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Global IC Packaging Sales Market Report 2018

Published Date: 2018-06-01   |   Pages: 100   |   Tables: 121   | Report Id: 454613   | Hits: 16 |   Electronics & Semiconductor

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This report studies the global IC Packaging market status and forecast, categorizes the global IC Packaging market size (value & volume) by key players, type, application, and region. This report focuses on the top players in North America, Europe, China, Japan, Southeast Asia India and Other regions (Middle East & Africa, Central & South America).

IC packaging (a.k.a. IC assembly) is one of the essential processes and technologies in IC manufacture, connecting the bare die to the PCB. In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encased in a supporting case that prevents physical damage and corrosion.

This industry is affected by the economy and policy, so it’s important to put an eye to economic indexes and leaders’ prefer. With the global economic recovery, more and more people pay attention to rising environment standards, especially in underdevelopment regions that have a large population and fast economic growth, the need will increase.

The industry is a high-technology and high-profit industry, the research team maintain a very optimistic attitude. It is suggested that the new enterprises to enter the field.

We tend to believe this industry now is close to mature, and the consumption increasing degree will show a smooth curve. On product prices, the slow downward trend in recent years will maintain in the future, as competition intensifies, prices gap between different brands will go narrowing. Similarly, there will be fluctuation in gross margin.

The global IC Packaging market is valued at xx million US$ in 2017 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2018-2025.

The major players covered in this report

ASE

Amkor

SPIL

STATS ChipPac

Powertech Technology

J-devices

UTAC

JECT

ChipMOS

Chipbond

Geographically, this report studies the key regions, focuses on product sales, value, market share and growth opportunity in these regions, covering

United States

Europe

China

Japan

Southeast Asia

India

We can also provide the customized separate regional or country-level reports, for the following regions:

North America

United States

Canada

Mexico

Asia-Pacific

China

India

Japan

South Korea

Australia

Indonesia

Singapore

Rest of Asia-Pacific

Europe

Germany

France

UK

Italy

Spain

Russia

Rest of Europe

Central & South America

Brazil

Argentina

Rest of South America

Middle East & Africa

Saudi Arabia

Turkey

Rest of Middle East & Africa

On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into

DIP

SOP

QFP

QFN

BGA

CSP

LGA

WLP

FC

Others

On the basis on the end users/applications, this report focuses on the status and outlook for major applications/end users, sales volume, market share and growth rate for each application, including

CIS

MEMS

Others

The study objectives of this report are:

To analyze and study the global IC Packaging sales, value, status (2013-2017) and forecast (2018-2025);

To analyze the top players in North America, Europe, China, Japan, Southeast Asia and India, to study the sales, value and market share of top players in these regions.

Focuses on the key IC Packaging players, to study the sales, value, market share and development plans in future.

Focuses on the global key manufacturers, to define, describe and analyze the market competition landscape, SWOT analysis.

To define, describe and forecast the market by type, application and region.

To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.

To identify significant trends and factors driving or inhibiting the market growth.

To analyze the opportunities in the market for stakeholders by identifying the high growth segments.

To strategically analyze each submarket with respect to individual growth trend and their contribution to the market

To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market

To strategically profile the key players and comprehensively analyze their growth strategies.

In this study, the years considered to estimate the market size of IC Packaging are as follows:

History Year: 2013-2017

Base Year: 2017

Estimated Year: 2018

Forecast Year 2018 to 2025

For the data information by region, company, type and application, 2017 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.

Key Stakeholders

IC Packaging Manufacturers

IC Packaging Distributors/Traders/Wholesalers

IC Packaging Subcomponent Manufacturers

Industry Association

Downstream Vendors

Available Customizations

With the given market data, QYResearch offers customizations according to the company's specific needs. The following customization options are available for the report:

Regional and country-level analysis of the IC Packaging market, by end-use.

Detailed analysis and profiles of additional market players.

Licenses Type

Only one user can access the report
Multiple users can access the report

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