Global Solder Paste Inspection (SPI) System Market Report, History and Forecast 2015-2026

Published Date: 2020-08-07   |   Pages: 173   |   Tables: 231   | Report Id: 2061466   | Hits: 85 |   Electronics & Semiconductor

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Market Analysis and Insights: Global Solder Paste Inspection (SPI) System Market

Since the COVID-19 virus outbreak in December 2019, the disease has spread to almost 200 countries around the globe with the World Health Organization declaring it a public health emergency. The global impacts of the coronavirus disease 2019 (COVID-19) are already starting to be felt and will significantly affect the Solder Paste Inspection (SPI) System market in 2020.

The outbreak of COVID-19 has brought effects on many aspects, like flight cancellations; travel bans and quarantines; restaurants closed; all indoor events restricted; over forty countries state of emergency declared; massive slowing of the supply chain; stock market volatility; falling business confidence, growing panic among the population, and uncertainty about future.

Prior to COVID-19, the market for Solder Paste Inspection (SPI) System was anticipated to grow from US$ 293 million in 2020 to US$ 418 million by 2026; it is expected to grow at a CAGR of 5.8% during 2021-2026, whereas post-COVID-19 scenario, the market for Solder Paste Inspection (SPI) System is projected to grow from US$ 265 million in 2020 (a decline by ~9.7% compared to market estimated for 2020 before the outbreak of COVID-19) to US$ 394 million by 2026; it is expected to grow at a CAGR of 6.0% during 2021-2026. The solicitation of proposals by the governments and public-private companies across the world to mitigate the impact of the COVID-19 pandemic is the key factor propelling the growth of the Solder Paste Inspection (SPI) System market.

In the high-end Solder Paste Inspection (SPI) System market, the global market is dominated by few players like Koh Young, Test Research, Inc (TRI), CKD Corporation and CyberOptics Corporation; In the low-end and medium-end market, it is highly competitive due to lots of players enter in this fields in around 2010, especially the players from South Korea and China.

In China, the high-end market is dominated by Koh Young, and in the medium- and low-end market, the Chinese local players play important roles, especially in recent several years. Sinic-Tek Vision Technology and Shenzhen ZhenHuaXing are the two largest local brands; Shenzhen JT Automation Equipment and Shenzhen Chonvo Intelligence performed ordinarily in part few years due to precision problem. JUTZE Intelligence Technology in a key local players of AOI, but in SPI system, it was in poor performance compared with Sinic-Tek Vision Technology and Shenzhen ZhenHuaXing.

The In-Line 3D SPI systems are dominating the market, with a share over 90 percent in 2019. In future, the Off-line SPI will exit from this market due to slumping demand.

Global Solder Paste Inspection (SPI) System Scope and Market Size

The global Solder Paste Inspection (SPI) System market is segmented by region (country), company, by Type, and by Application. Players, stakeholders, and other participants in the global Solder Paste Inspection (SPI) System market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), by Type, and by Application for the period 2015-2026.

By Company

Koh Young

Test Research, Inc (TRI)

CKD Corporation

CyberOptics Corporation



Viscom AG


Mycronic (Vi TECHNOLOGY)

MEK Marantz Electronics


SAKI Corporation

Caltex Scientific

ASC International

Jet Technology

Sinic-Tek Vision Technology

Shenzhen ZhenHuaXing

Shenzhen JT Automation Equipment

JUTZE Intelligence Technology

Shenzhen Chonvo Intelligence

Segment by Type

In-line SPI System

Off-line SPI System

Segment by Application

Automotive Electronics

Consumer Electronics



By Region

North America






South Korea













Latin America




Middle East & Africa


Saudi Arabia


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