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Global Wafer Bonders Industry Research Report, Growth Trends and Competitive Analysis 2019-2025

Published Date: 2019-01-04   |   Pages: 118   |   Tables: 144   | Report Id: 906795   | Hits: 5 |   Electronics & Semiconductor



Wafer bonding is commonly used in Front-end of line (FEOL) operational steps as wafer-to-wafer bonding provides strength if the device wafer is to be thinned to ultra-thin dimensions. The statistic scope is wafer bonder in this report.

The Wafer Bonders market was valued at xx Million US$ in 2018 and is projected to reach xx Million US$ by 2025, at a CAGR of xx% during the forecast period. In this study, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Wafer Bonders.

This study focuses on the production side and consumption side of Wafer Bonders, presents the global Wafer Bonders market size by manufacturers, regions, type and application, history breakdown data from 2014 to 2019, and forecast to 2025.

In terms of production side, this report researches the Wafer Bonders capacity, production, value, ex-factory price, growth rate, market share for major manufacturers, regions (or countries) and product type.

In terms of consumption side, this report focuses on the consumption of Wafer Bonders by regions and application. The key regions like North America, Europe, Asia-Pacific, Central & South America, Middle East and Africa etc.

This report includes the following manufacturers; we can also add the other companies as you want.

EV Group (EVG)

SUSS MicroTec

Dynatex International

AML

Mitsubishi Heavy Industries

Kulicke & Soffa Industries, Inc

Ayumi Industries Company Limited

Tokyo Electron Limited

Tokyo Ohka Kogyo Co., Ltd

Finetech GmbH & Co. KG

Market Segment by Product Type

Semi-Auto Type

Fully Automatic Type

Market Segment by Application

MEMS

Advanced Packaging (BSI CIS, CIS capping WLP, 3D stack TSV)

LED Devices

SOI Substrate

Others

Key Regions split in this report:

North America

United States

Canada

Mexico

Asia-Pacific

China

India

Japan

South Korea

Australia

Indonesia

Malaysia

Philippines

Thailand

Vietnam

Europe

Germany

France

UK

Italy

Russia

Central & South America

Brazil

Rest of Central & South America

Middle East & Africa

The study objectives are:

To analyze and research the global Wafer Bonders status and future forecast, involving capacity, production, value, consumption, growth rate (CAGR), market share, historical and forecast.

To present the key Wafer Bonders manufacturers, capacity, production, revenue, market share, and recent development.

To split the breakdown data by regions, type, manufacturers and applications.

To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.

To identify significant trends, drivers, influence factors in global and regions.

To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.

In this study, the years considered to estimate the market size of Wafer Bonders are as follows:

History Year: 2014-2019

Base Year: 2018

Estimated Year: 2019

Forecast Year 2019 to 2025

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