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Global and China Wafer Grinding Tapes Market Insights, Forecast to 2026

Published Date: 2020-09-28   |   Pages: 128   |   Tables: 287   | Report Id: 2158070   | Hits: 40 |   Electronics & Semiconductor

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Wafer Grinding Tapes is used to protect the wafer surface during back grinding after the IC is formed on the wafer. Attached on the circuit surface, it prevents damages to the circuit surface and pollutions to the wafer surface and improves the grinding accuracy of the wafer. Especially, it can perfectly protect the wafer pattern surface and the chip during the manufacturing process with its excellent physical and chemical properties. With developments of jumbo-sized and thinned wafer and high-bumped wafer, the function required to the BG tape are (1) low contamination levels, (2) highly close contact to wafer-, and (3) easiness of peeling.


Market Analysis and Insights: Global and China Wafer Grinding Tapes Market

This report focuses on global and China Wafer Grinding Tapes QYR Global and China market.

The global Wafer Grinding Tapes market size is projected to reach US$ XX million by 2026, from US$ XX million in 2020, at a CAGR of XX% during 2021-2026.


Global Wafer Grinding Tapes Scope and Market Size

Wafer Grinding Tapes market is segmented by region (country), players, by Type, and by Application. Players, stakeholders, and other participants in the global Wafer Grinding Tapes market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by region (country), by Type and by Application in terms of revenue and forecast for the period 2015-2026.


Segment by Type, the Wafer Grinding Tapes market is segmented into

UV Type

Non-UV Type


Segment by Application, the Wafer Grinding Tapes market is segmented into

Standard

Standard Thin Die

(S)DBG(GAL)

Bump


Regional and Country-level Analysis

The Wafer Grinding Tapes market is analysed and market size information is provided by regions (countries).

The key regions covered in the Wafer Grinding Tapes market report are North America, Europe, Asia Pacific, Latin America, Middle East and Africa. It also covers key regions (countries), viz, U.S., Canada, Germany, France, U.K., Italy, Russia, China, Japan, South Korea, India, Australia, Taiwan, Indonesia, Thailand, Malaysia, Philippines, Vietnam, Mexico, Brazil, Turkey, Saudi Arabia, U.A.E, etc.

The report includes country-wise and region-wise market size for the period 2015-2026. It also includes market size and forecast by Type, and by Application segment in terms of sales and revenue for the period 2015-2026.


Competitive Landscape and Wafer Grinding Tapes Market Share Analysis

Wafer Grinding Tapes market competitive landscape provides details and data information by players. The report offers comprehensive analysis and accurate statistics on revenue by the player for the period 2015-2020. It also offers detailed analysis supported by reliable statistics on revenue (global and regional level) by players for the period 2015-2020. Details included are company description, major business, company total revenue and the sales, revenue generated in Wafer Grinding Tapes business, the date to enter into the Wafer Grinding Tapes market, Wafer Grinding Tapes product introduction, recent developments, etc.

The major vendors covered:

Mitsui Chemicals Tohcello

Nitto

LINTEC

Furukawa Electric

Denka

D&X

AI Technology

Force-One Applied Materials

AMC Co, Ltd

Pantech Tape Co., Ltd

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