Global Temporary Wafer Bonding Materials Market Research Report 2023

Industry: Electronics & Semiconductor

Published: 2023-08-04

Pages: 99 Pages

Report ld: 1539743

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Description
Table of Contents
Table of Figures
Related Reports
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Description
Table of Contents
Table of Figures
Related Reports
PDF Download

Description

Temporary Wafer Bonding Materials provide rigid support for ultra-thin wafers during the backside process, enabling them to complete the complex back-end processing of ultra-thin wafers
According to QYResearch’s new survey, global Temporary Wafer Bonding Materials market is projected to reach US$ 1936.2 million in 2029, increasing from US$ 1264 million in 2022, with the CAGR of 6.3% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Temporary Wafer Bonding Materials market research.

The market for temporary wafer bonding materials has been growing steadily in recent years. Temporary wafer bonding is a process used in semiconductor manufacturing and advanced packaging technologies. It involves bonding a device wafer to a carrier wafer using a temporary bonding material. This bonding enables subsequent processing steps such as thinning, 3D integration, and back-end processing.

The demand for temporary wafer bonding materials has been driven by several factors, including:
Advanced Packaging Technologies: Temporary wafer bonding materials play a crucial role in advanced packaging technologies such as 3D integration, stacked die packaging, and system-in-package (SiP) solutions. These technologies require temporary bonding to enable the fabrication of multiple layers or the integration of diverse components into a single package.

Wafer Thinning: Temporary bonding materials are essential for thinning the device wafer to achieve desired thicknesses in processes like wafer thinning for backside illumination (BSI) image sensors or through-silicon via (TSV) fabrication for 3D integration.

Yield Improvement: Temporary wafer bonding helps protect delicate or fragile wafers during processing, reducing the risk of damage and improving yield in the manufacturing process.

Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Temporary Wafer Bonding Materials market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.

By Company
    Brewer Science
    Samcien Semiconductor Materials
    Sekisui Chemical
    3M
    HD MicroSystems (DuPont)
    Dow
    Henkel
    Nissan Chemical
    TOKYO OHKA KOGYO
    AI Technology

Segment by Type
    Thermoplastic Materials
    UV Curing Materials
    Composite Films
    Metallic Materials
    Others

Segment by Application
    Wafer-level Packaging
    MEMS
    Compound Semiconductor
    Others

Production by Region
    North America
    Europe
    China
    Japan

Consumption by Region
    North America
        United States
        Canada
    Europe
        Germany
        France
        U.K.
        Italy
        Russia
    Asia-Pacific
        China
        Japan
        South Korea
        India
        Australia
        China Taiwan
        Indonesia
        Thailand
        Malaysia
    Latin America, Middle East & Africa
        Mexico
        Brazil
        Turkey
        GCC Countries

The Temporary Wafer Bonding Materials report covers below items:
Chapter 1: Product Basic Information (Definition, Type and Application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source

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Table of Contents

1 Temporary Wafer Bonding Materials Market Overview
    1.1 Product Definition
    1.2 Temporary Wafer Bonding Materials Segment by Type
        1.2.1 Global Temporary Wafer Bonding Materials Market Value Growth Rate Analysis by Type 2022 VS 2029
        1.2.2 Thermoplastic Materials
        1.2.3 UV Curing Materials
        1.2.4 Composite Films
        1.2.5 Metallic Materials
        1.2.6 Others
    1.3 Temporary Wafer Bonding Materials Segment by Application
        1.3.1 Global Temporary Wafer Bonding Materials Market Value Growth Rate Analysis by Application: 2022 VS 2029
        1.3.2 Wafer-level Packaging
        1.3.3 MEMS
        1.3.4 Compound Semiconductor
        1.3.5 Others
    1.4 Global Market Growth Prospects
        1.4.1 Global Temporary Wafer Bonding Materials Production Value Estimates and Forecasts (2018-2029)
        1.4.2 Global Temporary Wafer Bonding Materials Production Capacity Estimates and Forecasts (2018-2029)
        1.4.3 Global Temporary Wafer Bonding Materials Production Estimates and Forecasts (2018-2029)
        1.4.4 Global Temporary Wafer Bonding Materials Market Average Price Estimates and Forecasts (2018-2029)
    1.5 Assumptions and Limitations

2 Market Competition by Manufacturers
    2.1 Global Temporary Wafer Bonding Materials Production Market Share by Manufacturers (2018-2023)
    2.2 Global Temporary Wafer Bonding Materials Production Value Market Share by Manufacturers (2018-2023)
    2.3 Global Key Players of Temporary Wafer Bonding Materials, Industry Ranking, 2021 VS 2022 VS 2023
    2.4 Global Temporary Wafer Bonding Materials Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
    2.5 Global Temporary Wafer Bonding Materials Average Price by Manufacturers (2018-2023)
    2.6 Global Key Manufacturers of Temporary Wafer Bonding Materials, Manufacturing Base Distribution and Headquarters
    2.7 Global Key Manufacturers of Temporary Wafer Bonding Materials, Product Offered and Application
    2.8 Global Key Manufacturers of Temporary Wafer Bonding Materials, Date of Enter into This Industry
    2.9 Temporary Wafer Bonding Materials Market Competitive Situation and Trends
        2.9.1 Temporary Wafer Bonding Materials Market Concentration Rate
        2.9.2 Global 5 and 10 Largest Temporary Wafer Bonding Materials Players Market Share by Revenue
    2.10 Mergers & Acquisitions, Expansion

3 Temporary Wafer Bonding Materials Production by Region
    3.1 Global Temporary Wafer Bonding Materials Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
    3.2 Global Temporary Wafer Bonding Materials Production Value by Region (2018-2029)
        3.2.1 Global Temporary Wafer Bonding Materials Production Value Market Share by Region (2018-2023)
        3.2.2 Global Forecasted Production Value of Temporary Wafer Bonding Materials by Region (2024-2029)
    3.3 Global Temporary Wafer Bonding Materials Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
    3.4 Global Temporary Wafer Bonding Materials Production by Region (2018-2029)
        3.4.1 Global Temporary Wafer Bonding Materials Production Market Share by Region (2018-2023)
        3.4.2 Global Forecasted Production of Temporary Wafer Bonding Materials by Region (2024-2029)
    3.5 Global Temporary Wafer Bonding Materials Market Price Analysis by Region (2018-2023)
    3.6 Global Temporary Wafer Bonding Materials Production and Value, Year-over-Year Growth
        3.6.1 North America Temporary Wafer Bonding Materials Production Value Estimates and Forecasts (2018-2029)
        3.6.2 Europe Temporary Wafer Bonding Materials Production Value Estimates and Forecasts (2018-2029)
        3.6.3 China Temporary Wafer Bonding Materials Production Value Estimates and Forecasts (2018-2029)
        3.6.4 Japan Temporary Wafer Bonding Materials Production Value Estimates and Forecasts (2018-2029)

4 Temporary Wafer Bonding Materials Consumption by Region
    4.1 Global Temporary Wafer Bonding Materials Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
    4.2 Global Temporary Wafer Bonding Materials Consumption by Region (2018-2029)
        4.2.1 Global Temporary Wafer Bonding Materials Consumption by Region (2018-2023)
        4.2.2 Global Temporary Wafer Bonding Materials Forecasted Consumption by Region (2024-2029)
    4.3 North America
        4.3.1 North America Temporary Wafer Bonding Materials Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
        4.3.2 North America Temporary Wafer Bonding Materials Consumption by Country (2018-2029)
        4.3.3 United States
        4.3.4 Canada
    4.4 Europe
        4.4.1 Europe Temporary Wafer Bonding Materials Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
        4.4.2 Europe Temporary Wafer Bonding Materials Consumption by Country (2018-2029)
        4.4.3 Germany
        4.4.4 France
        4.4.5 U.K.
        4.4.6 Italy
        4.4.7 Russia
    4.5 Asia Pacific
        4.5.1 Asia Pacific Temporary Wafer Bonding Materials Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
        4.5.2 Asia Pacific Temporary Wafer Bonding Materials Consumption by Region (2018-2029)
        4.5.3 China
        4.5.4 Japan
        4.5.5 South Korea
        4.5.6 China Taiwan
        4.5.7 Southeast Asia
        4.5.8 India
    4.6 Latin America, Middle East & Africa
        4.6.1 Latin America, Middle East & Africa Temporary Wafer Bonding Materials Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
        4.6.2 Latin America, Middle East & Africa Temporary Wafer Bonding Materials Consumption by Country (2018-2029)
        4.6.3 Mexico
        4.6.4 Brazil
        4.6.5 Turkey

5 Segment by Type
    5.1 Global Temporary Wafer Bonding Materials Production by Type (2018-2029)
        5.1.1 Global Temporary Wafer Bonding Materials Production by Type (2018-2023)
        5.1.2 Global Temporary Wafer Bonding Materials Production by Type (2024-2029)
        5.1.3 Global Temporary Wafer Bonding Materials Production Market Share by Type (2018-2029)
    5.2 Global Temporary Wafer Bonding Materials Production Value by Type (2018-2029)
        5.2.1 Global Temporary Wafer Bonding Materials Production Value by Type (2018-2023)
        5.2.2 Global Temporary Wafer Bonding Materials Production Value by Type (2024-2029)
        5.2.3 Global Temporary Wafer Bonding Materials Production Value Market Share by Type (2018-2029)
    5.3 Global Temporary Wafer Bonding Materials Price by Type (2018-2029)

6 Segment by Application
    6.1 Global Temporary Wafer Bonding Materials Production by Application (2018-2029)
        6.1.1 Global Temporary Wafer Bonding Materials Production by Application (2018-2023)
        6.1.2 Global Temporary Wafer Bonding Materials Production by Application (2024-2029)
        6.1.3 Global Temporary Wafer Bonding Materials Production Market Share by Application (2018-2029)
    6.2 Global Temporary Wafer Bonding Materials Production Value by Application (2018-2029)
        6.2.1 Global Temporary Wafer Bonding Materials Production Value by Application (2018-2023)
        6.2.2 Global Temporary Wafer Bonding Materials Production Value by Application (2024-2029)
        6.2.3 Global Temporary Wafer Bonding Materials Production Value Market Share by Application (2018-2029)
    6.3 Global Temporary Wafer Bonding Materials Price by Application (2018-2029)

7 Key Companies Profiled
    7.1 Brewer Science
        7.1.1 Brewer Science Temporary Wafer Bonding Materials Corporation Information
        7.1.2 Brewer Science Temporary Wafer Bonding Materials Product Portfolio
        7.1.3 Brewer Science Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2018-2023)
        7.1.4 Brewer Science Main Business and Markets Served
        7.1.5 Brewer Science Recent Developments/Updates
    7.2 Samcien Semiconductor Materials
        7.2.1 Samcien Semiconductor Materials Temporary Wafer Bonding Materials Corporation Information
        7.2.2 Samcien Semiconductor Materials Temporary Wafer Bonding Materials Product Portfolio
        7.2.3 Samcien Semiconductor Materials Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2018-2023)
        7.2.4 Samcien Semiconductor Materials Main Business and Markets Served
        7.2.5 Samcien Semiconductor Materials Recent Developments/Updates
    7.3 Sekisui Chemical
        7.3.1 Sekisui Chemical Temporary Wafer Bonding Materials Corporation Information
        7.3.2 Sekisui Chemical Temporary Wafer Bonding Materials Product Portfolio
        7.3.3 Sekisui Chemical Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2018-2023)
        7.3.4 Sekisui Chemical Main Business and Markets Served
        7.3.5 Sekisui Chemical Recent Developments/Updates
    7.4 3M
        7.4.1 3M Temporary Wafer Bonding Materials Corporation Information
        7.4.2 3M Temporary Wafer Bonding Materials Product Portfolio
        7.4.3 3M Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2018-2023)
        7.4.4 3M Main Business and Markets Served
        7.4.5 3M Recent Developments/Updates
    7.5 HD MicroSystems (DuPont)
        7.5.1 HD MicroSystems (DuPont) Temporary Wafer Bonding Materials Corporation Information
        7.5.2 HD MicroSystems (DuPont) Temporary Wafer Bonding Materials Product Portfolio
        7.5.3 HD MicroSystems (DuPont) Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2018-2023)
        7.5.4 HD MicroSystems (DuPont) Main Business and Markets Served
        7.5.5 HD MicroSystems (DuPont) Recent Developments/Updates
    7.6 Dow
        7.6.1 Dow Temporary Wafer Bonding Materials Corporation Information
        7.6.2 Dow Temporary Wafer Bonding Materials Product Portfolio
        7.6.3 Dow Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2018-2023)
        7.6.4 Dow Main Business and Markets Served
        7.6.5 Dow Recent Developments/Updates
    7.7 Henkel
        7.7.1 Henkel Temporary Wafer Bonding Materials Corporation Information
        7.7.2 Henkel Temporary Wafer Bonding Materials Product Portfolio
        7.7.3 Henkel Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2018-2023)
        7.7.4 Henkel Main Business and Markets Served
        7.7.5 Henkel Recent Developments/Updates
    7.8 Nissan Chemical
        7.8.1 Nissan Chemical Temporary Wafer Bonding Materials Corporation Information
        7.8.2 Nissan Chemical Temporary Wafer Bonding Materials Product Portfolio
        7.8.3 Nissan Chemical Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2018-2023)
        7.8.4 Nissan Chemical Main Business and Markets Served
        7.7.5 Nissan Chemical Recent Developments/Updates
    7.9 TOKYO OHKA KOGYO
        7.9.1 TOKYO OHKA KOGYO Temporary Wafer Bonding Materials Corporation Information
        7.9.2 TOKYO OHKA KOGYO Temporary Wafer Bonding Materials Product Portfolio
        7.9.3 TOKYO OHKA KOGYO Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2018-2023)
        7.9.4 TOKYO OHKA KOGYO Main Business and Markets Served
        7.9.5 TOKYO OHKA KOGYO Recent Developments/Updates
    7.10 AI Technology
        7.10.1 AI Technology Temporary Wafer Bonding Materials Corporation Information
        7.10.2 AI Technology Temporary Wafer Bonding Materials Product Portfolio
        7.10.3 AI Technology Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2018-2023)
        7.10.4 AI Technology Main Business and Markets Served
        7.10.5 AI Technology Recent Developments/Updates

8 Industry Chain and Sales Channels Analysis
    8.1 Temporary Wafer Bonding Materials Industry Chain Analysis
    8.2 Temporary Wafer Bonding Materials Key Raw Materials
        8.2.1 Key Raw Materials
        8.2.2 Raw Materials Key Suppliers
    8.3 Temporary Wafer Bonding Materials Production Mode & Process
    8.4 Temporary Wafer Bonding Materials Sales and Marketing
        8.4.1 Temporary Wafer Bonding Materials Sales Channels
        8.4.2 Temporary Wafer Bonding Materials Distributors
    8.5 Temporary Wafer Bonding Materials Customers

9 Temporary Wafer Bonding Materials Market Dynamics
    9.1 Temporary Wafer Bonding Materials Industry Trends
    9.2 Temporary Wafer Bonding Materials Market Drivers
    9.3 Temporary Wafer Bonding Materials Market Challenges
    9.4 Temporary Wafer Bonding Materials Market Restraints

10 Research Finding and Conclusion

11 Methodology and Data Source
    11.1 Methodology/Research Approach
        11.1.1 Research Programs/Design
        11.1.2 Market Size Estimation
        11.1.3 Market Breakdown and Data Triangulation
    11.2 Data Source
        11.2.1 Secondary Sources
        11.2.2 Primary Sources
    11.3 Author List
    11.4 Disclaimer

Table of Figures

List of Tables
    Table 1. Global Temporary Wafer Bonding Materials Market Value by Type, (US$ Million) & (2022 VS 2029)
    Table 2. Global Temporary Wafer Bonding Materials Market Value by Application, (US$ Million) & (2022 VS 2029)
    Table 3. Global Temporary Wafer Bonding Materials Production Capacity (Kiloton) by Manufacturers in 2022
    Table 4. Global Temporary Wafer Bonding Materials Production by Manufacturers (2018-2023) & (Kiloton)
    Table 5. Global Temporary Wafer Bonding Materials Production Market Share by Manufacturers (2018-2023)
    Table 6. Global Temporary Wafer Bonding Materials Production Value by Manufacturers (2018-2023) & (US$ Million)
    Table 7. Global Temporary Wafer Bonding Materials Production Value Share by Manufacturers (2018-2023)
    Table 8. Global Temporary Wafer Bonding Materials Industry Ranking 2021 VS 2022 VS 2023
    Table 9. Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Temporary Wafer Bonding Materials as of 2022)
    Table 10. Global Market Temporary Wafer Bonding Materials Average Price by Manufacturers (US$/Ton) & (2018-2023)
    Table 11. Manufacturers Temporary Wafer Bonding Materials Production Sites and Area Served
    Table 12. Manufacturers Temporary Wafer Bonding Materials Product Types
    Table 13. Global Temporary Wafer Bonding Materials Manufacturers Market Concentration Ratio (CR5 and HHI)
    Table 14. Mergers & Acquisitions, Expansion
    Table 15. Global Temporary Wafer Bonding Materials Production Value by Region: 2018 VS 2022 VS 2029 (US$ Million)
    Table 16. Global Temporary Wafer Bonding Materials Production Value (US$ Million) by Region (2018-2023)
    Table 17. Global Temporary Wafer Bonding Materials Production Value Market Share by Region (2018-2023)
    Table 18. Global Temporary Wafer Bonding Materials Production Value (US$ Million) Forecast by Region (2024-2029)
    Table 19. Global Temporary Wafer Bonding Materials Production Value Market Share Forecast by Region (2024-2029)
    Table 20. Global Temporary Wafer Bonding Materials Production Comparison by Region: 2018 VS 2022 VS 2029 (Kiloton)
    Table 21. Global Temporary Wafer Bonding Materials Production (Kiloton) by Region (2018-2023)
    Table 22. Global Temporary Wafer Bonding Materials Production Market Share by Region (2018-2023)
    Table 23. Global Temporary Wafer Bonding Materials Production (Kiloton) Forecast by Region (2024-2029)
    Table 24. Global Temporary Wafer Bonding Materials Production Market Share Forecast by Region (2024-2029)
    Table 25. Global Temporary Wafer Bonding Materials Market Average Price (US$/Ton) by Region (2018-2023)
    Table 26. Global Temporary Wafer Bonding Materials Market Average Price (US$/Ton) by Region (2024-2029)
    Table 27. Global Temporary Wafer Bonding Materials Consumption Growth Rate by Region: 2018 VS 2022 VS 2029 (Kiloton)
    Table 28. Global Temporary Wafer Bonding Materials Consumption by Region (2018-2023) & (Kiloton)
    Table 29. Global Temporary Wafer Bonding Materials Consumption Market Share by Region (2018-2023)
    Table 30. Global Temporary Wafer Bonding Materials Forecasted Consumption by Region (2024-2029) & (Kiloton)
    Table 31. Global Temporary Wafer Bonding Materials Forecasted Consumption Market Share by Region (2018-2023)
    Table 32. North America Temporary Wafer Bonding Materials Consumption Growth Rate by Country: 2018 VS 2022 VS 2029 (Kiloton)
    Table 33. North America Temporary Wafer Bonding Materials Consumption by Country (2018-2023) & (Kiloton)
    Table 34. North America Temporary Wafer Bonding Materials Consumption by Country (2024-2029) & (Kiloton)
    Table 35. Europe Temporary Wafer Bonding Materials Consumption Growth Rate by Country: 2018 VS 2022 VS 2029 (Kiloton)
    Table 36. Europe Temporary Wafer Bonding Materials Consumption by Country (2018-2023) & (Kiloton)
    Table 37. Europe Temporary Wafer Bonding Materials Consumption by Country (2024-2029) & (Kiloton)
    Table 38. Asia Pacific Temporary Wafer Bonding Materials Consumption Growth Rate by Region: 2018 VS 2022 VS 2029 (Kiloton)
    Table 39. Asia Pacific Temporary Wafer Bonding Materials Consumption by Region (2018-2023) & (Kiloton)
    Table 40. Asia Pacific Temporary Wafer Bonding Materials Consumption by Region (2024-2029) & (Kiloton)
    Table 41. Latin America, Middle East & Africa Temporary Wafer Bonding Materials Consumption Growth Rate by Country: 2018 VS 2022 VS 2029 (Kiloton)
    Table 42. Latin America, Middle East & Africa Temporary Wafer Bonding Materials Consumption by Country (2018-2023) & (Kiloton)
    Table 43. Latin America, Middle East & Africa Temporary Wafer Bonding Materials Consumption by Country (2024-2029) & (Kiloton)
    Table 44. Global Temporary Wafer Bonding Materials Production (Kiloton) by Type (2018-2023)
    Table 45. Global Temporary Wafer Bonding Materials Production (Kiloton) by Type (2024-2029)
    Table 46. Global Temporary Wafer Bonding Materials Production Market Share by Type (2018-2023)
    Table 47. Global Temporary Wafer Bonding Materials Production Market Share by Type (2024-2029)
    Table 48. Global Temporary Wafer Bonding Materials Production Value (US$ Million) by Type (2018-2023)
    Table 49. Global Temporary Wafer Bonding Materials Production Value (US$ Million) by Type (2024-2029)
    Table 50. Global Temporary Wafer Bonding Materials Production Value Share by Type (2018-2023)
    Table 51. Global Temporary Wafer Bonding Materials Production Value Share by Type (2024-2029)
    Table 52. Global Temporary Wafer Bonding Materials Price (US$/Ton) by Type (2018-2023)
    Table 53. Global Temporary Wafer Bonding Materials Price (US$/Ton) by Type (2024-2029)
    Table 54. Global Temporary Wafer Bonding Materials Production (Kiloton) by Application (2018-2023)
    Table 55. Global Temporary Wafer Bonding Materials Production (Kiloton) by Application (2024-2029)
    Table 56. Global Temporary Wafer Bonding Materials Production Market Share by Application (2018-2023)
    Table 57. Global Temporary Wafer Bonding Materials Production Market Share by Application (2024-2029)
    Table 58. Global Temporary Wafer Bonding Materials Production Value (US$ Million) by Application (2018-2023)
    Table 59. Global Temporary Wafer Bonding Materials Production Value (US$ Million) by Application (2024-2029)
    Table 60. Global Temporary Wafer Bonding Materials Production Value Share by Application (2018-2023)
    Table 61. Global Temporary Wafer Bonding Materials Production Value Share by Application (2024-2029)
    Table 62. Global Temporary Wafer Bonding Materials Price (US$/Ton) by Application (2018-2023)
    Table 63. Global Temporary Wafer Bonding Materials Price (US$/Ton) by Application (2024-2029)
    Table 64. Brewer Science Temporary Wafer Bonding Materials Corporation Information
    Table 65. Brewer Science Specification and Application
    Table 66. Brewer Science Temporary Wafer Bonding Materials Production (Kiloton), Value (US$ Million), Price (US$/Ton) and Gross Margin (2018-2023)
    Table 67. Brewer Science Main Business and Markets Served
    Table 68. Brewer Science Recent Developments/Updates
    Table 69. Samcien Semiconductor Materials Temporary Wafer Bonding Materials Corporation Information
    Table 70. Samcien Semiconductor Materials Specification and Application
    Table 71. Samcien Semiconductor Materials Temporary Wafer Bonding Materials Production (Kiloton), Value (US$ Million), Price (US$/Ton) and Gross Margin (2018-2023)
    Table 72. Samcien Semiconductor Materials Main Business and Markets Served
    Table 73. Samcien Semiconductor Materials Recent Developments/Updates
    Table 74. Sekisui Chemical Temporary Wafer Bonding Materials Corporation Information
    Table 75. Sekisui Chemical Specification and Application
    Table 76. Sekisui Chemical Temporary Wafer Bonding Materials Production (Kiloton), Value (US$ Million), Price (US$/Ton) and Gross Margin (2018-2023)
    Table 77. Sekisui Chemical Main Business and Markets Served
    Table 78. Sekisui Chemical Recent Developments/Updates
    Table 79. 3M Temporary Wafer Bonding Materials Corporation Information
    Table 80. 3M Specification and Application
    Table 81. 3M Temporary Wafer Bonding Materials Production (Kiloton), Value (US$ Million), Price (US$/Ton) and Gross Margin (2018-2023)
    Table 82. 3M Main Business and Markets Served
    Table 83. 3M Recent Developments/Updates
    Table 84. HD MicroSystems (DuPont) Temporary Wafer Bonding Materials Corporation Information
    Table 85. HD MicroSystems (DuPont) Specification and Application
    Table 86. HD MicroSystems (DuPont) Temporary Wafer Bonding Materials Production (Kiloton), Value (US$ Million), Price (US$/Ton) and Gross Margin (2018-2023)
    Table 87. HD MicroSystems (DuPont) Main Business and Markets Served
    Table 88. HD MicroSystems (DuPont) Recent Developments/Updates
    Table 89. Dow Temporary Wafer Bonding Materials Corporation Information
    Table 90. Dow Specification and Application
    Table 91. Dow Temporary Wafer Bonding Materials Production (Kiloton), Value (US$ Million), Price (US$/Ton) and Gross Margin (2018-2023)
    Table 92. Dow Main Business and Markets Served
    Table 93. Dow Recent Developments/Updates
    Table 94. Henkel Temporary Wafer Bonding Materials Corporation Information
    Table 95. Henkel Specification and Application
    Table 96. Henkel Temporary Wafer Bonding Materials Production (Kiloton), Value (US$ Million), Price (US$/Ton) and Gross Margin (2018-2023)
    Table 97. Henkel Main Business and Markets Served
    Table 98. Henkel Recent Developments/Updates
    Table 99. Nissan Chemical Temporary Wafer Bonding Materials Corporation Information
    Table 100. Nissan Chemical Specification and Application
    Table 101. Nissan Chemical Temporary Wafer Bonding Materials Production (Kiloton), Value (US$ Million), Price (US$/Ton) and Gross Margin (2018-2023)
    Table 102. Nissan Chemical Main Business and Markets Served
    Table 103. Nissan Chemical Recent Developments/Updates
    Table 104. TOKYO OHKA KOGYO Temporary Wafer Bonding Materials Corporation Information
    Table 105. TOKYO OHKA KOGYO Specification and Application
    Table 106. TOKYO OHKA KOGYO Temporary Wafer Bonding Materials Production (Kiloton), Value (US$ Million), Price (US$/Ton) and Gross Margin (2018-2023)
    Table 107. TOKYO OHKA KOGYO Main Business and Markets Served
    Table 108. TOKYO OHKA KOGYO Recent Developments/Updates
    Table 109. AI Technology Temporary Wafer Bonding Materials Corporation Information
    Table 110. AI Technology Specification and Application
    Table 111. AI Technology Temporary Wafer Bonding Materials Production (Kiloton), Value (US$ Million), Price (US$/Ton) and Gross Margin (2018-2023)
    Table 112. AI Technology Main Business and Markets Served
    Table 113. AI Technology Recent Developments/Updates
    Table 114. Key Raw Materials Lists
    Table 115. Raw Materials Key Suppliers Lists
    Table 116. Temporary Wafer Bonding Materials Distributors List
    Table 117. Temporary Wafer Bonding Materials Customers List
    Table 118. Temporary Wafer Bonding Materials Market Trends
    Table 119. Temporary Wafer Bonding Materials Market Drivers
    Table 120. Temporary Wafer Bonding Materials Market Challenges
    Table 121. Temporary Wafer Bonding Materials Market Restraints
    Table 122. Research Programs/Design for This Report
    Table 123. Key Data Information from Secondary Sources
    Table 124. Key Data Information from Primary Sources
List of Figures
    Figure 1. Product Picture of Temporary Wafer Bonding Materials
    Figure 2. Global Temporary Wafer Bonding Materials Market Value by Type, (US$ Million) & (2022 VS 2029)
    Figure 3. Global Temporary Wafer Bonding Materials Market Share by Type: 2022 VS 2029
    Figure 4. Thermoplastic Materials Product Picture
    Figure 5. UV Curing Materials Product Picture
    Figure 6. Composite Films Product Picture
    Figure 7. Metallic Materials Product Picture
    Figure 8. Others Product Picture
    Figure 9. Global Temporary Wafer Bonding Materials Market Value by Application, (US$ Million) & (2022 VS 2029)
    Figure 10. Global Temporary Wafer Bonding Materials Market Share by Application: 2022 VS 2029
    Figure 11. Wafer-level Packaging
    Figure 12. MEMS
    Figure 13. Compound Semiconductor
    Figure 14. Others
    Figure 15. Global Temporary Wafer Bonding Materials Production Value (US$ Million), 2018 VS 2022 VS 2029
    Figure 16. Global Temporary Wafer Bonding Materials Production Value (US$ Million) & (2018-2029)
    Figure 17. Global Temporary Wafer Bonding Materials Production (Kiloton) & (2018-2029)
    Figure 18. Global Temporary Wafer Bonding Materials Average Price (US$/Ton) & (2018-2029)
    Figure 19. Temporary Wafer Bonding Materials Report Years Considered
    Figure 20. Temporary Wafer Bonding Materials Production Share by Manufacturers in 2022
    Figure 21. Temporary Wafer Bonding Materials Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2018 VS 2022
    Figure 22. The Global 5 and 10 Largest Players: Market Share by Temporary Wafer Bonding Materials Revenue in 2022
    Figure 23. Global Temporary Wafer Bonding Materials Production Value by Region: 2018 VS 2022 VS 2029 (US$ Million)
    Figure 24. Global Temporary Wafer Bonding Materials Production Value Market Share by Region: 2018 VS 2022 VS 2029
    Figure 25. Global Temporary Wafer Bonding Materials Production Comparison by Region: 2018 VS 2022 VS 2029 (Kiloton)
    Figure 26. Global Temporary Wafer Bonding Materials Production Market Share by Region: 2018 VS 2022 VS 2029
    Figure 27. North America Temporary Wafer Bonding Materials Production Value (US$ Million) Growth Rate (2018-2029)
    Figure 28. Europe Temporary Wafer Bonding Materials Production Value (US$ Million) Growth Rate (2018-2029)
    Figure 29. China Temporary Wafer Bonding Materials Production Value (US$ Million) Growth Rate (2018-2029)
    Figure 30. Japan Temporary Wafer Bonding Materials Production Value (US$ Million) Growth Rate (2018-2029)
    Figure 31. Global Temporary Wafer Bonding Materials Consumption by Region: 2018 VS 2022 VS 2029 (Kiloton)
    Figure 32. Global Temporary Wafer Bonding Materials Consumption Market Share by Region: 2018 VS 2022 VS 2029
    Figure 33. North America Temporary Wafer Bonding Materials Consumption and Growth Rate (2018-2023) & (Kiloton)
    Figure 34. North America Temporary Wafer Bonding Materials Consumption Market Share by Country (2018-2029)
    Figure 35. Canada Temporary Wafer Bonding Materials Consumption and Growth Rate (2018-2023) & (Kiloton)
    Figure 36. U.S. Temporary Wafer Bonding Materials Consumption and Growth Rate (2018-2023) & (Kiloton)
    Figure 37. Europe Temporary Wafer Bonding Materials Consumption and Growth Rate (2018-2023) & (Kiloton)
    Figure 38. Europe Temporary Wafer Bonding Materials Consumption Market Share by Country (2018-2029)
    Figure 39. Germany Temporary Wafer Bonding Materials Consumption and Growth Rate (2018-2023) & (Kiloton)
    Figure 40. France Temporary Wafer Bonding Materials Consumption and Growth Rate (2018-2023) & (Kiloton)
    Figure 41. U.K. Temporary Wafer Bonding Materials Consumption and Growth Rate (2018-2023) & (Kiloton)
    Figure 42. Italy Temporary Wafer Bonding Materials Consumption and Growth Rate (2018-2023) & (Kiloton)
    Figure 43. Russia Temporary Wafer Bonding Materials Consumption and Growth Rate (2018-2023) & (Kiloton)
    Figure 44. Asia Pacific Temporary Wafer Bonding Materials Consumption and Growth Rate (2018-2023) & (Kiloton)
    Figure 45. Asia Pacific Temporary Wafer Bonding Materials Consumption Market Share by Regions (2018-2029)
    Figure 46. China Temporary Wafer Bonding Materials Consumption and Growth Rate (2018-2023) & (Kiloton)
    Figure 47. Japan Temporary Wafer Bonding Materials Consumption and Growth Rate (2018-2023) & (Kiloton)
    Figure 48. South Korea Temporary Wafer Bonding Materials Consumption and Growth Rate (2018-2023) & (Kiloton)
    Figure 49. China Taiwan Temporary Wafer Bonding Materials Consumption and Growth Rate (2018-2023) & (Kiloton)
    Figure 50. Southeast Asia Temporary Wafer Bonding Materials Consumption and Growth Rate (2018-2023) & (Kiloton)
    Figure 51. India Temporary Wafer Bonding Materials Consumption and Growth Rate (2018-2023) & (Kiloton)
    Figure 52. Latin America, Middle East & Africa Temporary Wafer Bonding Materials Consumption and Growth Rate (2018-2023) & (Kiloton)
    Figure 53. Latin America, Middle East & Africa Temporary Wafer Bonding Materials Consumption Market Share by Country (2018-2029)
    Figure 54. Mexico Temporary Wafer Bonding Materials Consumption and Growth Rate (2018-2023) & (Kiloton)
    Figure 55. Brazil Temporary Wafer Bonding Materials Consumption and Growth Rate (2018-2023) & (Kiloton)
    Figure 56. Turkey Temporary Wafer Bonding Materials Consumption and Growth Rate (2018-2023) & (Kiloton)
    Figure 57. GCC Countries Temporary Wafer Bonding Materials Consumption and Growth Rate (2018-2023) & (Kiloton)
    Figure 58. Global Production Market Share of Temporary Wafer Bonding Materials by Type (2018-2029)
    Figure 59. Global Production Value Market Share of Temporary Wafer Bonding Materials by Type (2018-2029)
    Figure 60. Global Temporary Wafer Bonding Materials Price (US$/Ton) by Type (2018-2029)
    Figure 61. Global Production Market Share of Temporary Wafer Bonding Materials by Application (2018-2029)
    Figure 62. Global Production Value Market Share of Temporary Wafer Bonding Materials by Application (2018-2029)
    Figure 63. Global Temporary Wafer Bonding Materials Price (US$/Ton) by Application (2018-2029)
    Figure 64. Temporary Wafer Bonding Materials Value Chain
    Figure 65. Temporary Wafer Bonding Materials Production Process
    Figure 66. Channels of Distribution (Direct Vs Distribution)
    Figure 67. Distributors Profiles
    Figure 68. Bottom-up and Top-down Approaches for This Report
    Figure 69. Data Triangulation

Description

Temporary Wafer Bonding Materials provide rigid support for ultra-thin wafers during the backside process, enabling them to complete the complex back-end processing of ultra-thin wafers
According to QYResearch’s new survey, global Temporary Wafer Bonding Materials market is projected to reach US$ 1936.2 million in 2029, increasing from US$ 1264 million in 2022, with the CAGR of 6.3% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Temporary Wafer Bonding Materials market research.

The market for temporary wafer bonding materials has been growing steadily in recent years. Temporary wafer bonding is a process used in semiconductor manufacturing and advanced packaging technologies. It involves bonding a device wafer to a carrier wafer using a temporary bonding material. This bonding enables subsequent processing steps such as thinning, 3D integration, and back-end processing.

The demand for temporary wafer bonding materials has been driven by several factors, including:
Advanced Packaging Technologies: Temporary wafer bonding materials play a crucial role in advanced packaging technologies such as 3D integration, stacked die packaging, and system-in-package (SiP) solutions. These technologies require temporary bonding to enable the fabrication of multiple layers or the integration of diverse components into a single package.

Wafer Thinning: Temporary bonding materials are essential for thinning the device wafer to achieve desired thicknesses in processes like wafer thinning for backside illumination (BSI) image sensors or through-silicon via (TSV) fabrication for 3D integration.

Yield Improvement: Temporary wafer bonding helps protect delicate or fragile wafers during processing, reducing the risk of damage and improving yield in the manufacturing process.

Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Temporary Wafer Bonding Materials market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.

By Company
    Brewer Science
    Samcien Semiconductor Materials
    Sekisui Chemical
    3M
    HD MicroSystems (DuPont)
    Dow
    Henkel
    Nissan Chemical
    TOKYO OHKA KOGYO
    AI Technology

Segment by Type
    Thermoplastic Materials
    UV Curing Materials
    Composite Films
    Metallic Materials
    Others

Segment by Application
    Wafer-level Packaging
    MEMS
    Compound Semiconductor
    Others

Production by Region
    North America
    Europe
    China
    Japan

Consumption by Region
    North America
        United States
        Canada
    Europe
        Germany
        France
        U.K.
        Italy
        Russia
    Asia-Pacific
        China
        Japan
        South Korea
        India
        Australia
        China Taiwan
        Indonesia
        Thailand
        Malaysia
    Latin America, Middle East & Africa
        Mexico
        Brazil
        Turkey
        GCC Countries

The Temporary Wafer Bonding Materials report covers below items:
Chapter 1: Product Basic Information (Definition, Type and Application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source

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