QYR in News

Xiongsu Technology Makes Cross‑border Acquisition of Semiconductor Material Enterprise, Facing Three Major Challenges

Per statistics compiled by global market‑intelligence provider QYResearch, the global power module packaging materials market attained a market size of around USD 3.233 billion in 2025. Driven by the rapid development of power semiconductors, the market is expected to rise to USD 6.005 billion by 2032 at a compound annual growth rate (CAGR) of 8.5%.

Source: Baidu‑Baijiahao, Eastmoney Public Disclosure URLs: https://baijiahao.baidu.com/s?id=1878810076279559570&wfr=spider&for=pc https://finance.eastmoney.com/a/202610123892494347.html