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Global Hermetic Packaging Market Professional Survey Report 2018

Published Date: 2018-01-30   |   Pages: 113   |   Tables: 135   | Report Id: 68473   | Hits: 16 |   Packaging Materials

This report studies Hermetic Packaging in Global market, especially in North America, China, Europe, Southeast Asia, Japan and India, with production, revenue, consumption, import and export in these regions, from 2013 to 2018, and forecast to 2025.

This report focuses on top manufacturers in global market, with production, price, revenue and market share for each manufacturer, covering

Schott AG

Ametek Inc.

Texas Instruments Incorporated

Amkor Technology

Teledyne Microelectronic Technology

Kyocera Corporation

Materion Corporation

Egide SA

Micross Components Inc.

Legacy Technologies Inc.

Willow Technologies

Special Hermetic Products Inc.

SST International

Sinclair Manufacturing Company

Mackin Technologies

On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into

Ceramic to Metal Sealing

Glass to Metal Sealing

Transponder Glass

Reed Glass

Passivation Glass

By Application, the market can be split into

Aeronautics & Space

Military & Defense





By Regions, this report covers (we can add the regions/countries as you want)

North America



Southeast Asia



If you have any special requirements, please let us know and we will offer you the report as you want.

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