High Density Interconnects (HDI) board is defined as a board (PCB) with a higher wiring density per Unit area than conventional printed circuit boards (PCB). They have finer lines and spaces (<100 µm), smaller vias (<150 µm) and capture pads (<400 µm), I/O>300, and higher connection pad density (>20 pads/cm2) than employed in conventional PCB technology. HDI board is used to reduce size and weight, as well as to enhance electrical performance.
The sales revenue share of Unimicron is about 8.39% in 2015, which is the No.1 of the global HDI industry. The other competitors include Compeq, AT&S SEMCO, Ibiden, TTM, ZDT, Tripod, DAP, Unitech, Multek and LG Innotek, etc.
At present, in developed countries, the HDI industry is generally at a more advanced level. The world's largest enterprises are mainly concentrated in China. Meanwhile, foreign companies have more advanced equipment, strong R & D capability, and leading technical level
Despite the presence of competition problems, due to the global recovery trend is clear, investors are still optimistic about this area; the future will still have more new investment enter the field.
The global HDI market is valued at 9480 million US$ in 2017 and will reach 22700 million US$ by the end of 2025, growing at a CAGR of 11.5% during 2018-2025.
The major manufacturers covered in this report
Young Poong (KCC)
Geographically, this report studies the top producers and consumers, focuses on product capacity, production, value, consumption, market share and growth opportunity in these key regions, covering
Other regions (Central & South America, Middle East & Africa)
We can also provide the customized separate regional or country-level reports, for the following regions:
Rest of Asia-Pacific
Rest of Europe
Central & South America
Rest of South America
Middle East & Africa
Rest of Middle East & Africa
On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into
HDI PCB (1+N+1)
HDI PCB (2+N+2)
ELIC (Every Layer Interconnection)
By Application, the market can be split into
Computer & Display
The study objectives of this report are:
To analyze and study the global HDI capacity, production, value, consumption, status (2013-2017) and forecast (2018-2025);
Focuses on the key HDI manufacturers, to study the capacity, production, value, market share and development plans in future.
Focuses on the global key manufacturers, to define, describe and analyze the market competition landscape, SWOT analysis.
To define, describe and forecast the market by type, application and region.
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends and factors driving or inhibiting the market growth.
To analyze the opportunities in the market for stakeholders by identifying the high growth segments.
To strategically analyze each submarket with respect to individual growth trend and their contribution to the market.
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
To strategically profile the key players and comprehensively analyze their growth strategies.
In this study, the years considered to estimate the market size of HDI are as follows:
History Year: 2013-2017
Base Year: 2017
Estimated Year: 2018
Forecast Year 2018 to 2025
For the data information by region, company, type and application, 2017 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.
HDI Subcomponent Manufacturers
With the given market data, QYResearch offers customizations according to the company's specific needs. The following customization options are available for the report:
Regional and country-level analysis of the HDI market, by end-use.
Detailed analysis and profiles of additional market players.