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Global Small Outline Integrated Circuit (SOIC) Package Market Research Report 2023
Global Small Outline Integrated Circuit (SOIC) Package Market Research Report 2023
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Description
- Table of Contents
- Table of Figures
- PDF Download
A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs. The convention for naming the package is SOIC or SO followed by the number of pins. According to QYResearch’s new survey, global Small Outline Integrated Circuit (SOIC) Package market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029.
The global Small Outline Integrated Circuit (SOIC) package market refers to the market for a type of surface mount integrated circuit (IC) package known as SOIC. SOIC packages are widely used in the electronics industry for their compact size, ease of manufacturing, and compatibility with automated assembly processes.
Here are some key factors driving the growth of the global SOIC package market:
Miniaturization and High-Density Packaging: As electronic devices continue to become smaller and more compact, there is a growing demand for IC packages that offer high-density integration. SOIC packages are known for their small outline and compact size, allowing for efficient use of space on printed circuit boards (PCBs) and enabling the miniaturization of devices.
Wide Application in Various Industries: SOIC packages are used in a wide range of industries, including consumer electronics, automotive, industrial, telecommunications, and healthcare. They are suitable for applications such as power management, signal processing, microcontrollers, memory, and interface circuits. The broad applicability of SOIC packages contributes to their market growth.
Cost-Effectiveness and Manufacturing Efficiency: SOIC packages are cost-effective to manufacture compared to other types of IC packages, such as quad flat no-leads (QFN) or ball grid array (BGA). Additionally, their compatibility with automated assembly processes makes them highly efficient for high-volume production, reducing manufacturing costs and increasing productivity.
Thermal Performance and Reliability: SOIC packages have good thermal performance due to their exposed leads, which allows heat to be dissipated effectively. This feature is particularly important for power-related applications where heat dissipation is critical. Furthermore, SOIC packages offer good electrical performance and reliability, meeting the stringent requirements of various industries.
Compatibility with Legacy Systems: SOIC packages have been widely used for many years, and they have become a standard package type for many ICs. This compatibility with legacy systems makes them attractive for replacement or upgrade purposes, allowing for seamless integration into existing designs without major changes.
Advancements in Technology: The SOIC package market has benefited from advancements in semiconductor manufacturing technology. These advancements have led to the development of smaller pitch sizes, higher pin counts, and higher operating speeds for SOIC packages, expanding their capabilities and increasing their adoption in new applications.
Growing Demand for Portable and Wearable Devices: The increasing popularity of portable electronics, such as smartphones, tablets, wearables, and IoT devices, fuels the demand for compact and lightweight IC packages like SOIC. These devices require smaller and more energy-efficient components, driving the growth of the SOIC package market.
In conclusion, the global SOIC package market is driven by the need for miniaturization, high-density packaging, wide application in various industries, cost-effectiveness, manufacturing efficiency, thermal performance, compatibility with legacy systems, advancements in technology, and the demand for portable and wearable devices. As the electronics industry continues to evolve and demand for small, reliable, and high-performance IC packages increases, the market for SOIC packages is expected to grow significantly.The global Small Outline Integrated Circuit (SOIC) package market refers to the market for a type of surface mount integrated circuit (IC) package known as SOIC. SOIC packages are widely used in the electronics industry for their compact size, ease of manufacturing, and compatibility with automated assembly processes.
Here are some key factors driving the growth of the global SOIC package market:
Miniaturization and High-Density Packaging: As electronic devices continue to become smaller and more compact, there is a growing demand for IC packages that offer high-density integration. SOIC packages are known for their small outline and compact size, allowing for efficient use of space on printed circuit boards (PCBs) and enabling the miniaturization of devices.
Wide Application in Various Industries: SOIC packages are used in a wide range of industries, including consumer electronics, automotive, industrial, telecommunications, and healthcare. They are suitable for applications such as power management, signal processing, microcontrollers, memory, and interface circuits. The broad applicability of SOIC packages contributes to their market growth.
Cost-Effectiveness and Manufacturing Efficiency: SOIC packages are cost-effective to manufacture compared to other types of IC packages, such as quad flat no-leads (QFN) or ball grid array (BGA). Additionally, their compatibility with automated assembly processes makes them highly efficient for high-volume production, reducing manufacturing costs and increasing productivity.
Thermal Performance and Reliability: SOIC packages have good thermal performance due to their exposed leads, which allows heat to be dissipated effectively. This feature is particularly important for power-related applications where heat dissipation is critical. Furthermore, SOIC packages offer good electrical performance and reliability, meeting the stringent requirements of various industries.
Compatibility with Legacy Systems: SOIC packages have been widely used for many years, and they have become a standard package type for many ICs. This compatibility with legacy systems makes them attractive for replacement or upgrade purposes, allowing for seamless integration into existing designs without major changes.
Advancements in Technology: The SOIC package market has benefited from advancements in semiconductor manufacturing technology. These advancements have led to the development of smaller pitch sizes, higher pin counts, and higher operating speeds for SOIC packages, expanding their capabilities and increasing their adoption in new applications.
Growing Demand for Portable and Wearable Devices: The increasing popularity of portable electronics, such as smartphones, tablets, wearables, and IoT devices, fuels the demand for compact and lightweight IC packages like SOIC. These devices require smaller and more energy-efficient components, driving the growth of the SOIC package market.
In conclusion, the global SOIC package market is driven by the need for miniaturization, high-density packaging, wide application in various industries, cost-effectiveness, manufacturing efficiency, thermal performance, compatibility with legacy systems, advancements in technology, and the demand for portable and wearable devices. As the electronics industry continues to evolve and demand for small, reliable, and high-performance IC packages increases, the market for SOIC packages is expected to grow significantly.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Small Outline Integrated Circuit (SOIC) Package market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
3M
Enplas Corporation
Toshiba Electronic Devices and Storage Corporation
Intel Corporation
Loranger International Corporation
Komachine
Aries Electronics Inc
Johnstech International
Mill-Max Manufacturing Corporation
Molex
Foxconn
Sensata Technologies
Plastronics
TE Connectivity
Socionext America Inc
WinWay Technology Co
ChipMOS Technologies Inc
Yamaichi Electronics
Segment by Type
Mini-SOIC
Small Outline J-Lead Package
Others
Segment by Application
Industrial
Consumer Electronics
Automotive
Medical Devices
Military and Defense
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Southeast Asia
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The Small Outline Integrated Circuit (SOIC) Package report covers below items:
Chapter 1: Product Basic Information (Definition, Type and Application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source 1 Small Outline Integrated Circuit (SOIC) Package Market Overview
1.1 Product Definition
1.2 Small Outline Integrated Circuit (SOIC) Package Segment by Type
1.2.1 Global Small Outline Integrated Circuit (SOIC) Package Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Mini-SOIC
1.2.3 Small Outline J-Lead Package
1.2.4 Others
1.3 Small Outline Integrated Circuit (SOIC) Package Segment by Application
1.3.1 Global Small Outline Integrated Circuit (SOIC) Package Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Industrial
1.3.3 Consumer Electronics
1.3.4 Automotive
1.3.5 Medical Devices
1.3.6 Military and Defense
1.4 Global Market Growth Prospects
1.4.1 Global Small Outline Integrated Circuit (SOIC) Package Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Small Outline Integrated Circuit (SOIC) Package Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Small Outline Integrated Circuit (SOIC) Package Production Estimates and Forecasts (2018-2029)
1.4.4 Global Small Outline Integrated Circuit (SOIC) Package Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2.1 Global Small Outline Integrated Circuit (SOIC) Package Production Market Share by Manufacturers (2018-2023)
2.2 Global Small Outline Integrated Circuit (SOIC) Package Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Small Outline Integrated Circuit (SOIC) Package, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Small Outline Integrated Circuit (SOIC) Package Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Small Outline Integrated Circuit (SOIC) Package Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Small Outline Integrated Circuit (SOIC) Package, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Small Outline Integrated Circuit (SOIC) Package, Product Offered and Application
2.8 Global Key Manufacturers of Small Outline Integrated Circuit (SOIC) Package, Date of Enter into This Industry
2.9 Small Outline Integrated Circuit (SOIC) Package Market Competitive Situation and Trends
2.9.1 Small Outline Integrated Circuit (SOIC) Package Market Concentration Rate
2.9.2 Global 5 and 10 Largest Small Outline Integrated Circuit (SOIC) Package Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3.1 Global Small Outline Integrated Circuit (SOIC) Package Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Small Outline Integrated Circuit (SOIC) Package Production Value by Region (2018-2029)
3.2.1 Global Small Outline Integrated Circuit (SOIC) Package Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Small Outline Integrated Circuit (SOIC) Package by Region (2024-2029)
3.3 Global Small Outline Integrated Circuit (SOIC) Package Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Small Outline Integrated Circuit (SOIC) Package Production by Region (2018-2029)
3.4.1 Global Small Outline Integrated Circuit (SOIC) Package Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Small Outline Integrated Circuit (SOIC) Package by Region (2024-2029)
3.5 Global Small Outline Integrated Circuit (SOIC) Package Market Price Analysis by Region (2018-2023)
3.6 Global Small Outline Integrated Circuit (SOIC) Package Production and Value, Year-over-Year Growth
3.6.1 North America Small Outline Integrated Circuit (SOIC) Package Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Small Outline Integrated Circuit (SOIC) Package Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Small Outline Integrated Circuit (SOIC) Package Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Small Outline Integrated Circuit (SOIC) Package Production Value Estimates and Forecasts (2018-2029)
3.6.5 South Korea Small Outline Integrated Circuit (SOIC) Package Production Value Estimates and Forecasts (2018-2029)
4.1 Global Small Outline Integrated Circuit (SOIC) Package Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Small Outline Integrated Circuit (SOIC) Package Consumption by Region (2018-2029)
4.2.1 Global Small Outline Integrated Circuit (SOIC) Package Consumption by Region (2018-2023)
4.2.2 Global Small Outline Integrated Circuit (SOIC) Package Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Small Outline Integrated Circuit (SOIC) Package Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Small Outline Integrated Circuit (SOIC) Package Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Small Outline Integrated Circuit (SOIC) Package Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Small Outline Integrated Circuit (SOIC) Package Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Small Outline Integrated Circuit (SOIC) Package Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Small Outline Integrated Circuit (SOIC) Package Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Small Outline Integrated Circuit (SOIC) Package Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Small Outline Integrated Circuit (SOIC) Package Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5.1 Global Small Outline Integrated Circuit (SOIC) Package Production by Type (2018-2029)
5.1.1 Global Small Outline Integrated Circuit (SOIC) Package Production by Type (2018-2023)
5.1.2 Global Small Outline Integrated Circuit (SOIC) Package Production by Type (2024-2029)
5.1.3 Global Small Outline Integrated Circuit (SOIC) Package Production Market Share by Type (2018-2029)
5.2 Global Small Outline Integrated Circuit (SOIC) Package Production Value by Type (2018-2029)
5.2.1 Global Small Outline Integrated Circuit (SOIC) Package Production Value by Type (2018-2023)
5.2.2 Global Small Outline Integrated Circuit (SOIC) Package Production Value by Type (2024-2029)
5.2.3 Global Small Outline Integrated Circuit (SOIC) Package Production Value Market Share by Type (2018-2029)
5.3 Global Small Outline Integrated Circuit (SOIC) Package Price by Type (2018-2029)
6.1 Global Small Outline Integrated Circuit (SOIC) Package Production by Application (2018-2029)
6.1.1 Global Small Outline Integrated Circuit (SOIC) Package Production by Application (2018-2023)
6.1.2 Global Small Outline Integrated Circuit (SOIC) Package Production by Application (2024-2029)
6.1.3 Global Small Outline Integrated Circuit (SOIC) Package Production Market Share by Application (2018-2029)
6.2 Global Small Outline Integrated Circuit (SOIC) Package Production Value by Application (2018-2029)
6.2.1 Global Small Outline Integrated Circuit (SOIC) Package Production Value by Application (2018-2023)
6.2.2 Global Small Outline Integrated Circuit (SOIC) Package Production Value by Application (2024-2029)
6.2.3 Global Small Outline Integrated Circuit (SOIC) Package Production Value Market Share by Application (2018-2029)
6.3 Global Small Outline Integrated Circuit (SOIC) Package Price by Application (2018-2029)
7.1 3M
7.1.1 3M Small Outline Integrated Circuit (SOIC) Package Corporation Information
7.1.2 3M Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.1.3 3M Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2018-2023)
7.1.4 3M Main Business and Markets Served
7.1.5 3M Recent Developments/Updates
7.2 Enplas Corporation
7.2.1 Enplas Corporation Small Outline Integrated Circuit (SOIC) Package Corporation Information
7.2.2 Enplas Corporation Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.2.3 Enplas Corporation Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Enplas Corporation Main Business and Markets Served
7.2.5 Enplas Corporation Recent Developments/Updates
7.3 Toshiba Electronic Devices and Storage Corporation
7.3.1 Toshiba Electronic Devices and Storage Corporation Small Outline Integrated Circuit (SOIC) Package Corporation Information
7.3.2 Toshiba Electronic Devices and Storage Corporation Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.3.3 Toshiba Electronic Devices and Storage Corporation Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Toshiba Electronic Devices and Storage Corporation Main Business and Markets Served
7.3.5 Toshiba Electronic Devices and Storage Corporation Recent Developments/Updates
7.4 Intel Corporation
7.4.1 Intel Corporation Small Outline Integrated Circuit (SOIC) Package Corporation Information
7.4.2 Intel Corporation Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.4.3 Intel Corporation Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Intel Corporation Main Business and Markets Served
7.4.5 Intel Corporation Recent Developments/Updates
7.5 Loranger International Corporation
7.5.1 Loranger International Corporation Small Outline Integrated Circuit (SOIC) Package Corporation Information
7.5.2 Loranger International Corporation Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.5.3 Loranger International Corporation Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Loranger International Corporation Main Business and Markets Served
7.5.5 Loranger International Corporation Recent Developments/Updates
7.6 Komachine
7.6.1 Komachine Small Outline Integrated Circuit (SOIC) Package Corporation Information
7.6.2 Komachine Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.6.3 Komachine Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2018-2023)
7.6.4 Komachine Main Business and Markets Served
7.6.5 Komachine Recent Developments/Updates
7.7 Aries Electronics Inc
7.7.1 Aries Electronics Inc Small Outline Integrated Circuit (SOIC) Package Corporation Information
7.7.2 Aries Electronics Inc Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.7.3 Aries Electronics Inc Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Aries Electronics Inc Main Business and Markets Served
7.7.5 Aries Electronics Inc Recent Developments/Updates
7.8 Johnstech International
7.8.1 Johnstech International Small Outline Integrated Circuit (SOIC) Package Corporation Information
7.8.2 Johnstech International Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.8.3 Johnstech International Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Johnstech International Main Business and Markets Served
7.7.5 Johnstech International Recent Developments/Updates
7.9 Mill-Max Manufacturing Corporation
7.9.1 Mill-Max Manufacturing Corporation Small Outline Integrated Circuit (SOIC) Package Corporation Information
7.9.2 Mill-Max Manufacturing Corporation Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.9.3 Mill-Max Manufacturing Corporation Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Mill-Max Manufacturing Corporation Main Business and Markets Served
7.9.5 Mill-Max Manufacturing Corporation Recent Developments/Updates
7.10 Molex
7.10.1 Molex Small Outline Integrated Circuit (SOIC) Package Corporation Information
7.10.2 Molex Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.10.3 Molex Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2018-2023)
7.10.4 Molex Main Business and Markets Served
7.10.5 Molex Recent Developments/Updates
7.11 Foxconn
7.11.1 Foxconn Small Outline Integrated Circuit (SOIC) Package Corporation Information
7.11.2 Foxconn Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.11.3 Foxconn Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2018-2023)
7.11.4 Foxconn Main Business and Markets Served
7.11.5 Foxconn Recent Developments/Updates
7.12 Sensata Technologies
7.12.1 Sensata Technologies Small Outline Integrated Circuit (SOIC) Package Corporation Information
7.12.2 Sensata Technologies Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.12.3 Sensata Technologies Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2018-2023)
7.12.4 Sensata Technologies Main Business and Markets Served
7.12.5 Sensata Technologies Recent Developments/Updates
7.13 Plastronics
7.13.1 Plastronics Small Outline Integrated Circuit (SOIC) Package Corporation Information
7.13.2 Plastronics Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.13.3 Plastronics Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2018-2023)
7.13.4 Plastronics Main Business and Markets Served
7.13.5 Plastronics Recent Developments/Updates
7.14 TE Connectivity
7.14.1 TE Connectivity Small Outline Integrated Circuit (SOIC) Package Corporation Information
7.14.2 TE Connectivity Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.14.3 TE Connectivity Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2018-2023)
7.14.4 TE Connectivity Main Business and Markets Served
7.14.5 TE Connectivity Recent Developments/Updates
7.15 Socionext America Inc
7.15.1 Socionext America Inc Small Outline Integrated Circuit (SOIC) Package Corporation Information
7.15.2 Socionext America Inc Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.15.3 Socionext America Inc Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2018-2023)
7.15.4 Socionext America Inc Main Business and Markets Served
7.15.5 Socionext America Inc Recent Developments/Updates
7.16 WinWay Technology Co
7.16.1 WinWay Technology Co Small Outline Integrated Circuit (SOIC) Package Corporation Information
7.16.2 WinWay Technology Co Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.16.3 WinWay Technology Co Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2018-2023)
7.16.4 WinWay Technology Co Main Business and Markets Served
7.16.5 WinWay Technology Co Recent Developments/Updates
7.17 ChipMOS Technologies Inc
7.17.1 ChipMOS Technologies Inc Small Outline Integrated Circuit (SOIC) Package Corporation Information
7.17.2 ChipMOS Technologies Inc Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.17.3 ChipMOS Technologies Inc Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2018-2023)
7.17.4 ChipMOS Technologies Inc Main Business and Markets Served
7.17.5 ChipMOS Technologies Inc Recent Developments/Updates
7.18 Yamaichi Electronics
7.18.1 Yamaichi Electronics Small Outline Integrated Circuit (SOIC) Package Corporation Information
7.18.2 Yamaichi Electronics Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.18.3 Yamaichi Electronics Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2018-2023)
7.18.4 Yamaichi Electronics Main Business and Markets Served
7.18.5 Yamaichi Electronics Recent Developments/Updates
8.1 Small Outline Integrated Circuit (SOIC) Package Industry Chain Analysis
8.2 Small Outline Integrated Circuit (SOIC) Package Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Small Outline Integrated Circuit (SOIC) Package Production Mode & Process
8.4 Small Outline Integrated Circuit (SOIC) Package Sales and Marketing
8.4.1 Small Outline Integrated Circuit (SOIC) Package Sales Channels
8.4.2 Small Outline Integrated Circuit (SOIC) Package Distributors
8.5 Small Outline Integrated Circuit (SOIC) Package Customers
9.1 Small Outline Integrated Circuit (SOIC) Package Industry Trends
9.2 Small Outline Integrated Circuit (SOIC) Package Market Drivers
9.3 Small Outline Integrated Circuit (SOIC) Package Market Challenges
9.4 Small Outline Integrated Circuit (SOIC) Package Market Restraints
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
List of Tables
Table 1. Global Small Outline Integrated Circuit (SOIC) Package Market Value by Type, (US$ Million) & (2022 VS 2029)
Table 2. Global Small Outline Integrated Circuit (SOIC) Package Market Value by Application, (US$ Million) & (2022 VS 2029)
Table 3. Global Small Outline Integrated Circuit (SOIC) Package Production Capacity (K Units) by Manufacturers in 2022
Table 4. Global Small Outline Integrated Circuit (SOIC) Package Production by Manufacturers (2018-2023) & (K Units)
Table 5. Global Small Outline Integrated Circuit (SOIC) Package Production Market Share by Manufacturers (2018-2023)
Table 6. Global Small Outline Integrated Circuit (SOIC) Package Production Value by Manufacturers (2018-2023) & (US$ Million)
Table 7. Global Small Outline Integrated Circuit (SOIC) Package Production Value Share by Manufacturers (2018-2023)
Table 8. Global Small Outline Integrated Circuit (SOIC) Package Industry Ranking 2021 VS 2022 VS 2023
Table 9. Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Small Outline Integrated Circuit (SOIC) Package as of 2022)
Table 10. Global Market Small Outline Integrated Circuit (SOIC) Package Average Price by Manufacturers (US$/Unit) & (2018-2023)
Table 11. Manufacturers Small Outline Integrated Circuit (SOIC) Package Production Sites and Area Served
Table 12. Manufacturers Small Outline Integrated Circuit (SOIC) Package Product Types
Table 13. Global Small Outline Integrated Circuit (SOIC) Package Manufacturers Market Concentration Ratio (CR5 and HHI)
Table 14. Mergers & Acquisitions, Expansion
Table 15. Global Small Outline Integrated Circuit (SOIC) Package Production Value by Region: 2018 VS 2022 VS 2029 (US$ Million)
Table 16. Global Small Outline Integrated Circuit (SOIC) Package Production Value (US$ Million) by Region (2018-2023)
Table 17. Global Small Outline Integrated Circuit (SOIC) Package Production Value Market Share by Region (2018-2023)
Table 18. Global Small Outline Integrated Circuit (SOIC) Package Production Value (US$ Million) Forecast by Region (2024-2029)
Table 19. Global Small Outline Integrated Circuit (SOIC) Package Production Value Market Share Forecast by Region (2024-2029)
Table 20. Global Small Outline Integrated Circuit (SOIC) Package Production Comparison by Region: 2018 VS 2022 VS 2029 (K Units)
Table 21. Global Small Outline Integrated Circuit (SOIC) Package Production (K Units) by Region (2018-2023)
Table 22. Global Small Outline Integrated Circuit (SOIC) Package Production Market Share by Region (2018-2023)
Table 23. Global Small Outline Integrated Circuit (SOIC) Package Production (K Units) Forecast by Region (2024-2029)
Table 24. Global Small Outline Integrated Circuit (SOIC) Package Production Market Share Forecast by Region (2024-2029)
Table 25. Global Small Outline Integrated Circuit (SOIC) Package Market Average Price (US$/Unit) by Region (2018-2023)
Table 26. Global Small Outline Integrated Circuit (SOIC) Package Market Average Price (US$/Unit) by Region (2024-2029)
Table 27. Global Small Outline Integrated Circuit (SOIC) Package Consumption Growth Rate by Region: 2018 VS 2022 VS 2029 (K Units)
Table 28. Global Small Outline Integrated Circuit (SOIC) Package Consumption by Region (2018-2023) & (K Units)
Table 29. Global Small Outline Integrated Circuit (SOIC) Package Consumption Market Share by Region (2018-2023)
Table 30. Global Small Outline Integrated Circuit (SOIC) Package Forecasted Consumption by Region (2024-2029) & (K Units)
Table 31. Global Small Outline Integrated Circuit (SOIC) Package Forecasted Consumption Market Share by Region (2018-2023)
Table 32. North America Small Outline Integrated Circuit (SOIC) Package Consumption Growth Rate by Country: 2018 VS 2022 VS 2029 (K Units)
Table 33. North America Small Outline Integrated Circuit (SOIC) Package Consumption by Country (2018-2023) & (K Units)
Table 34. North America Small Outline Integrated Circuit (SOIC) Package Consumption by Country (2024-2029) & (K Units)
Table 35. Europe Small Outline Integrated Circuit (SOIC) Package Consumption Growth Rate by Country: 2018 VS 2022 VS 2029 (K Units)
Table 36. Europe Small Outline Integrated Circuit (SOIC) Package Consumption by Country (2018-2023) & (K Units)
Table 37. Europe Small Outline Integrated Circuit (SOIC) Package Consumption by Country (2024-2029) & (K Units)
Table 38. Asia Pacific Small Outline Integrated Circuit (SOIC) Package Consumption Growth Rate by Region: 2018 VS 2022 VS 2029 (K Units)
Table 39. Asia Pacific Small Outline Integrated Circuit (SOIC) Package Consumption by Region (2018-2023) & (K Units)
Table 40. Asia Pacific Small Outline Integrated Circuit (SOIC) Package Consumption by Region (2024-2029) & (K Units)
Table 41. Latin America, Middle East & Africa Small Outline Integrated Circuit (SOIC) Package Consumption Growth Rate by Country: 2018 VS 2022 VS 2029 (K Units)
Table 42. Latin America, Middle East & Africa Small Outline Integrated Circuit (SOIC) Package Consumption by Country (2018-2023) & (K Units)
Table 43. Latin America, Middle East & Africa Small Outline Integrated Circuit (SOIC) Package Consumption by Country (2024-2029) & (K Units)
Table 44. Global Small Outline Integrated Circuit (SOIC) Package Production (K Units) by Type (2018-2023)
Table 45. Global Small Outline Integrated Circuit (SOIC) Package Production (K Units) by Type (2024-2029)
Table 46. Global Small Outline Integrated Circuit (SOIC) Package Production Market Share by Type (2018-2023)
Table 47. Global Small Outline Integrated Circuit (SOIC) Package Production Market Share by Type (2024-2029)
Table 48. Global Small Outline Integrated Circuit (SOIC) Package Production Value (US$ Million) by Type (2018-2023)
Table 49. Global Small Outline Integrated Circuit (SOIC) Package Production Value (US$ Million) by Type (2024-2029)
Table 50. Global Small Outline Integrated Circuit (SOIC) Package Production Value Share by Type (2018-2023)
Table 51. Global Small Outline Integrated Circuit (SOIC) Package Production Value Share by Type (2024-2029)
Table 52. Global Small Outline Integrated Circuit (SOIC) Package Price (US$/Unit) by Type (2018-2023)
Table 53. Global Small Outline Integrated Circuit (SOIC) Package Price (US$/Unit) by Type (2024-2029)
Table 54. Global Small Outline Integrated Circuit (SOIC) Package Production (K Units) by Application (2018-2023)
Table 55. Global Small Outline Integrated Circuit (SOIC) Package Production (K Units) by Application (2024-2029)
Table 56. Global Small Outline Integrated Circuit (SOIC) Package Production Market Share by Application (2018-2023)
Table 57. Global Small Outline Integrated Circuit (SOIC) Package Production Market Share by Application (2024-2029)
Table 58. Global Small Outline Integrated Circuit (SOIC) Package Production Value (US$ Million) by Application (2018-2023)
Table 59. Global Small Outline Integrated Circuit (SOIC) Package Production Value (US$ Million) by Application (2024-2029)
Table 60. Global Small Outline Integrated Circuit (SOIC) Package Production Value Share by Application (2018-2023)
Table 61. Global Small Outline Integrated Circuit (SOIC) Package Production Value Share by Application (2024-2029)
Table 62. Global Small Outline Integrated Circuit (SOIC) Package Price (US$/Unit) by Application (2018-2023)
Table 63. Global Small Outline Integrated Circuit (SOIC) Package Price (US$/Unit) by Application (2024-2029)
Table 64. 3M Small Outline Integrated Circuit (SOIC) Package Corporation Information
Table 65. 3M Specification and Application
Table 66. 3M Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 67. 3M Main Business and Markets Served
Table 68. 3M Recent Developments/Updates
Table 69. Enplas Corporation Small Outline Integrated Circuit (SOIC) Package Corporation Information
Table 70. Enplas Corporation Specification and Application
Table 71. Enplas Corporation Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 72. Enplas Corporation Main Business and Markets Served
Table 73. Enplas Corporation Recent Developments/Updates
Table 74. Toshiba Electronic Devices and Storage Corporation Small Outline Integrated Circuit (SOIC) Package Corporation Information
Table 75. Toshiba Electronic Devices and Storage Corporation Specification and Application
Table 76. Toshiba Electronic Devices and Storage Corporation Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 77. Toshiba Electronic Devices and Storage Corporation Main Business and Markets Served
Table 78. Toshiba Electronic Devices and Storage Corporation Recent Developments/Updates
Table 79. Intel Corporation Small Outline Integrated Circuit (SOIC) Package Corporation Information
Table 80. Intel Corporation Specification and Application
Table 81. Intel Corporation Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 82. Intel Corporation Main Business and Markets Served
Table 83. Intel Corporation Recent Developments/Updates
Table 84. Loranger International Corporation Small Outline Integrated Circuit (SOIC) Package Corporation Information
Table 85. Loranger International Corporation Specification and Application
Table 86. Loranger International Corporation Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 87. Loranger International Corporation Main Business and Markets Served
Table 88. Loranger International Corporation Recent Developments/Updates
Table 89. Komachine Small Outline Integrated Circuit (SOIC) Package Corporation Information
Table 90. Komachine Specification and Application
Table 91. Komachine Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 92. Komachine Main Business and Markets Served
Table 93. Komachine Recent Developments/Updates
Table 94. Aries Electronics Inc Small Outline Integrated Circuit (SOIC) Package Corporation Information
Table 95. Aries Electronics Inc Specification and Application
Table 96. Aries Electronics Inc Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 97. Aries Electronics Inc Main Business and Markets Served
Table 98. Aries Electronics Inc Recent Developments/Updates
Table 99. Johnstech International Small Outline Integrated Circuit (SOIC) Package Corporation Information
Table 100. Johnstech International Specification and Application
Table 101. Johnstech International Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 102. Johnstech International Main Business and Markets Served
Table 103. Johnstech International Recent Developments/Updates
Table 104. Mill-Max Manufacturing Corporation Small Outline Integrated Circuit (SOIC) Package Corporation Information
Table 105. Mill-Max Manufacturing Corporation Specification and Application
Table 106. Mill-Max Manufacturing Corporation Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 107. Mill-Max Manufacturing Corporation Main Business and Markets Served
Table 108. Mill-Max Manufacturing Corporation Recent Developments/Updates
Table 109. Molex Small Outline Integrated Circuit (SOIC) Package Corporation Information
Table 110. Molex Specification and Application
Table 111. Molex Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 112. Molex Main Business and Markets Served
Table 113. Molex Recent Developments/Updates
Table 114. Foxconn Small Outline Integrated Circuit (SOIC) Package Corporation Information
Table 115. Foxconn Specification and Application
Table 116. Foxconn Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 117. Foxconn Main Business and Markets Served
Table 118. Foxconn Recent Developments/Updates
Table 119. Sensata Technologies Small Outline Integrated Circuit (SOIC) Package Corporation Information
Table 120. Sensata Technologies Specification and Application
Table 121. Sensata Technologies Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 122. Sensata Technologies Main Business and Markets Served
Table 123. Sensata Technologies Recent Developments/Updates
Table 124. Plastronics Small Outline Integrated Circuit (SOIC) Package Corporation Information
Table 125. Plastronics Specification and Application
Table 126. Plastronics Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 127. Plastronics Main Business and Markets Served
Table 128. Plastronics Recent Developments/Updates
Table 129. TE Connectivity Small Outline Integrated Circuit (SOIC) Package Corporation Information
Table 130. TE Connectivity Specification and Application
Table 131. TE Connectivity Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 132. TE Connectivity Main Business and Markets Served
Table 133. TE Connectivity Recent Developments/Updates
Table 134. TE Connectivity Small Outline Integrated Circuit (SOIC) Package Corporation Information
Table 135. Socionext America Inc Specification and Application
Table 136. Socionext America Inc Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 137. Socionext America Inc Main Business and Markets Served
Table 138. Socionext America Inc Recent Developments/Updates
Table 139. WinWay Technology Co Small Outline Integrated Circuit (SOIC) Package Corporation Information
Table 140. WinWay Technology Co Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 141. WinWay Technology Co Main Business and Markets Served
Table 142. WinWay Technology Co Recent Developments/Updates
Table 143. ChipMOS Technologies Inc Small Outline Integrated Circuit (SOIC) Package Corporation Information
Table 144. ChipMOS Technologies Inc Specification and Application
Table 145. ChipMOS Technologies Inc Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 146. ChipMOS Technologies Inc Main Business and Markets Served
Table 147. ChipMOS Technologies Inc Recent Developments/Updates
Table 148. Yamaichi Electronics Small Outline Integrated Circuit (SOIC) Package Corporation Information
Table 149. Yamaichi Electronics Specification and Application
Table 150. Yamaichi Electronics Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 151. Yamaichi Electronics Main Business and Markets Served
Table 152. Yamaichi Electronics Recent Developments/Updates
Table 153. Key Raw Materials Lists
Table 154. Raw Materials Key Suppliers Lists
Table 155. Small Outline Integrated Circuit (SOIC) Package Distributors List
Table 156. Small Outline Integrated Circuit (SOIC) Package Customers List
Table 157. Small Outline Integrated Circuit (SOIC) Package Market Trends
Table 158. Small Outline Integrated Circuit (SOIC) Package Market Drivers
Table 159. Small Outline Integrated Circuit (SOIC) Package Market Challenges
Table 160. Small Outline Integrated Circuit (SOIC) Package Market Restraints
Table 161. Research Programs/Design for This Report
Table 162. Key Data Information from Secondary Sources
Table 163. Key Data Information from Primary Sources
List of Figures
Figure 1. Product Picture of Small Outline Integrated Circuit (SOIC) Package
Figure 2. Global Small Outline Integrated Circuit (SOIC) Package Market Value by Type, (US$ Million) & (2022 VS 2029)
Figure 3. Global Small Outline Integrated Circuit (SOIC) Package Market Share by Type: 2022 VS 2029
Figure 4. Mini-SOIC Product Picture
Figure 5. Small Outline J-Lead Package Product Picture
Figure 6. Others Product Picture
Figure 7. Global Small Outline Integrated Circuit (SOIC) Package Market Value by Application, (US$ Million) & (2022 VS 2029)
Figure 8. Global Small Outline Integrated Circuit (SOIC) Package Market Share by Application: 2022 VS 2029
Figure 9. Industrial
Figure 10. Consumer Electronics
Figure 11. Automotive
Figure 12. Medical Devices
Figure 13. Military and Defense
Figure 14. Global Small Outline Integrated Circuit (SOIC) Package Production Value (US$ Million), 2018 VS 2022 VS 2029
Figure 15. Global Small Outline Integrated Circuit (SOIC) Package Production Value (US$ Million) & (2018-2029)
Figure 16. Global Small Outline Integrated Circuit (SOIC) Package Production (K Units) & (2018-2029)
Figure 17. Global Small Outline Integrated Circuit (SOIC) Package Average Price (US$/Unit) & (2018-2029)
Figure 18. Small Outline Integrated Circuit (SOIC) Package Report Years Considered
Figure 19. Small Outline Integrated Circuit (SOIC) Package Production Share by Manufacturers in 2022
Figure 20. Small Outline Integrated Circuit (SOIC) Package Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2018 VS 2022
Figure 21. The Global 5 and 10 Largest Players: Market Share by Small Outline Integrated Circuit (SOIC) Package Revenue in 2022
Figure 22. Global Small Outline Integrated Circuit (SOIC) Package Production Value by Region: 2018 VS 2022 VS 2029 (US$ Million)
Figure 23. Global Small Outline Integrated Circuit (SOIC) Package Production Value Market Share by Region: 2018 VS 2022 VS 2029
Figure 24. Global Small Outline Integrated Circuit (SOIC) Package Production Comparison by Region: 2018 VS 2022 VS 2029 (K Units)
Figure 25. Global Small Outline Integrated Circuit (SOIC) Package Production Market Share by Region: 2018 VS 2022 VS 2029
Figure 26. North America Small Outline Integrated Circuit (SOIC) Package Production Value (US$ Million) Growth Rate (2018-2029)
Figure 27. Europe Small Outline Integrated Circuit (SOIC) Package Production Value (US$ Million) Growth Rate (2018-2029)
Figure 28. China Small Outline Integrated Circuit (SOIC) Package Production Value (US$ Million) Growth Rate (2018-2029)
Figure 29. Japan Small Outline Integrated Circuit (SOIC) Package Production Value (US$ Million) Growth Rate (2018-2029)
Figure 30. South Korea Small Outline Integrated Circuit (SOIC) Package Production Value (US$ Million) Growth Rate (2018-2029)
Figure 31. Global Small Outline Integrated Circuit (SOIC) Package Consumption by Region: 2018 VS 2022 VS 2029 (K Units)
Figure 32. Global Small Outline Integrated Circuit (SOIC) Package Consumption Market Share by Region: 2018 VS 2022 VS 2029
Figure 33. North America Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2018-2023) & (K Units)
Figure 34. North America Small Outline Integrated Circuit (SOIC) Package Consumption Market Share by Country (2018-2029)
Figure 35. Canada Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2018-2023) & (K Units)
Figure 36. U.S. Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2018-2023) & (K Units)
Figure 37. Europe Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2018-2023) & (K Units)
Figure 38. Europe Small Outline Integrated Circuit (SOIC) Package Consumption Market Share by Country (2018-2029)
Figure 39. Germany Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2018-2023) & (K Units)
Figure 40. France Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2018-2023) & (K Units)
Figure 41. U.K. Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2018-2023) & (K Units)
Figure 42. Italy Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2018-2023) & (K Units)
Figure 43. Russia Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2018-2023) & (K Units)
Figure 44. Asia Pacific Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2018-2023) & (K Units)
Figure 45. Asia Pacific Small Outline Integrated Circuit (SOIC) Package Consumption Market Share by Regions (2018-2029)
Figure 46. China Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2018-2023) & (K Units)
Figure 47. Japan Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2018-2023) & (K Units)
Figure 48. South Korea Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2018-2023) & (K Units)
Figure 49. China Taiwan Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2018-2023) & (K Units)
Figure 50. Southeast Asia Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2018-2023) & (K Units)
Figure 51. India Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2018-2023) & (K Units)
Figure 52. Latin America, Middle East & Africa Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2018-2023) & (K Units)
Figure 53. Latin America, Middle East & Africa Small Outline Integrated Circuit (SOIC) Package Consumption Market Share by Country (2018-2029)
Figure 54. Mexico Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2018-2023) & (K Units)
Figure 55. Brazil Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2018-2023) & (K Units)
Figure 56. Turkey Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2018-2023) & (K Units)
Figure 57. GCC Countries Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2018-2023) & (K Units)
Figure 58. Global Production Market Share of Small Outline Integrated Circuit (SOIC) Package by Type (2018-2029)
Figure 59. Global Production Value Market Share of Small Outline Integrated Circuit (SOIC) Package by Type (2018-2029)
Figure 60. Global Small Outline Integrated Circuit (SOIC) Package Price (US$/Unit) by Type (2018-2029)
Figure 61. Global Production Market Share of Small Outline Integrated Circuit (SOIC) Package by Application (2018-2029)
Figure 62. Global Production Value Market Share of Small Outline Integrated Circuit (SOIC) Package by Application (2018-2029)
Figure 63. Global Small Outline Integrated Circuit (SOIC) Package Price (US$/Unit) by Application (2018-2029)
Figure 64. Small Outline Integrated Circuit (SOIC) Package Value Chain
Figure 65. Small Outline Integrated Circuit (SOIC) Package Production Process
Figure 66. Channels of Distribution (Direct Vs Distribution)
Figure 67. Distributors Profiles
Figure 68. Bottom-up and Top-down Approaches for This Report
Figure 69. Data Triangulation A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs. The convention for naming the package is SOIC or SO followed by the number of pins. According to QYResearch’s new survey, global Small Outline Integrated Circuit (SOIC) Package market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029.
The global Small Outline Integrated Circuit (SOIC) package market refers to the market for a type of surface mount integrated circuit (IC) package known as SOIC. SOIC packages are widely used in the electronics industry for their compact size, ease of manufacturing, and compatibility with automated assembly processes.
Here are some key factors driving the growth of the global SOIC package market:
Miniaturization and High-Density Packaging: As electronic devices continue to become smaller and more compact, there is a growing demand for IC packages that offer high-density integration. SOIC packages are known for their small outline and compact size, allowing for efficient use of space on printed circuit boards (PCBs) and enabling the miniaturization of devices.
Wide Application in Various Industries: SOIC packages are used in a wide range of industries, including consumer electronics, automotive, industrial, telecommunications, and healthcare. They are suitable for applications such as power management, signal processing, microcontrollers, memory, and interface circuits. The broad applicability of SOIC packages contributes to their market growth.
Cost-Effectiveness and Manufacturing Efficiency: SOIC packages are cost-effective to manufacture compared to other types of IC packages, such as quad flat no-leads (QFN) or ball grid array (BGA). Additionally, their compatibility with automated assembly processes makes them highly efficient for high-volume production, reducing manufacturing costs and increasing productivity.
Thermal Performance and Reliability: SOIC packages have good thermal performance due to their exposed leads, which allows heat to be dissipated effectively. This feature is particularly important for power-related applications where heat dissipation is critical. Furthermore, SOIC packages offer good electrical performance and reliability, meeting the stringent requirements of various industries.
Compatibility with Legacy Systems: SOIC packages have been widely used for many years, and they have become a standard package type for many ICs. This compatibility with legacy systems makes them attractive for replacement or upgrade purposes, allowing for seamless integration into existing designs without major changes.
Advancements in Technology: The SOIC package market has benefited from advancements in semiconductor manufacturing technology. These advancements have led to the development of smaller pitch sizes, higher pin counts, and higher operating speeds for SOIC packages, expanding their capabilities and increasing their adoption in new applications.
Growing Demand for Portable and Wearable Devices: The increasing popularity of portable electronics, such as smartphones, tablets, wearables, and IoT devices, fuels the demand for compact and lightweight IC packages like SOIC. These devices require smaller and more energy-efficient components, driving the growth of the SOIC package market.
In conclusion, the global SOIC package market is driven by the need for miniaturization, high-density packaging, wide application in various industries, cost-effectiveness, manufacturing efficiency, thermal performance, compatibility with legacy systems, advancements in technology, and the demand for portable and wearable devices. As the electronics industry continues to evolve and demand for small, reliable, and high-performance IC packages increases, the market for SOIC packages is expected to grow significantly.The global Small Outline Integrated Circuit (SOIC) package market refers to the market for a type of surface mount integrated circuit (IC) package known as SOIC. SOIC packages are widely used in the electronics industry for their compact size, ease of manufacturing, and compatibility with automated assembly processes.
Here are some key factors driving the growth of the global SOIC package market:
Miniaturization and High-Density Packaging: As electronic devices continue to become smaller and more compact, there is a growing demand for IC packages that offer high-density integration. SOIC packages are known for their small outline and compact size, allowing for efficient use of space on printed circuit boards (PCBs) and enabling the miniaturization of devices.
Wide Application in Various Industries: SOIC packages are used in a wide range of industries, including consumer electronics, automotive, industrial, telecommunications, and healthcare. They are suitable for applications such as power management, signal processing, microcontrollers, memory, and interface circuits. The broad applicability of SOIC packages contributes to their market growth.
Cost-Effectiveness and Manufacturing Efficiency: SOIC packages are cost-effective to manufacture compared to other types of IC packages, such as quad flat no-leads (QFN) or ball grid array (BGA). Additionally, their compatibility with automated assembly processes makes them highly efficient for high-volume production, reducing manufacturing costs and increasing productivity.
Thermal Performance and Reliability: SOIC packages have good thermal performance due to their exposed leads, which allows heat to be dissipated effectively. This feature is particularly important for power-related applications where heat dissipation is critical. Furthermore, SOIC packages offer good electrical performance and reliability, meeting the stringent requirements of various industries.
Compatibility with Legacy Systems: SOIC packages have been widely used for many years, and they have become a standard package type for many ICs. This compatibility with legacy systems makes them attractive for replacement or upgrade purposes, allowing for seamless integration into existing designs without major changes.
Advancements in Technology: The SOIC package market has benefited from advancements in semiconductor manufacturing technology. These advancements have led to the development of smaller pitch sizes, higher pin counts, and higher operating speeds for SOIC packages, expanding their capabilities and increasing their adoption in new applications.
Growing Demand for Portable and Wearable Devices: The increasing popularity of portable electronics, such as smartphones, tablets, wearables, and IoT devices, fuels the demand for compact and lightweight IC packages like SOIC. These devices require smaller and more energy-efficient components, driving the growth of the SOIC package market.
In conclusion, the global SOIC package market is driven by the need for miniaturization, high-density packaging, wide application in various industries, cost-effectiveness, manufacturing efficiency, thermal performance, compatibility with legacy systems, advancements in technology, and the demand for portable and wearable devices. As the electronics industry continues to evolve and demand for small, reliable, and high-performance IC packages increases, the market for SOIC packages is expected to grow significantly.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Small Outline Integrated Circuit (SOIC) Package market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
3M
Enplas Corporation
Toshiba Electronic Devices and Storage Corporation
Intel Corporation
Loranger International Corporation
Komachine
Aries Electronics Inc
Johnstech International
Mill-Max Manufacturing Corporation
Molex
Foxconn
Sensata Technologies
Plastronics
TE Connectivity
Socionext America Inc
WinWay Technology Co
ChipMOS Technologies Inc
Yamaichi Electronics
Segment by Type
Mini-SOIC
Small Outline J-Lead Package
Others
Segment by Application
Industrial
Consumer Electronics
Automotive
Medical Devices
Military and Defense
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Southeast Asia
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The Small Outline Integrated Circuit (SOIC) Package report covers below items:
Chapter 1: Product Basic Information (Definition, Type and Application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source
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A comprehensive and in-depth analysis of current industry data on markets, competitors and suppliers.
In-depth research on key industry players and analysis of production and sales operations.
Objective forecasts of future trends in the industry.
WHAT QYRESEARCH OFFER?
Competition
Key players, new entrants,acquisitions, mergers and expansions,development trends and challenges.
Industry Analysis
Rawmaterial, application, product type, demand,supply,downstream, supply chain etc.
Market Size
Capacity, production, sales, revenue, price, cost etc.
Customized Information
We can offer customized survey and information to meet ourclient's need.
INTEREST IN THIS REPORT?
Get A Free Sample >>
WHY QYR?
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Fastest report delivery service
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More than 17 years of vast experience
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Operation for 24 * 7 & 365 days
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In-depth and comprehensive analysis
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Professional and timely after-sales service
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Owns large database
Add to Cart
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