Materials Market Price Analysis by Region (2019-2024)
3.6 Global Temporary Wafer Bonding Materials Production and Value, Year-over-Year Growth
3.6.1 North America Temporary Wafer Bonding Materials Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Temporary Wafer Bonding Materials Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Temporary Wafer Bonding Materials Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Temporary Wafer Bonding Materials Production Value Estimates and Forecasts (2019-2030)
4 Temporary Wafer Bonding Materials Consumption by Region
4.1 Global Temporary Wafer Bonding Materials Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Temporary Wafer Bonding Materials Consumption by Region (2019-2030)
4.2.1 Global Temporary Wafer Bonding Materials Consumption by Region (2019-2024)
4.2.2 Global Temporary Wafer Bonding Materials Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Temporary Wafer Bonding Materials Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Temporary Wafer Bonding Materials Consumption by Country (2019-2030)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Temporary Wafer Bonding Materials Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Temporary Wafer Bonding Materials Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Temporary Wafer Bonding Materials Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Temporary Wafer Bonding Materials Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Temporary Wafer Bonding Materials Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Temporary Wafer Bonding Materials Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Temporary Wafer Bonding Materials Production by Type (2019-2030)
5.1.1 Global Temporary Wafer Bonding Materials Production by Type (2019-2024)
5.1.2 Global Temporary Wafer Bonding Materials Production by Type (2025-2030)
5.1.3 Global Temporary Wafer Bonding Materials Production Market Share by Type (2019-2030)
5.2 Global Temporary Wafer Bonding Materials Production Value by Type (2019-2030)
5.2.1 Global Temporary Wafer Bonding Materials Production Value by Type (2019-2024)
5.2.2 Global Temporary Wafer Bonding Materials Production Value by Type (2025-2030)
5.2.3 Global Temporary Wafer Bonding Materials Production Value Market Share by Type (2019-2030)
5.3 Global Temporary Wafer Bonding Materials Price by Type (2019-2030)
6 Segment by Application
6.1 Global Temporary Wafer Bonding Materials Production by Application (2019-2030)
6.1.1 Global Temporary Wafer Bonding Materials Production by Application (2019-2024)
6.1.2 Global Temporary Wafer Bonding Materials Production by Application (2025-2030)
6.1.3 Global Temporary Wafer Bonding Materials Production Market Share by Application (2019-2030)
6.2 Global Temporary Wafer Bonding Materials Production Value by Application (2019-2030)
6.2.1 Global Temporary Wafer Bonding Materials Production Value by Application (2019-2024)
6.2.2 Global Temporary Wafer Bonding Materials Production Value by Application (2025-2030)
6.2.3 Global Temporary Wafer Bonding Materials Production Value Market Share by Application (2019-2030)
6.3 Global Temporary Wafer Bonding Materials Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Brewer Science
7.1.1 Brewer Science Temporary Wafer Bonding Materials Corporation Information
7.1.2 Brewer Science Temporary Wafer Bonding Materials Product Portfolio
7.1.3 Brewer Science Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Brewer Science Main Business and Markets Served
7.1.5 Brewer Science Recent Developments/Updates
7.2 Samcien Semiconductor Materials
7.2.1 Samcien Semiconductor Materials Temporary Wafer Bonding Materials Corporation Information
7.2.2 Samcien Semiconductor Materials Temporary Wafer Bonding Materials Product Portfolio
7.2.3 Samcien Semiconductor Materials Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Samcien Semiconductor Materials Main Business and Markets Served
7.2.5 Samcien Semiconductor Materials Recent Developments/Updates
7.3 Sekisui Chemical
7.3.1 Sekisui Chemical Temporary Wafer Bonding Materials Corporation Information
7.3.2 Sekisui Chemical Temporary Wafer Bonding Materials Product Portfolio
7.3.3 Sekisui Chemical Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Sekisui Chemical Main Business and Markets Served
7.3.5 Sekisui Chemical Recent Developments/Updates
7.4 3M
7.4.1 3M Temporary Wafer Bonding Materials Corporation Information
7.4.2 3M Temporary Wafer Bonding Materials Product Portfolio
7.4.3 3M Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2019-2024)
7.4.4 3M Main Business and Markets Served
7.4.5 3M Recent Developments/Updates
7.5 HD MicroSystems (DuPont)
7.5.1 HD MicroSystems (DuPont) Temporary Wafer Bonding Materials Corporation Information
7.5.2 HD MicroSystems (DuPont) Temporary Wafer Bonding Materials Product Portfolio
7.5.3 HD MicroSystems (DuPont) Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2019-2024)
7.5.4 HD MicroSystems (DuPont) Main Business and Markets Served
7.5.5 HD MicroSystems (DuPont) Recent Developments/Updates
7.6 Dow
7.6.1 Dow Temporary Wafer Bonding Materials Corporation Information
7.6.2 Dow Temporary Wafer Bonding Materials Product Portfolio
7.6.3 Dow Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Dow Main Business and Markets Served
7.6.5 Dow Recent Developments/Updates
7.7 Henkel
7.7.1 Henkel Temporary Wafer Bonding Materials Corporation Information
7.7.2 Henkel Temporary Wafer Bonding Materials Product Portfolio
7.7.3 Henkel Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Henkel Main Business and Markets Served
7.7.5 Henkel Recent Developments/Updates
7.8 Nissan Chemical
7.8.1 Nissan Chemical Temporary Wafer Bonding Materials Corporation Information
7.8.2 Nissan Chemical Temporary Wafer Bonding Materials Product Portfolio
7.8.3 Nissan Chemical Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Nissan Chemical Main Business and Markets Served
7.7.5 Nissan Chemical Recent Developments/Updates
7.9 TOKYO OHKA KOGYO
7.9.1 TOKYO OHKA KOGYO Temporary Wafer Bonding Materials Corporation Information
7.9.2 TOKYO OHKA KOGYO Temporary Wafer Bonding Materials Product Portfolio
7.9.3 TOKYO OHKA KOGYO Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2019-2024)
7.9.4 TOKYO OHKA KOGYO Main Business and Markets Served
7.9.5 TOKYO OHKA KOGYO Recent Developments/Updates
7.10 AI Technology
7.10.1 AI Technology Temporary Wafer Bonding Materials Corporation Information
7.10.2 AI Technology Temporary Wafer Bonding Materials Product Portfolio
7.10.3 AI Technology Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2019-2024)
7.10.4 AI Technology Main Business and Markets Served
7.10.5 AI Technology Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Temporary Wafer Bonding Materials Industry Chain Analysis
8.2 Temporary Wafer Bonding Materials Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Temporary Wafer Bonding Materials Production Mode & Process
8.4 Temporary Wafer Bonding Materials Sales and Marketing
8.4.1 Temporary Wafer Bonding Materials Sales Channels
8.4.2 Temporary Wafer Bonding Materials Distributors
8.5 Temporary Wafer Bonding Materials Customers
9 Temporary Wafer Bonding Materials Market Dynamics
9.1 Temporary Wafer Bonding Materials Industry Trends
9.2 Temporary Wafer Bonding Materials Market Drivers
9.3 Temporary Wafer Bonding Materials Market Challenges
9.4 Temporary Wafer Bonding Materials Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Table of Figures
List of Tables
Table 1. Global Temporary Wafer Bonding Materials Market Value by Type, (US$ Million) & (2023 VS 2030)
Table 2. Global Temporary Wafer Bonding Materials Market Value by Application, (US$ Million) & (2023 VS 2030)
Table 3. Global Temporary Wafer Bonding Materials Production Capacity (Kiloton) by Manufacturers in 2023
Table 4. Global Temporary Wafer Bonding Materials Production by Manufacturers (2019-2024) & (Kiloton)
Table 5. Global Temporary Wafer Bonding Materials Production Market Share by Manufacturers (2019-2024)
Table 6. Global Temporary Wafer Bonding Materials Production Value by Manufacturers (2019-2024) & (US$ Million)
Table 7. Global Temporary Wafer Bonding Materials Production Value Share by Manufacturers (2019-2024)
Table 8. Global Temporary Wafer Bonding Materials Industry Ranking 2022 VS 2023 VS 2024
Table 9. Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Temporary Wafer Bonding Materials as of 2023)
Table 10. Global Market Temporary Wafer Bonding Materials Average Price by Manufacturers (US$/Ton) & (2019-2024)
Table 11. Manufacturers Temporary Wafer Bonding Materials Production Sites and Area Served
Table 12. Manufacturers Temporary Wafer Bonding Materials Product Types
Table 13. Global Temporary Wafer Bonding Materials Manufacturers Market Concentration Ratio (CR5 and HHI)
Table 14. Mergers & Acquisitions, Expansion
Table 15. Global Temporary Wafer Bonding Materials Production Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
Table 16. Global Temporary Wafer Bonding Materials Production Value (US$ Million) by Region (2019-2024)
Table 17. Global Temporary Wafer Bonding Materials Production Value Market Share by Region (2019-2024)
Table 18. Global Temporary Wafer Bonding Materials Production Value (US$ Million) Forecast by Region (2025-2030)
Table 19. Global Temporary Wafer Bonding Materials Production Value Market Share Forecast by Region (2025-2030)
Table 20. Global Temporary Wafer Bonding Materials Production Comparison by Region: 2019 VS 2023 VS 2030 (Kiloton)
Table 21. Global Temporary Wafer Bonding Materials Production (Kiloton) by Region (2019-2024)
Table 22. Global Temporary Wafer Bonding Materials Production Market Share by Region (2019-2024)
Table 23. Global Temporary Wafer Bonding Materials Production (Kiloton) Forecast by Region (2025-2030)
Table 24. Global Temporary Wafer Bonding Materials Production Market Share Forecast by Region (2025-2030)
Table 25. Global Temporary Wafer Bonding Materials Market Average Price (US$/Ton) by Region (2019-2024)
Table 26. Global Temporary Wafer Bonding Materials Market Average Price (US$/Ton) by Region (2025-2030)
Table 27. Global Temporary Wafer Bonding Materials Consumption Growth Rate by Region: 2019 VS 2023 VS 2030 (Kiloton)
Table 28. Global Temporary Wafer Bonding Materials Consumption by Region (2019-2024) & (Kiloton)
Table 29. Global Temporary Wafer Bonding Materials Consumption Market Share by Region (2019-2024)
Table 30. Global Temporary Wafer Bonding Materials Forecasted Consumption by Region (2025-2030) & (Kiloton)
Table 31. Global Temporary Wafer Bonding Materials Forecasted Consumption Market Share by Region (2019-2024)
Table 32. North America Temporary Wafer Bonding Materials Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (Kiloton)
Table 33. North America Temporary Wafer Bonding Materials Consumption by Country (2019-2024) & (Kiloton)
Table 34. North America Temporary Wafer Bonding Materials Consumption by Country (2025-2030) & (Kiloton)
Table 35. Europe Temporary Wafer Bonding Materials Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (Kiloton)
Table 36. Europe Temporary Wafer Bonding Materials Consumption by Country (2019-2024) & (Kiloton)
Table 37. Europe Temporary Wafer Bonding Materials Consumption by Country (2025-2030) & (Kiloton)
Table 38. Asia Pacific Temporary Wafer Bonding Materials Consumption Growth Rate by Region: 2019 VS 2023 VS 2030 (Kiloton)
Table 39. Asia Pacific Temporary Wafer Bonding Materials Consumption by Region (2019-2024) & (Kiloton)
Table 40. Asia Pacific Temporary Wafer Bonding Materials Consumption by Region (2025-2030) & (Kiloton)
Table 41. Latin America, Middle East & Africa Temporary Wafer Bonding Materials Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (Kiloton)
Table 42. Latin America, Middle East & Africa Temporary Wafer Bonding Materials Consumption by Country (2019-2024) & (Kiloton)
Table 43. Latin America, Middle East & Africa Temporary Wafer Bonding Materials Consumption by Country (2025-2030) & (Kiloton)
Table 44. Global Temporary Wafer Bonding Materials Production (Kiloton) by Type (2019-2024)
Table 45. Global Temporary Wafer Bonding Materials Production (Kiloton) by Type (2025-2030)
Table 46. Global Temporary Wafer Bonding Materials Production Market Share by Type (2019-2024)
Table 47. Global Temporary Wafer Bonding Materials Production Market Share by Type (2025-2030)
Table 48. Global Temporary Wafer Bonding Materials Production Value (US$ Million) by Type (2019-2024)
Table 49. Global Temporary Wafer Bonding Materials Production Value (US$ Million) by Type (2025-2030)
Table 50. Global Temporary Wafer Bonding Materials Production Value Share by Type (2019-2024)
Table 51. Global Temporary Wafer Bonding Materials Production Value Share by Type (2025-2030)
Table 52. Global Temporary Wafer Bonding Materials Price (US$/Ton) by Type (2019-2024)
Table 53. Global Temporary Wafer Bonding Materials Price (US$/Ton) by Type (2025-2030)
Table 54. Global Temporary Wafer Bonding Materials Production (Kiloton) by Application (2019-2024)
Table 55. Global Temporary Wafer Bonding Materials Production (Kiloton) by Application (2025-2030)
Table 56. Global Temporary Wafer Bonding Materials Production Market Share by Application (2019-2024)
Table 57. Global Temporary Wafer Bonding Materials Production Market Share by Application (2025-2030)
Table 58. Global Temporary Wafer Bonding Materials Production Value (US$ Million) by Application (2019-2024)
Table 59. Global Temporary Wafer Bonding Materials Production Value (US$ Million) by Application (2025-2030)
Table 60. Global Temporary Wafer Bonding Materials Production Value Share by Application (2019-2024)
Table 61. Global Temporary Wafer Bonding Materials Production Value Share by Application (2025-2030)
Table 62. Global Temporary Wafer Bonding Materials Price (US$/Ton) by Application (2019-2024)
Table 63. Global Temporary Wafer Bonding Materials Price (US$/Ton) by Application (2025-2030)
Table 64. Brewer Science Temporary Wafer Bonding Materials Corporation Information
Table 65. Brewer Science Specification and Application
Table 66. Brewer Science Temporary Wafer Bonding Materials Production (Kiloton), Value (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 67. Brewer Science Main Business and Markets Served
Table 68. Brewer Science Recent Developments/Updates
Table 69. Samcien Semiconductor Materials Temporary Wafer Bonding Materials Corporation Information
Table 70. Samcien Semiconductor Materials Specification and Application
Table 71. Samcien Semiconductor Materials Temporary Wafer Bonding Materials Production (Kiloton), Value (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 72. Samcien Semiconductor Materials Main Business and Markets Served
Table 73. Samcien Semiconductor Materials Recent Developments/Updates
Table 74. Sekisui Chemical Temporary Wafer Bonding Materials Corporation Information
Table 75. Sekisui Chemical Specification and Application
Table 76. Sekisui Chemical Temporary Wafer Bonding Materials Production (Kiloton), Value (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 77. Sekisui Chemical Main Business and Markets Served
Table 78. Sekisui Chemical Recent Developments/Updates
Table 79. 3M Temporary Wafer Bonding Materials Corporation Information
Table 80. 3M Specification and Application
Table 81. 3M Temporary Wafer Bonding Materials Production (Kiloton), Value (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 82. 3M Main Business and Markets Served
Table 83. 3M Recent Developments/Updates
Table 84. HD MicroSystems (DuPont) Temporary Wafer Bonding Materials Corporation Information
Table 85. HD MicroSystems (DuPont) Specification and Application
Table 86. HD MicroSystems (DuPont) Temporary Wafer Bonding Materials Production (Kiloton), Value (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 87. HD MicroSystems (DuPont) Main Business and Markets Served
Table 88. HD MicroSystems (DuPont) Recent Developments/Updates
Table 89. Dow Temporary Wafer Bonding Materials Corporation Information
Table 90. Dow Specification and Application
Table 91. Dow Temporary Wafer Bonding Materials Production (Kiloton), Value (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 92. Dow Main Business and Markets Served
Table 93. Dow Recent Developments/Updates
Table 94. Henkel Temporary Wafer Bonding Materials Corporation Information
Table 95. Henkel Specification and Application
Table 96. Henkel Temporary Wafer Bonding Materials Production (Kiloton), Value (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 97. Henkel Main Business and Markets Served
Table 98. Henkel Recent Developments/Updates
Table 99. Nissan Chemical Temporary Wafer Bonding Materials Corporation Information
Table 100. Nissan Chemical Specification and Application
Table 101. Nissan Chemical Temporary Wafer Bonding Materials Production (Kiloton), Value (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 102. Nissan Chemical Main Business and Markets Served
Table 103. Nissan Chemical Recent Developments/Updates
Table 104. TOKYO OHKA KOGYO Temporary Wafer Bonding Materials Corporation Information
Table 105. TOKYO OHKA KOGYO Specification and Application
Table 106. TOKYO OHKA KOGYO Temporary Wafer Bonding Materials Production (Kiloton), Value (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 107. TOKYO OHKA KOGYO Main Business and Markets Served
Table 108. TOKYO OHKA KOGYO Recent Developments/Updates
Table 109. AI Technology Temporary Wafer Bonding Materials Corporation Information
Table 110. AI Technology Specification and Application
Table 111. AI Technology Temporary Wafer Bonding Materials Production (Kiloton), Value (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 112. AI Technology Main Business and Markets Served
Table 113. AI Technology Recent Developments/Updates
Table 114. Key Raw Materials Lists
Table 115. Raw Materials Key Suppliers Lists
Table 116. Temporary Wafer Bonding Materials Distributors List
Table 117. Temporary Wafer Bonding Materials Customers List
Table 118. Temporary Wafer Bonding Materials Market Trends
Table 119. Temporary Wafer Bonding Materials Market Drivers
Table 120. Temporary Wafer Bonding Materials Market Challenges
Table 121. Temporary Wafer Bonding Materials Market Restraints
Table 122. Research Programs/Design for This Report
Table 123. Key Data Information from Secondary Sources
Table 124. Key Data Information from Primary Sources
List of Figures
Figure 1. Product Picture of Temporary Wafer Bonding Materials
Figure 2. Global Temporary Wafer Bonding Materials Market Value by Type, (US$ Million) & (2023 VS 2030)
Figure 3. Global Temporary Wafer Bonding Materials Market Share by Type: 2023 VS 2030
Figure 4. Thermoplastic Materials Product Picture
Figure 5. UV Curing Materials Product Picture
Figure 6. Composite Films Product Picture
Figure 7. Metallic Materials Product Picture
Figure 8. Others Product Picture
Figure 9. Global Temporary Wafer Bonding Materials Market Value by Application, (US$ Million) & (2023 VS 2030)
Figure 10. Global Temporary Wafer Bonding Materials Market Share by Application: 2023 VS 2030
Figure 11. Wafer-level Packaging
Figure 12. MEMS
Figure 13. Compound Semiconductor
Figure 14. Others
Figure 15. Global Temporary Wafer Bonding Materials Production Value (US$ Million), 2019 VS 2023 VS 2030
Figure 16. Global Temporary Wafer Bonding Materials Production Value (US$ Million) & (2019-2030)
Figure 17. Global Temporary Wafer Bonding Materials Production (Kiloton) & (2019-2030)
Figure 18. Global Temporary Wafer Bonding Materials Average Price (US$/Ton) & (2019-2030)
Figure 19. Temporary Wafer Bonding Materials Report Years Considered
Figure 20. Temporary Wafer Bonding Materials Production Share by Manufacturers in 2023
Figure 21. Temporary Wafer Bonding Materials Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2019 VS 2023
Figure 22. The Global 5 and 10 Largest Players: Market Share by Temporary Wafer Bonding Materials Revenue in 2023
Figure 23. Global Temporary Wafer Bonding Materials Production Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
Figure 24. Global Temporary Wafer Bonding Materials Production Value Market Share by Region: 2019 VS 2023 VS 2030
Figure 25. Global Temporary Wafer Bonding Materials Production Comparison by Region: 2019 VS 2023 VS 2030 (Kiloton)
Figure 26. Global Temporary Wafer Bonding Materials Production Market Share by Region: 2019 VS 2023 VS 2030
Figure 27. North America Temporary Wafer Bonding Materials Production Value (US$ Million) Growth Rate (2019-2030)
Figure 28. Europe Temporary Wafer Bonding Materials Production Value (US$ Million) Growth Rate (2019-2030)
Figure 29. China Temporary Wafer Bonding Materials Production Value (US$ Million) Growth Rate (2019-2030)
Figure 30. Japan Temporary Wafer Bonding Materials Production Value (US$ Million) Growth Rate (2019-2030)
Figure 31. Global Temporary Wafer Bonding Materials Consumption by Region: 2019 VS 2023 VS 2030 (Kiloton)
Figure 32. Global Temporary Wafer Bonding Materials Consumption Market Share by Region: 2019 VS 2023 VS 2030
Figure 33. North America Temporary Wafer Bonding Materials Consumption and Growth Rate (2019-2024) & (Kiloton)
Figure 34. North America Temporary Wafer Bonding Materials Consumption Market Share by Country (2019-2030)
Figure 35. Canada Temporary Wafer Bonding Materials Consumption and Growth Rate (2019-2024) & (Kiloton)
Figure 36. U.S. Temporary Wafer Bonding Materials Consumption and Growth Rate (2019-2024) & (Kiloton)
Figure 37. Europe Temporary Wafer Bonding Materials Consumption and Growth Rate (2019-2024) & (Kiloton)
Figure 38. Europe Temporary Wafer Bonding Materials Consumption Market Share by Country (2019-2030)
Figure 39. Germany Temporary Wafer Bonding Materials Consumption and Growth Rate (2019-2024) & (Kiloton)
Figure 40. France Temporary Wafer Bonding Materials Consumption and Growth Rate (2019-2024) & (Kiloton)
Figure 41. U.K. Temporary Wafer Bonding Materials Consumption and Growth Rate (2019-2024) & (Kiloton)
Figure 42. Italy Temporary Wafer Bonding Materials Consumption and Growth Rate (2019-2024) & (Kiloton)
Figure 43. Russia Temporary Wafer Bonding Materials Consumption and Growth Rate (2019-2024) & (Kiloton)
Figure 44. Asia Pacific Temporary Wafer Bonding Materials Consumption and Growth Rate (2019-2024) & (Kiloton)
Figure 45. Asia Pacific Temporary Wafer Bonding Materials Consumption Market Share by Regions (2019-2030)
Figure 46. China Temporary Wafer Bonding Materials Consumption and Growth Rate (2019-2024) & (Kiloton)
Figure 47. Japan Temporary Wafer Bonding Materials Consumption and Growth Rate (2019-2024) & (Kiloton)
Figure 48. South Korea Temporary Wafer Bonding Materials Consumption and Growth Rate (2019-2024) & (Kiloton)
Figure 49. China Taiwan Temporary Wafer Bonding Materials Consumption and Growth Rate (2019-2024) & (Kiloton)
Figure 50. Southeast Asia Temporary Wafer Bonding Materials Consumption and Growth Rate (2019-2024) & (Kiloton)
Figure 51. India Temporary Wafer Bonding Materials Consumption and Growth Rate (2019-2024) & (Kiloton)
Figure 52. Latin America, Middle East & Africa Temporary Wafer Bonding Materials Consumption and Growth Rate (2019-2024) & (Kiloton)
Figure 53. Latin America, Middle East & Africa Temporary Wafer Bonding Materials Consumption Market Share by Country (2019-2030)
Figure 54. Mexico Temporary Wafer Bonding Materials Consumption and Growth Rate (2019-2024) & (Kiloton)
Figure 55. Brazil Temporary Wafer Bonding Materials Consumption and Growth Rate (2019-2024) & (Kiloton)
Figure 56. Turkey Temporary Wafer Bonding Materials Consumption and Growth Rate (2019-2024) & (Kiloton)
Figure 57. GCC Countries Temporary Wafer Bonding Materials Consumption and Growth Rate (2019-2024) & (Kiloton)
Figure 58. Global Production Market Share of Temporary Wafer Bonding Materials by Type (2019-2030)
Figure 59. Global Production Value Market Share of Temporary Wafer Bonding Materials by Type (2019-2030)
Figure 60. Global Temporary Wafer Bonding Materials Price (US$/Ton) by Type (2019-2030)
Figure 61. Global Production Market Share of Temporary Wafer Bonding Materials by Application (2019-2030)
Figure 62. Global Production Value Market Share of Temporary Wafer Bonding Materials by Application (2019-2030)
Figure 63. Global Temporary Wafer Bonding Materials Price (US$/Ton) by Application (2019-2030)
Figure 64. Temporary Wafer Bonding Materials Value Chain
Figure 65. Temporary Wafer Bonding Materials Production Process
Figure 66. Channels of Distribution (Direct Vs Distribution)
Figure 67. Distributors Profiles
Figure 68. Bottom-up and Top-down Approaches for This Report
Figure 69. Data Triangulation
Description
Temporary Wafer Bonding Materials provide rigid support for ultra-thin wafers during the backside process, enabling them to complete the complex back-end processing of ultra-thin wafers The global Temporary Wafer Bonding Materials market was valued at US$ 1264 million in 2023 and is anticipated to reach US$ 1936.2 million by 2030, witnessing a CAGR of 6.3% during the forecast period 2024-2030.
The market for temporary wafer bonding materials has been growing steadily in recent years. Temporary wafer bonding is a process used in semiconductor manufacturing and advanced packaging technologies. It involves bonding a device wafer to a carrier wafer using a temporary bonding material. This bonding enables subsequent processing steps such as thinning, 3D integration, and back-end processing.
The demand for temporary wafer bonding materials has been driven by several factors, including:
Advanced Packaging Technologies: Temporary wafer bonding materials play a crucial role in advanced packaging technologies such as 3D integration, stacked die packaging, and system-in-package (SiP) solutions. These technologies require temporary bonding to enable the fabrication of multiple layers or the integration of diverse components into a single package.
Wafer Thinning: Temporary bonding materials are essential for thinning the device wafer to achieve desired thicknesses in processes like wafer thinning for backside illumination (BSI) image sensors or through-silicon via (TSV) fabrication for 3D integration.
Yield Improvement: Temporary wafer bonding helps protect delicate or fragile wafers during processing, reducing the risk of damage and improving yield in the manufacturing process.
This report aims to provide a comprehensive presentation of the global market for Temporary Wafer Bonding Materials, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Temporary Wafer Bonding Materials.
Report Scope
The Temporary Wafer Bonding Materials market size, estimations, and forecasts are provided in terms of output/shipments (Kiloton) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Temporary Wafer Bonding Materials market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Temporary Wafer Bonding Materials manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Temporary Wafer Bonding Materials manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Temporary Wafer Bonding Materials by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Temporary Wafer Bonding Materials in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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