Industry Research Reports

Part 1

Part 2

Part 3

Part 4

Part 5

Home > Reports > Electronics & Semiconductor > 3D IC and 2.5D IC Packaging - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030

3D IC and 2.5D IC Packaging - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030

Industry: Electronics & Semiconductor

Published: 2024-01-24

Pages: 100 Pages

Report ld: 2339054

Request Sample

Pre-Order Enquiry

Description
Table of Contents
Table of Figures
Related Reports
PDF Download

Description
Table of Contents
Table of Figures
Related Reports
PDF Download

Description

The global market for 3D IC and 2.5D IC Packaging was estimated to be worth US$ 100020 million in 2023 and is forecast to a readjusted size of US$ 268230 million by 2030 with a CAGR of 15.0% during the forecast period 2024-2030
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.

3D IC and 2.5D IC Packaging Market Size(US$)

M= millions and B=billions

Report Scope
This report aims to provide a comprehensive presentation of the global market for 3D IC and 2.5D IC Packaging, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of 3D IC and 2.5D IC Packaging by region & country, by Type, and by Application.

The 3D IC and 2.5D IC Packaging market size, estimations, and forecasts are provided in terms of sales volume (K Units) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 3D IC and 2.5D IC Packaging.

Market Segmentation

Report Metric
Details
Report Title
3D IC and 2.5D IC Packaging - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030
Forecasted Market Size in 2030
US$ 268230 million
CAGR(2024-2030)
15%
Market Size Available for Years
2024-2030
Global 3D IC and 2.5D IC Packaging Companies Covered
Taiwan Semiconductor
Samsung Electronics
Toshiba Corp
Advanced Semiconductor Engineering
Amkor Technology
Global 3D IC and 2.5D IC Packaging Market, by Region
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global 3D IC and 2.5D IC Packaging Market, Segment by Type
3D Wafer-level Chip-scale Packaging
3D TSV
2.5D
Global 3D IC and 2.5D IC Packaging Market, Segment by Application
Logic
Imaging & Optoelectronics
Memory
MEMS/Sensors
LED
Power
Forecast Units
USD million in value
Report Coverage
Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of 3D IC and 2.5D IC Packaging manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of 3D IC and 2.5D IC Packaging in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of 3D IC and 2.5D IC Packaging in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

Table of Contents

1 Market Overview
    1.1 3D IC and 2.5D IC Packaging Product Introduction
    1.2 Global 3D IC and 2.5D IC Packaging Market Size Forecast
        1.2.1 Global 3D IC and 2.5D IC Packaging Sales Value (2019-2030)
        1.2.2 Global 3D IC and 2.5D IC Packaging Sales Volume (2019-2030)
        1.2.3 Global 3D IC and 2.5D IC Packaging Sales Price (2019-2030)
    1.3 3D IC and 2.5D IC Packaging Market Trends & Drivers
        1.3.1 3D IC and 2.5D IC Packaging Industry Trends
        1.3.2 3D IC and 2.5D IC Packaging Market Drivers & Opportunity
        1.3.3 3D IC and 2.5D IC Packaging Market Challenges
        1.3.4 3D IC and 2.5D IC Packaging Market Restraints
    1.4 Assumptions and Limitations
    1.5 Study Objectives
    1.6 Years Considered

2 Competitive Analysis by Company
    2.1 Global 3D IC and 2.5D IC Packaging Players Revenue Ranking (2023)
    2.2 Global 3D IC and 2.5D IC Packaging Revenue by Company (2019-2024)
    2.3 Global 3D IC and 2.5D IC Packaging Players Sales Volume Ranking (2023)
    2.4 Global 3D IC and 2.5D IC Packaging Sales Volume by Company Players (2019-2024)
    2.5 Global 3D IC and 2.5D IC Packaging Average Price by Company (2019-2024)
    2.6 Key Manufacturers 3D IC and 2.5D IC Packaging Manufacturing Base Distribution and Headquarters
    2.7 Key Manufacturers 3D IC and 2.5D IC Packaging Product Offered
    2.8 Key Manufacturers Time to Begin Mass Production of 3D IC and 2.5D IC Packaging
    2.9 3D IC and 2.5D IC Packaging Market Competitive Analysis
        2.9.1 3D IC and 2.5D IC Packaging Market Concentration Rate (2019-2024)
        2.9.2 Global 5 and 10 Largest Manufacturers by 3D IC and 2.5D IC Packaging Revenue in 2023
        2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in 3D IC and 2.5D IC Packaging as of 2023)
    2.10 Mergers & Acquisitions, Expansion

3 Segmentation by Type
    3.1 Introduction by Type
        3.1.1 3D Wafer-level Chip-scale Packaging
        3.1.2 3D TSV
        3.1.3 2.5D
    3.2 Global 3D IC and 2.5D IC Packaging Sales Value by Type
        3.2.1 Global 3D IC and 2.5D IC Packaging Sales Value by Type (2019 VS 2023 VS 2030)
        3.2.2 Global 3D IC and 2.5D IC Packaging Sales Value, by Type (2019-2030)
        3.2.3 Global 3D IC and 2.5D IC Packaging Sales Value, by Type (%) (2019-2030)
    3.3 Global 3D IC and 2.5D IC Packaging Sales Volume by Type
        3.3.1 Global 3D IC and 2.5D IC Packaging Sales Volume by Type (2019 VS 2023 VS 2030)
        3.3.2 Global 3D IC and 2.5D IC Packaging Sales Volume, by Type (2019-2030)
        3.3.3 Global 3D IC and 2.5D IC Packaging Sales Volume, by Type (%) (2019-2030)
    3.4 Global 3D IC and 2.5D IC Packaging Average Price by Type (2019-2030)

4 Segmentation by Application
    4.1 Introduction by Application
        4.1.1 Logic
        4.1.2 Imaging & Optoelectronics
        4.1.3 Memory
        4.1.4 MEMS/Sensors
        4.1.5 LED
        4.1.6 Power
    4.2 Global 3D IC and 2.5D IC Packaging Sales Value by Application
        4.2.1 Global 3D IC and 2.5D IC Packaging Sales Value by Application (2019 VS 2023 VS 2030)
        4.2.2 Global 3D IC and 2.5D IC Packaging Sales Value, by Application (2019-2030)
        4.2.3 Global 3D IC and 2.5D IC Packaging Sales Value, by Application (%) (2019-2030)
    4.3 Global 3D IC and 2.5D IC Packaging Sales Volume by Application
        4.3.1 Global 3D IC and 2.5D IC Packaging Sales Volume by Application (2019 VS 2023 VS 2030)
        4.3.2 Global 3D IC and 2.5D IC Packaging Sales Volume, by Application (2019-2030)
        4.3.3 Global 3D IC and 2.5D IC Packaging Sales Volume, by Application (%) (2019-2030)
    4.4 Global 3D IC and 2.5D IC Packaging Average Price by Application (2019-2030)

5 Segmentation by Region
    5.1 Global 3D IC and 2.5D IC Packaging Sales Value by Region
        5.1.1 Global 3D IC and 2.5D IC Packaging Sales Value by Region: 2019 VS 2023 VS 2030
        5.1.2 Global 3D IC and 2.5D IC Packaging Sales Value by Region (2019-2024)
        5.1.3 Global 3D IC and 2.5D IC Packaging Sales Value by Region (2025-2030)
        5.1.4 Global 3D IC and 2.5D IC Packaging Sales Value by Region (%), (2019-2030)
    5.2 Global 3D IC and 2.5D IC Packaging Sales Volume by Region
        5.2.1 Global 3D IC and 2.5D IC Packaging Sales Volume by Region: 2019 VS 2023 VS 2030
        5.2.2 Global 3D IC and 2.5D IC Packaging Sales Volume by Region (2019-2024)
        5.2.3 Global 3D IC and 2.5D IC Packaging Sales Volume by Region (2025-2030)
        5.2.4 Global 3D IC and 2.5D IC Packaging Sales Volume by Region (%), (2019-2030)
    5.3 Global 3D IC and 2.5D IC Packaging Average Price by Region (2019-2030)
    5.4 North America
        5.4.1 North America 3D IC and 2.5D IC Packaging Sales Value, 2019-2030
        5.4.2 North America 3D IC and 2.5D IC Packaging Sales Value by Country (%), 2023 VS 2030
    5.5 Europe
        5.5.1 Europe 3D IC and 2.5D IC Packaging Sales Value, 2019-2030
        5.5.2 Europe 3D IC and 2.5D IC Packaging Sales Value by Country (%), 2023 VS 2030
    5.6 Asia Pacific
        5.6.1 Asia Pacific 3D IC and 2.5D IC Packaging Sales Value, 2019-2030
        5.6.2 Asia Pacific 3D IC and 2.5D IC Packaging Sales Value by Country (%), 2023 VS 2030
    5.7 South America
        5.7.1 South America 3D IC and 2.5D IC Packaging Sales Value, 2019-2030
        5.7.2 South America 3D IC and 2.5D IC Packaging Sales Value by Country (%), 2023 VS 2030
    5.8 Middle East & Africa
        5.8.1 Middle East & Africa 3D IC and 2.5D IC Packaging Sales Value, 2019-2030
        5.8.2 Middle East & Africa 3D IC and 2.5D IC Packaging Sales Value by Country (%), 2023 VS 2030

6 Segmentation by Key Countries/Regions
    6.1 Key Countries/Regions 3D IC and 2.5D IC Packaging Sales Value Growth Trends, 2019 VS 2023 VS 2030
    6.2 Key Countries/Regions 3D IC and 2.5D IC Packaging Sales Value
        6.2.1 Key Countries/Regions 3D IC and 2.5D IC Packaging Sales Value, 2019-2030
        6.2.2 Key Countries/Regions 3D IC and 2.5D IC Packaging Sales Volume, 2019-2030
    6.3 United States
        6.3.1 United States 3D IC and 2.5D IC Packaging Sales Value, 2019-2030
        6.3.2 United States 3D IC and 2.5D IC Packaging Sales Value by Type (%), 2023 VS 2030
        6.3.3 United States 3D IC and 2.5D IC Packaging Sales Value by Application, 2023 VS 2030
    6.4 Europe
        6.4.1 Europe 3D IC and 2.5D IC Packaging Sales Value, 2019-2030
        6.4.2 Europe 3D IC and 2.5D IC Packaging Sales Value by Type (%), 2023 VS 2030
        6.4.3 Europe 3D IC and 2.5D IC Packaging Sales Value by Application, 2023 VS 2030
    6.5 China
        6.5.1 China 3D IC and 2.5D IC Packaging Sales Value, 2019-2030
        6.5.2 China 3D IC and 2.5D IC Packaging Sales Value by Type (%), 2023 VS 2030
        6.5.3 China 3D IC and 2.5D IC Packaging Sales Value by Application, 2023 VS 2030
    6.6 Japan
        6.6.1 Japan 3D IC and 2.5D IC Packaging Sales Value, 2019-2030
        6.6.2 Japan 3D IC and 2.5D IC Packaging Sales Value by Type (%), 2023 VS 2030
        6.6.3 Japan 3D IC and 2.5D IC Packaging Sales Value by Application, 2023 VS 2030
    6.7 South Korea
        6.7.1 South Korea 3D IC and 2.5D IC Packaging Sales Value, 2019-2030
        6.7.2 South Korea 3D IC and 2.5D IC Packaging Sales Value by Type (%), 2023 VS 2030
        6.7.3 South Korea 3D IC and 2.5D IC Packaging Sales Value by Application, 2023 VS 2030
    6.8 Southeast Asia
        6.8.1 Southeast Asia 3D IC and 2.5D IC Packaging Sales Value, 2019-2030
        6.8.2 Southeast Asia 3D IC and 2.5D IC Packaging Sales Value by Type (%), 2023 VS 2030
        6.8.3 Southeast Asia 3D IC and 2.5D IC Packaging Sales Value by Application, 2023 VS 2030
    6.9 India
        6.9.1 India 3D IC and 2.5D IC Packaging Sales Value, 2019-2030
        6.9.2 India 3D IC and 2.5D IC Packaging Sales Value by Type (%), 2023 VS 2030
        6.9.3 India 3D IC and 2.5D IC Packaging Sales Value by Application, 2023 VS 2030

7 Company Profiles
    7.1 Taiwan Semiconductor
        7.1.1 Taiwan Semiconductor Company Information
        7.1.2 Taiwan Semiconductor Introduction and Business Overview
        7.1.3 Taiwan Semiconductor 3D IC and 2.5D IC Packaging Sales, Revenue and Gross Margin (2019-2024)
        7.1.4 Taiwan Semiconductor 3D IC and 2.5D IC Packaging Product Offerings
        7.1.5 Taiwan Semiconductor Recent Development
    7.2 Samsung Electronics
        7.2.1 Samsung Electronics Company Information
        7.2.2 Samsung Electronics Introduction and Business Overview
        7.2.3 Samsung Electronics 3D IC and 2.5D IC Packaging Sales, Revenue and Gross Margin (2019-2024)
        7.2.4 Samsung Electronics 3D IC and 2.5D IC Packaging Product Offerings
        7.2.5 Samsung Electronics Recent Development
    7.3 Toshiba Corp
        7.3.1 Toshiba Corp Company Information
        7.3.2 Toshiba Corp Introduction and Business Overview
        7.3.3 Toshiba Corp 3D IC and 2.5D IC Packaging Sales, Revenue and Gross Margin (2019-2024)
        7.3.4 Toshiba Corp 3D IC and 2.5D IC Packaging Product Offerings
        7.3.5 Toshiba Corp Recent Development
    7.4 Advanced Semiconductor Engineering
        7.4.1 Advanced Semiconductor Engineering Company Information
        7.4.2 Advanced Semiconductor Engineering Introduction and Business Overview
        7.4.3 Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Sales, Revenue and Gross Margin (2019-2024)
        7.4.4 Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Product Offerings
        7.4.5 Advanced Semiconductor Engineering Recent Development
    7.5 Amkor Technology
        7.5.1 Amkor Technology Company Information
        7.5.2 Amkor Technology Introduction and Business Overview
        7.5.3 Amkor Technology 3D IC and 2.5D IC Packaging Sales, Revenue and Gross Margin (2019-2024)
        7.5.4 Amkor Technology 3D IC and 2.5D IC Packaging Product Offerings
        7.5.5 Amkor Technology Recent Development

8 Industry Chain Analysis
    8.1 3D IC and 2.5D IC Packaging Industrial Chain
    8.2 3D IC and 2.5D IC Packaging Upstream Analysis
        8.2.1 Key Raw Materials
        8.2.2 Raw Materials Key Suppliers
        8.2.3 Manufacturing Cost Structure
    8.3 Midstream Analysis
    8.4 Downstream Analysis (Customers Analysis)
    8.5 Sales Model and Sales Channels
        8.5.1 3D IC and 2.5D IC Packaging Sales Model
        8.5.2 Sales Channel
        8.5.3 3D IC and 2.5D IC Packaging Distributors

9 Research Findings and Conclusion

10 Appendix
    10.1 Research Methodology
        10.1.1 Methodology/Research Approach
        10.1.2 Data Source
    10.2 Author Details
    10.3 Disclaimer

Table of Figures

List of Tables
    Table 1. 3D IC and 2.5D IC Packaging Market Trends
    Table 2. 3D IC and 2.5D IC Packaging Market Drivers & Opportunity
    Table 3. 3D IC and 2.5D IC Packaging Market Challenges
    Table 4. 3D IC and 2.5D IC Packaging Market Restraints
    Table 5. Global 3D IC and 2.5D IC Packaging Revenue by Company (2019-2024) & (US$ Million)
    Table 6. Global 3D IC and 2.5D IC Packaging Revenue Market Share by Company (2019-2024)
    Table 7. Global 3D IC and 2.5D IC Packaging Sales Volume by Company (2019-2024) & (K Units)
    Table 8. Global 3D IC and 2.5D IC Packaging Sales Volume Market Share by Company (2019-2024)
    Table 9. Global Market 3D IC and 2.5D IC Packaging Price by Company (2019-2024) & (K USD/Unit)
    Table 10. Key Manufacturers 3D IC and 2.5D IC Packaging Manufacturing Base Distribution and Headquarters
    Table 11. Key Manufacturers 3D IC and 2.5D IC Packaging Product Type
    Table 12. Key Manufacturers Time to Begin Mass Production of 3D IC and 2.5D IC Packaging
    Table 13. Global 3D IC and 2.5D IC Packaging Manufacturers Market Concentration Ratio (CR5 and HHI)
    Table 14. Global Top Manufacturers Market Share by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in 3D IC and 2.5D IC Packaging as of 2023)
    Table 15. Mergers & Acquisitions, Expansion Plans
    Table 16. Global 3D IC and 2.5D IC Packaging Sales Value by Type: 2019 VS 2023 VS 2030 (US$ Million)
    Table 17. Global 3D IC and 2.5D IC Packaging Sales Value by Type (2019-2024) & (US$ Million)
    Table 18. Global 3D IC and 2.5D IC Packaging Sales Value by Type (2025-2030) & (US$ Million)
    Table 19. Global 3D IC and 2.5D IC Packaging Sales Market Share in Value by Type (2019-2024) & (%)
    Table 20. Global 3D IC and 2.5D IC Packaging Sales Market Share in Value by Type (2025-2030) & (%)
    Table 21. Global 3D IC and 2.5D IC Packaging Sales Volume by Type: 2019 VS 2023 VS 2030 (K Units)
    Table 22. Global 3D IC and 2.5D IC Packaging Sales Volume by Type (2019-2024) & (K Units)
    Table 23. Global 3D IC and 2.5D IC Packaging Sales Volume by Type (2025-2030) & (K Units)
    Table 24. Global 3D IC and 2.5D IC Packaging Sales Market Share in Volume by Type (2019-2024) & (%)
    Table 25. Global 3D IC and 2.5D IC Packaging Sales Market Share in Volume by Type (2025-2030) & (%)
    Table 26. Global 3D IC and 2.5D IC Packaging Price by Type (2019-2024) & (K USD/Unit)
    Table 27. Global 3D IC and 2.5D IC Packaging Price by Type (2025-2030) & (K USD/Unit)
    Table 28. Global 3D IC and 2.5D IC Packaging Sales Value by Application: 2019 VS 2023 VS 2030 (US$ Million)
    Table 29. Global 3D IC and 2.5D IC Packaging Sales Value by Application (2019-2024) & (US$ Million)
    Table 30. Global 3D IC and 2.5D IC Packaging Sales Value by Application (2025-2030) & (US$ Million)
    Table 31. Global 3D IC and 2.5D IC Packaging Sales Market Share in Value by Application (2019-2024) & (%)
    Table 32. Global 3D IC and 2.5D IC Packaging Sales Market Share in Value by Application (2025-2030) & (%)
    Table 33. Global 3D IC and 2.5D IC Packaging Sales Volume by Application: 2019 VS 2023 VS 2030 (K Units)
    Table 34. Global 3D IC and 2.5D IC Packaging Sales Volume by Application (2019-2024) & (K Units)
    Table 35. Global 3D IC and 2.5D IC Packaging Sales Volume by Application (2025-2030) & (K Units)
    Table 36. Global 3D IC and 2.5D IC Packaging Sales Market Share in Volume by Application (2019-2024) & (%)
    Table 37. Global 3D IC and 2.5D IC Packaging Sales Market Share in Volume by Application (2025-2030) & (%)
    Table 38. Global 3D IC and 2.5D IC Packaging Price by Application (2019-2024) & (K USD/Unit)
    Table 39. Global 3D IC and 2.5D IC Packaging Price by Application (2025-2030) & (K USD/Unit)
    Table 40. Global 3D IC and 2.5D IC Packaging Sales Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
    Table 41. Global 3D IC and 2.5D IC Packaging Sales Value by Region (2019-2024) & (US$ Million)
    Table 42. Global 3D IC and 2.5D IC Packaging Sales Value by Region (2025-2030) & (US$ Million)
    Table 43. Global 3D IC and 2.5D IC Packaging Sales Value by Region (2019-2024) & (%)
    Table 44. Global 3D IC and 2.5D IC Packaging Sales Value by Region (2025-2030) & (%)
    Table 45. Global 3D IC and 2.5D IC Packaging Sales Volume by Region (K Units): 2019 VS 2023 VS 2030
    Table 46. Global 3D IC and 2.5D IC Packaging Sales Volume by Region (2019-2024) & (K Units)
    Table 47. Global 3D IC and 2.5D IC Packaging Sales Volume by Region (2025-2030) & (K Units)
    Table 48. Global 3D IC and 2.5D IC Packaging Sales Volume by Region (2019-2024) & (%)
    Table 49. Global 3D IC and 2.5D IC Packaging Sales Volume by Region (2025-2030) & (%)
    Table 50. Global 3D IC and 2.5D IC Packaging Average Price by Region (2019-2024) & (K USD/Unit)
    Table 51. Global 3D IC and 2.5D IC Packaging Average Price by Region (2025-2030) & (K USD/Unit)
    Table 52. Key Countries/Regions 3D IC and 2.5D IC Packaging Sales Value Growth Trends, (US$ Million): 2019 VS 2023 VS 2030
    Table 53. Key Countries/Regions 3D IC and 2.5D IC Packaging Sales Value, (2019-2024) & (US$ Million)
    Table 54. Key Countries/Regions 3D IC and 2.5D IC Packaging Sales Value, (2025-2030) & (US$ Million)
    Table 55. Key Countries/Regions 3D IC and 2.5D IC Packaging Sales Volume, (2019-2024) & (K Units)
    Table 56. Key Countries/Regions 3D IC and 2.5D IC Packaging Sales Volume, (2025-2030) & (K Units)
    Table 57. Taiwan Semiconductor Company Information
    Table 58. Taiwan Semiconductor Introduction and Business Overview
    Table 59. Taiwan Semiconductor 3D IC and 2.5D IC Packaging Sales (K Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2019-2024)
    Table 60. Taiwan Semiconductor 3D IC and 2.5D IC Packaging Product Offerings
    Table 61. Taiwan Semiconductor Recent Development
    Table 62. Samsung Electronics Company Information
    Table 63. Samsung Electronics Introduction and Business Overview
    Table 64. Samsung Electronics 3D IC and 2.5D IC Packaging Sales (K Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2019-2024)
    Table 65. Samsung Electronics 3D IC and 2.5D IC Packaging Product Offerings
    Table 66. Samsung Electronics Recent Development
    Table 67. Toshiba Corp Company Information
    Table 68. Toshiba Corp Introduction and Business Overview
    Table 69. Toshiba Corp 3D IC and 2.5D IC Packaging Sales (K Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2019-2024)
    Table 70. Toshiba Corp 3D IC and 2.5D IC Packaging Product Offerings
    Table 71. Toshiba Corp Recent Development
    Table 72. Advanced Semiconductor Engineering Company Information
    Table 73. Advanced Semiconductor Engineering Introduction and Business Overview
    Table 74. Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Sales (K Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2019-2024)
    Table 75. Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Product Offerings
    Table 76. Advanced Semiconductor Engineering Recent Development
    Table 77. Amkor Technology Company Information
    Table 78. Amkor Technology Introduction and Business Overview
    Table 79. Amkor Technology 3D IC and 2.5D IC Packaging Sales (K Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2019-2024)
    Table 80. Amkor Technology 3D IC and 2.5D IC Packaging Product Offerings
    Table 81. Amkor Technology Recent Development
    Table 82. Key Raw Materials Lists
    Table 83. Raw Materials Key Suppliers Lists
    Table 84. 3D IC and 2.5D IC Packaging Downstream Customers
    Table 85. 3D IC and 2.5D IC Packaging Distributors List
    Table 86. Research Programs/Design for This Report
    Table 87. Key Data Information from Secondary Sources
    Table 88. Key Data Information from Primary Sources
List of Figures
    Figure 1. 3D IC and 2.5D IC Packaging Product Picture
    Figure 2. Global 3D IC and 2.5D IC Packaging Sales Value, 2019 VS 2023 VS 2030 (US$ Million)
    Figure 3. Global 3D IC and 2.5D IC Packaging Sales Value (2019-2030) & (US$ Million)
    Figure 4. Global 3D IC and 2.5D IC Packaging Sales Volume (2019-2030) & (K Units)
    Figure 5. Global 3D IC and 2.5D IC Packaging Sales Price (2019-2030) & (K USD/Unit)
    Figure 6. 3D IC and 2.5D IC Packaging Report Years Considered
    Figure 7. Global 3D IC and 2.5D IC Packaging Players Revenue Ranking (2023) & (US$ Million)
    Figure 8. Global 3D IC and 2.5D IC Packaging Players Sales Volume Ranking (2023) & (K Units)
    Figure 9. The 5 and 10 Largest Manufacturers in the World: Market Share by 3D IC and 2.5D IC Packaging Revenue in 2023
    Figure 10. 3D IC and 2.5D IC Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2019 VS 2023
    Figure 11. 3D Wafer-level Chip-scale Packaging Picture
    Figure 12. 3D TSV Picture
    Figure 13. 2.5D Picture
    Figure 14. Global 3D IC and 2.5D IC Packaging Sales Value by Type (2019 VS 2023 VS 2030) & (US$ Million)
    Figure 15. Global 3D IC and 2.5D IC Packaging Sales Value Market Share by Type, 2023 & 2030
    Figure 16. Global 3D IC and 2.5D IC Packaging Sales Volume by Type (2019 VS 2023 VS 2030) & (K Units)
    Figure 17. Global 3D IC and 2.5D IC Packaging Sales Volume Market Share by Type, 2023 & 2030
    Figure 18. Global 3D IC and 2.5D IC Packaging Price by Type (2019-2030) & (K USD/Unit)
    Figure 19. Product Picture of Logic
    Figure 20. Product Picture of Imaging & Optoelectronics
    Figure 21. Product Picture of Memory
    Figure 22. Product Picture of MEMS/Sensors
    Figure 23. Product Picture of LED
    Figure 24. Product Picture of Power
    Figure 25. Global 3D IC and 2.5D IC Packaging Sales Value by Application (2019 VS 2023 VS 2030) & (US$ Million)
    Figure 26. Global 3D IC and 2.5D IC Packaging Sales Value Market Share by Application, 2023 & 2030
    Figure 27. Global 3D IC and 2.5D IC Packaging Sales Volume by Application (2019 VS 2023 VS 2030) & (K Units)
    Figure 28. Global 3D IC and 2.5D IC Packaging Sales Volume Market Share by Application, 2023 & 2030
    Figure 29. Global 3D IC and 2.5D IC Packaging Price by Application (2019-2030) & (K USD/Unit)
    Figure 30. North America 3D IC and 2.5D IC Packaging Sales Value (2019-2030) & (US$ Million)
    Figure 31. North America 3D IC and 2.5D IC Packaging Sales Value by Country (%), 2023 VS 2030
    Figure 32. Europe 3D IC and 2.5D IC Packaging Sales Value (2019-2030) & (US$ Million)
    Figure 33. Europe 3D IC and 2.5D IC Packaging Sales Value by Country (%), 2023 VS 2030
    Figure 34. Asia Pacific 3D IC and 2.5D IC Packaging Sales Value (2019-2030) & (US$ Million)
    Figure 35. Asia Pacific 3D IC and 2.5D IC Packaging Sales Value by Country (%), 2023 VS 2030
    Figure 36. South America 3D IC and 2.5D IC Packaging Sales Value (2019-2030) & (US$ Million)
    Figure 37. South America 3D IC and 2.5D IC Packaging Sales Value by Country (%), 2023 VS 2030
    Figure 38. Middle East & Africa 3D IC and 2.5D IC Packaging Sales Value (2019-2030) & (US$ Million)
    Figure 39. Middle East & Africa 3D IC and 2.5D IC Packaging Sales Value by Country (%), 2023 VS 2030
    Figure 40. Key Countries/Regions 3D IC and 2.5D IC Packaging Sales Value (%), (2019-2030)
    Figure 41. Key Countries/Regions 3D IC and 2.5D IC Packaging Sales Volume (%), (2019-2030)
    Figure 42. United States 3D IC and 2.5D IC Packaging Sales Value, (2019-2030) & (US$ Million)
    Figure 43. United States 3D IC and 2.5D IC Packaging Sales Value by Type (%), 2023 VS 2030
    Figure 44. United States 3D IC and 2.5D IC Packaging Sales Value by Application (%), 2023 VS 2030
    Figure 45. Europe 3D IC and 2.5D IC Packaging Sales Value, (2019-2030) & (US$ Million)
    Figure 46. Europe 3D IC and 2.5D IC Packaging Sales Value by Type (%), 2023 VS 2030
    Figure 47. Europe 3D IC and 2.5D IC Packaging Sales Value by Application (%), 2023 VS 2030
    Figure 48. China 3D IC and 2.5D IC Packaging Sales Value, (2019-2030) & (US$ Million)
    Figure 49. China 3D IC and 2.5D IC Packaging Sales Value by Type (%), 2023 VS 2030
    Figure 50. China 3D IC and 2.5D IC Packaging Sales Value by Application (%), 2023 VS 2030
    Figure 51. Japan 3D IC and 2.5D IC Packaging Sales Value, (2019-2030) & (US$ Million)
    Figure 52. Japan 3D IC and 2.5D IC Packaging Sales Value by Type (%), 2023 VS 2030
    Figure 53. Japan 3D IC and 2.5D IC Packaging Sales Value by Application (%), 2023 VS 2030
    Figure 54. South Korea 3D IC and 2.5D IC Packaging Sales Value, (2019-2030) & (US$ Million)
    Figure 55. South Korea 3D IC and 2.5D IC Packaging Sales Value by Type (%), 2023 VS 2030
    Figure 56. South Korea 3D IC and 2.5D IC Packaging Sales Value by Application (%), 2023 VS 2030
    Figure 57. Southeast Asia 3D IC and 2.5D IC Packaging Sales Value, (2019-2030) & (US$ Million)
    Figure 58. Southeast Asia 3D IC and 2.5D IC Packaging Sales Value by Type (%), 2023 VS 2030
    Figure 59. Southeast Asia 3D IC and 2.5D IC Packaging Sales Value by Application (%), 2023 VS 2030
    Figure 60. India 3D IC and 2.5D IC Packaging Sales Value, (2019-2030) & (US$ Million)
    Figure 61. India 3D IC and 2.5D IC Packaging Sales Value by Type (%), 2023 VS 2030
    Figure 62. India 3D IC and 2.5D IC Packaging Sales Value by Application (%), 2023 VS 2030
    Figure 63. 3D IC and 2.5D IC Packaging Industrial Chain
    Figure 64. 3D IC and 2.5D IC Packaging Manufacturing Cost Structure
    Figure 65. Channels of Distribution (Direct Sales, and Distribution)
    Figure 66. Bottom-up and Top-down Approaches for This Report
    Figure 67. Data Triangulation
    Figure 68. Key Executives Interviewed

Description

The global market for 3D IC and 2.5D IC Packaging was estimated to be worth US$ 100020 million in 2023 and is forecast to a readjusted size of US$ 268230 million by 2030 with a CAGR of 15.0% during the forecast period 2024-2030
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.

Report Scope
This report aims to provide a comprehensive presentation of the global market for 3D IC and 2.5D IC Packaging, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of 3D IC and 2.5D IC Packaging by region & country, by Type, and by Application.

The 3D IC and 2.5D IC Packaging market size, estimations, and forecasts are provided in terms of sales volume (K Units) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 3D IC and 2.5D IC Packaging.

Market Segmentation

Related Reports

Global 3D IC and 2.5D IC Packaging Market Research Report 2023
According to QYResearch’s new survey, global 3D IC and 2.5D IC Packaging market is projected to reac
Published: 2023-06-11
Pages: 89
USD 2900.00
(Single User License)
Global 3D IC and 2.5D IC Packaging Industry Research Report, Growth Trends and Competitive Analysis 2023-2029
The global 3D IC and 2.5D IC Packaging market size was US$ 100020 million in 2022 and is forecast to
Published: 2023-05-30
Pages: 107
USD 5600.00
(Single User License)
Global 3D IC and 2.5D IC Packaging Market Report, History and Forecast 2018-2029, Breakdown Data by Manufacturers, Key Regions, Types and Application
3D IC and 2.5D IC Packaging report published by QYResearch reveals that COVID-19 and Russia-Ukraine
Published: 2023-05-31
Pages: 94
USD 3350.00
(Single User License)
3D IC and 2.5D IC Packaging - Global Market Insights and Sales Trends 2024
The global 3D IC and 2.5D IC Packaging market size is expected to reach US$ 268230 million by 2029,
Published: 2023-11-15
Pages: 93
USD 3350.00
(Single User License)
Global 3D IC and 2.5D IC Packaging Market Research Report 2024
The global 3D IC and 2.5D IC Packaging market was valued at US$ 100020 million in 2023 and is antici
Published: 2024-01-04
Pages: 94
USD 2900.00
(Single User License)
Global 3D IC and 2.5D IC Packaging Market Insights, Forecast to 2030
The global 3D IC and 2.5D IC Packaging market is projected to grow from US$ 116030 million in 2024 t
Published: 2024-04-19
Pages: 85
USD 4900.00
(Single User License)
Global 3D IC and 2.5D IC Packaging Market Research Report 2025
The global market for 3D IC and 2.5D IC Packaging was valued at US$ 131680 million in the year 2024
Published: 2025-02-21
Pages: 83
USD 2900.00
(Single User License)
Global 3D IC and 2.5D IC Packaging Sales Market Report, Competitive Analysis and Regional Opportunities 2025-2031
The global 3D IC and 2.5D IC Packaging market size was US$ 131680 million in 2024 and is forecast to
Published: 2025-02-21
Pages: 70
USD 4250.00
(Single User License)
3D IC and 2.5D IC Packaging- Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031
The global market for 3D IC and 2.5D IC Packaging was estimated to be worth US$ 131680 million in 20
Published: 2025-02-21
Pages: 85
USD 3950.00
(Single User License)