QYR in News
On September 29, Shenzhen Hongfucheng New Materials Co., Ltd. cited a market report on thermal interface materials published by QYResearch.
Hongfucheng Officially Listed on the Shenzhen Stock Exchange’s ChiNext Board: AI Thermal Management Materials “Little Giant” Begins a New Chapter in Capital Markets
According to QY Research data, in 2024, Hongfucheng ranked 11th globally in market share for thermal interface materials and third in the Chinese market, holding a leading position among domestic companies.
Source: East Money, China Daily
More: https://finance.eastmoney.com/a/202609293886416964.html
http://caijing.chinadaily.com.cn/a/202609/29/WS6abb1ebbe4b09a165c78d3d0.html
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