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Global Wafer Grinding Tapes Market Report, History and Forecast 2015-2026, Breakdown Data by Manufacturers, Key Regions, Types and Application

Published Date: 2020-09-28   |   Pages: 110   |   Tables: 147   | Report Id: 2158064   | Hits: 44 |   Electronics & Semiconductor

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Wafer Grinding Tapes is used to protect the wafer surface during back grinding after the IC is formed on the wafer. Attached on the circuit surface, it prevents damages to the circuit surface and pollutions to the wafer surface and improves the grinding accuracy of the wafer. Especially, it can perfectly protect the wafer pattern surface and the chip during the manufacturing process with its excellent physical and chemical properties. With developments of jumbo-sized and thinned wafer and high-bumped wafer, the function required to the BG tape are (1) low contamination levels, (2) highly close contact to wafer-, and (3) easiness of peeling.

Market Analysis and Insights: Global Wafer Grinding Tapes Market

The global Wafer Grinding Tapes market size is projected to reach US$ XX million by 2026, from US$ XX million in 2020, at a CAGR of XX% during 2021-2026.

Global Wafer Grinding Tapes Scope and Segment

The global Wafer Grinding Tapes market is segmented by company, region (country), by Type, and by Application. Players, stakeholders, and other participants in the global Wafer Grinding Tapes market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by region (country), by Type, and by Application for the period 2015-2026.

The major regions covered in the report are North America, Europe, Asia-Pacific, South America, Middle East & Africa, etc. The report has specifically covered major countries including U.S., Canada, Germany, France, U.K., Italy, Russia, China, Japan, South Korea, India, Australia, Taiwan, Indonesia, Thailand, Malaysia, Philippines, Vietnam, Mexico, Brazil, Turkey, Saudi Arabia, U.A.E, etc. It includes revenue and volume analysis of each region and their respective countries for the forecast years. It also contains country-wise volume and revenue from the year 2015 to 2020. Additionally, it provides the reader with accurate data on volume sales according to the consumption for the same years.

By the product type, the market is primarily split into

UV Type

Non-UV Type

By the end users/application, this report covers the following segments

Standard

Standard Thin Die

(S)DBG(GAL)

Bump

Competitive Landscape:

The report provides a list of all the key players in the Wafer Grinding Tapes market along with a detailed analysis of the strategies, which the companies are adopting. The strategies mainly include new product development, research, and development, and also provides revenue shares, company overview, and recent company developments to remain competitive in the market.

The Wafer Grinding Tapes key manufacturers in this market include:

Mitsui Chemicals Tohcello

Nitto

LINTEC

Furukawa Electric

Denka

D&X

AI Technology

Force-One Applied Materials

AMC Co, Ltd

Pantech Tape Co., Ltd

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