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Global Wafer Bonders Market Research Report 2019

Published Date: 2019-01-04   |   Pages: 93   |   Tables: 106   | Report Id: 920150   | Hits: 8 |   Electronics & Semiconductor

Wafer bonding is commonly used in Front-end of line (FEOL) operational steps as wafer-to-wafer bonding provides strength if the device wafer is to be thinned to ultra-thin dimensions. The statistic scope is wafer bonder in this report.

The global Wafer Bonders market is valued at xx million US$ in 2018 is expected to reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.

This report focuses on Wafer Bonders volume and value at global level, regional level and company level. From a global perspective, this report represents overall Wafer Bonders market size by analyzing historical data and future prospect. Regionally, this report focuses on several key regions: North America, Europe, China and Japan.

At company level, this report focuses on the production capacity, ex-factory price, revenue and market share for each manufacturer covered in this report.

The following manufacturers are covered:

EV Group (EVG)

SUSS MicroTec

Dynatex International


Mitsubishi Heavy Industries

Kulicke & Soffa Industries, Inc

Ayumi Industries Company Limited

Tokyo Electron Limited

Tokyo Ohka Kogyo Co., Ltd

Finetech GmbH & Co. KG

Segment by Regions

North America




Segment by Type

Semi-Auto Type

Fully Automatic Type

Segment by Application


Advanced Packaging (BSI CIS, CIS capping WLP, 3D stack TSV)

LED Devices

SOI Substrate


Licenses Type

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