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Global Wafer Bonders Market Insights, Forecast to 2025

Published Date: 2019-01-04   |   Pages: 116   |   Tables: 145   | Report Id: 906586   | Hits: 10 |   Electronics & Semiconductor



Wafer bonding is commonly used in Front-end of line (FEOL) operational steps as wafer-to-wafer bonding provides strength if the device wafer is to be thinned to ultra-thin dimensions. The statistic scope is wafer bonder in this report.

The Wafer Bonders market was valued at xx Million US$ in 2018 and is projected to reach xx Million US$ by 2025, at a CAGR of xx% during the forecast period. In this study, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Wafer Bonders.

This report presents the worldwide Wafer Bonders market size (value, production and consumption), splits the breakdown (data status 2014-2019 and forecast to 2025), by manufacturers, region, type and application.

This study also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.

The following manufacturers are covered in this report:

EV Group (EVG)

SUSS MicroTec

Dynatex International

AML

Mitsubishi Heavy Industries

Kulicke & Soffa Industries, Inc

Ayumi Industries Company Limited

Tokyo Electron Limited

Tokyo Ohka Kogyo Co., Ltd

Finetech GmbH & Co. KG

Wafer Bonders Breakdown Data by Type

Semi-Auto Type

Fully Automatic Type

Wafer Bonders Breakdown Data by Application

MEMS

Advanced Packaging (BSI CIS, CIS capping WLP, 3D stack TSV)

LED Devices

SOI Substrate

Others

Wafer Bonders Production by Region

United States

Europe

China

Japan

South Korea

Other Regions

Wafer Bonders Consumption by Region

North America

United States

Canada

Mexico

Asia-Pacific

China

India

Japan

South Korea

Australia

Indonesia

Malaysia

Philippines

Thailand

Vietnam

Europe

Germany

France

UK

Italy

Russia

Rest of Europe

Central & South America

Brazil

Rest of South America

Middle East & Africa

GCC Countries

Turkey

Egypt

South Africa

Rest of Middle East & Africa

The study objectives are:

To analyze and research the global Wafer Bonders status and future forecast,involving, production, revenue, consumption, historical and forecast.

To present the key Wafer Bonders manufacturers, production, revenue, market share, and recent development.

To split the breakdown data by regions, type, manufacturers and applications.

To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.

To identify significant trends, drivers, influence factors in global and regions.

To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.

In this study, the years considered to estimate the market size of Wafer Bonders :

History Year: 2014 - 2018

Base Year: 2018

Estimated Year: 2019

Forecast Year: 2019 - 2025

This report includes the estimation of market size for value (million USD) and volume (Units). Both top-down and bottom-up approaches have been used to estimate and validate the market size of Wafer Bonders market, to estimate the size of various other dependent submarkets in the overall market. Key players in the market have been identified through secondary research, and their market shares have been determined through primary and secondary research. All percentage shares, splits, and breakdowns have been determined using secondary sources and verified primary sources.

For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.

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