Underfill Market Research：the global market size is projected to grow from USD 684 million in 2023 to USD 1,199 million by 2030

An underfill is a composite material made up of an epoxy polymer with significant amounts of filler. Additional components added to the underfill formulation are flow agents, adhesion promoters, and dyes. Underfill is used to fill space beneath a die and adhere to its carrier. Although primarily used for flip-chip devices, underfills can also be used with ball-grid arrays (BGAs) and CSPs. They add structural strength, increase impact resistance, bolster thermal cycling resistance and improve overall reliability.

According to the new market research report "Underfill - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030", published by QYResearch, the global Underfill market size is projected to grow from USD 684 million in 2023 to USD 1,199 million by 2030, at a CAGR of 7.7% during the forecast period.

• Global Underfill MarketSize(US$ Million), 2019-2030

 

Source: QYResearch, "Underfill - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”

 

 

• Global Underfill Top20Players Ranking and Market Share (Ranking is based on the revenue of 2023, continually updated)

 

Source: QYResearch, "Underfill - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”

 

This report profiles key players of Underfill such as Won Chemical, Henkel, NAMICS Corporation, Resonac, Panasonic Lexcm, etc.

In 2023, the global top five Underfill players account for 68.35% of market share in terms of revenue. Above figure shows the key players ranked by revenue in Underfill.

Market Drivers & Growth Opportunities

Increasing demand of consumer electronics

As the functions of consumer electronic products continue to become stronger, the demand for consumer electronics continues to rise. In countries with more developed chip manufacturing, the underfill of the package has also increased with the increase in chip shipments.

Development of industrial Automation

Industrial automation processes require many advanced electronics. Underfill for semiconductors will grow with the growth in shipments of products with chips such as industrial robots and M2M equipment as the core.

Automotive Eletronics

The automobile industry is in the era of technological innovation, and the automobile industry has become an industry equipped with high-tech; the scale of microprocessors in automobiles and engine systems is getting larger and larger. With the massive demand for chips from the auto industry, the market for Underfill for semiconductors is bound to expand further.

 

About The Authors

Su Yi

Industry analyst, focusing on market research, business planning, industry analysis, enterprise management consulting and other business field reports. For many of the world's top 500 enterprises to provide industry consulting services for segmented products.

Email: suyi@qyresearch.com

 

About QYResearch

QYResearch founded in California, USA in 2007.It is a leading global market research and consulting company. With over 17 years’ experience and professional research team in various cities over the world QY Research focuses on management consulting, database and seminar services, IPO consulting (data is widely cited in prospectuses, annual reports and presentations), industry chain research and customized research to help our clients in providing non-linear revenue model and make them successful. We are globally recognized for our expansive portfolio of services, good corporate citizenship, and our strong commitment to sustainability. Up to now, we have cooperated with more than 60,000 clients across five continents. Let’s work closely with you and build a bold and better future.

QYResearch is a world-renowned large-scale consulting company. The industry covers various high-tech industry chain market segments, spanning the semiconductor industry chain (semiconductor equipment and parts, semiconductor materials, ICs, Foundry, packaging and testing, discrete devices, sensors, optoelectronic devices), photovoltaic industry chain (equipment, cells, modules, auxiliary material brackets, inverters, power station terminals), new energy automobile industry chain (batteries and materials, auto parts, batteries, motors, electronic control, automotive semiconductors, etc.), communication industry chain (communication system equipment, terminal equipment, electronic components, RF front-end, optical modules, 4G/5G/6G, broadband, IoT, digital economy, AI), advanced materials industry Chain (metal materials, polymer materials, ceramic materials, nano materials, etc.), machinery manufacturing industry chain (CNC machine tools, construction machinery, electrical machinery, 3C automation, industrial robots, lasers, industrial control, drones), food, beverages and pharmaceuticals, medical equipment, agriculture, etc.

 

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