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Global and Japan Lead Frame Market Insights, Forecast to 2026

Published Date: 2020-09-01   |   Pages: 140   |   Tables: 287   | Report Id: 2121394   | Hits: 40 |   Electronics & Semiconductor

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Lead Frame is the basic component that delivers electric signal to external circuits and supports the chip inside of semiconductor package mechanically.

A lead frame consists of a die mounting paddle and lead fingers. The die paddle serves primarily to mechanically support the die during package manufacture. The lead fingers connect the die to the circuitry external to the package.

At present, the major companies focus on Taiwan, Japan, Korea and China. Of the major manufactures, Mitsui High-tec, Shinko, Chang Wah Technology, ASM Pacific Technology and SDI captured the global Top 5 suppliers in 2019. Mitsui High-tec maintained the global first largest position, occupied 10.24% global revenue market share, followed by Shinko, Chang Wah Technology, ASM Pacific Technology and SDI with 9.07%, 7.46%, 7.23% and 7.12% global revenue market share, respectively.

There are two classification of Lead Frame in this report: stamping process lead frame, etching process lead frame. The Stamping Process Lead Frame segment accounted for 66.66% of the sales volume share in 2019.


Market Analysis and Insights: Global and Japan Lead Frame Market

This report focuses on global and Japan Lead Frame QYR Global and Japan market.

The global Lead Frame market size is projected to reach US$ 3943 million by 2026, from US$ 3283 million in 2020, at a CAGR of 3.1% during 2021-2026.


Global Lead Frame Scope and Market Size

Lead Frame market is segmented by region (country), players, by Type, and by Application. Players, stakeholders, and other participants in the global Lead Frame market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by region (country), by Type and by Application in terms of revenue and forecast for the period 2015-2026.


Segment by Type, the Lead Frame market is segmented into

Stamping Process Lead Frame

Etching Process Lead Frame

Others


Segment by Application, the Lead Frame market is segmented into

Integrated Circuit

Discrete Device

Others


Regional and Country-level Analysis

The Lead Frame market is analysed and market size information is provided by regions (countries).

The key regions covered in the Lead Frame market report are North America, Europe, Asia Pacific, Latin America, Middle East and Africa. It also covers key regions (countries), viz, U.S., Canada, Germany, France, U.K., Italy, Russia, China, Japan, South Korea, India, Australia, Taiwan, Indonesia, Thailand, Malaysia, Philippines, Vietnam, Mexico, Brazil, Turkey, Saudi Arabia, U.A.E, etc.

The report includes country-wise and region-wise market size for the period 2015-2026. It also includes market size and forecast by Type, and by Application segment in terms of sales and revenue for the period 2015-2026.


Competitive Landscape and Lead Frame Market Share Analysis

Lead Frame market competitive landscape provides details and data information by players. The report offers comprehensive analysis and accurate statistics on revenue by the player for the period 2015-2020. It also offers detailed analysis supported by reliable statistics on revenue (global and regional level) by players for the period 2015-2020. Details included are company description, major business, company total revenue and the sales, revenue generated in Lead Frame business, the date to enter into the Lead Frame market, Lead Frame product introduction, recent developments, etc.

The major vendors covered:

Mitsui High-tec

Shinko

Chang Wah Technology

ASM Pacific Technology

SDI

HAESUNG

Fusheng Electronics

Enomoto

POSSEHL

Kangqiang

JIH LIN TECHNOLOGY

DNP

LG Innotek

Jentech

Dynacraft Industries

QPL Limited

Hualong

WuXi Micro Just-Tech

HUAYANG ELECTRONIC

Yonghong Technology

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