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Global Electronic Potting & Encapsulating Market Report, History and Forecast 2014-2025, Breakdown Data by Manufacturers, Key Regions, Types and Application

Published Date: 2019-04-13   |   Pages: 129   |   Tables: 162   | Report Id: 1088977   | Hits: 38 |   Chemical & Material



Summary

Electronic Potting and Encapsulation delivers a thicker and more robust solution versus conformal coating to protect electronic assemblies from harsher environments to keep them functioning properly for longer lengths of time, and/or to keep them protected from security threats. Electronic Potting and Encapsulation also create a barrier against moisture, dust, fungus and corrosion. These processes also enhance circuit reliability by eliminating leakage from high voltage circuits.

At present, in the foreign industrial developed countries the Electronic Potting & Encapsulating industry is generally at a more advanced level, the world's large enterprises are mainly concentrated in the Europe and USA. Meanwhile, foreign companies have more mature equipment, strong R & D capability, and the technical level is also in a leading position. But in foreign companies the manufacturing cost is relatively high, compared with in China. So the manufacturing cost in developed countries is a disadvantage. As the production technology of Electronic Potting & Encapsulating manufacturers in China continues to improve, the share of Chinese manufactures will be increasing, and the competitiveness in the international market will also gradually increase.

Currently China has become international Electronic Potting & Encapsulating large consumption country, but the production technology is relatively laggard, the manufacturers can only produce some low-end product, although after 2010 the new production lines is expanding, the technology is still relying on import.

The Electronic Potting & Encapsulating is mainly used in the electronics industry. As the electronics industry develops, there is a growing demand to increase the package performance. Along with this, performance and quality requirements for Electronic Potting & Encapsulatings have become more demanding.

The global Electronic Potting & Encapsulating market was 1170 million US$ in 2018 and is expected to 2740 million US$ by the end of 2025, growing at a CAGR of 11.2% between 2019 and 2025.

This report studies the Electronic Potting & Encapsulating market size (value and volume) by players, regions, product types and end industries, history data 2014-2018 and forecast data 2019-2025; This report also studies the global market competition landscape, market drivers and trends, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.

Geographically, this report is segmented into several key regions, with sales, revenue, market share and growth Rate of Electronic Potting & Encapsulating in these regions, from 2014 to 2025, covering

North America (United States, Canada and Mexico)

Europe (Germany, UK, France, Italy, Russia and Turkey etc.)

Asia-Pacific (China, Japan, Korea, India, Australia, Indonesia, Thailand, Philippines, Malaysia and Vietnam)

South America (Brazil etc.)

Middle East and Africa (Egypt and GCC Countries)

The various contributors involved in the value chain of the product include manufacturers, suppliers, distributors, intermediaries, and customers. The key manufacturers in this market include

Henkel

Dow Corning

Hitachi Chemical

LORD Corporation

Huntsman Corporation

ITW Engineered Polymers

3M

H.B. Fuller

John C. Dolph

Master Bond

ACC Silicones

Epic Resins

Plasma Ruggedized Solutions

By the product type, the market is primarily split into

Silicones

Epoxy

Polyurethane

Others

By the end users/application, this report covers the following segments

Consumer Electronics

Automotive

Medical

Telecommunications

Others

We can also provide the customized separate regional or country-level reports, for the following regions:

North America

United States

Canada

Mexico

Asia-Pacific

China

India

Japan

South Korea

Australia

Indonesia

Singapore

Malaysia

Philippines

Thailand

Vietnam

Rest of Asia-Pacific

Europe

Germany

France

UK

Italy

Spain

Russia

Rest of Europe

Central & South America

Brazil

Rest of Central & South America

Middle East & Africa

GCC Countries

Turkey

Egypt

South Africa

Rest of Middle East & Africa

The study objectives of this report are:

To study and analyze the global Electronic Potting & Encapsulating market size (value & volume) by company, key regions/countries, products and application, history data from 2014 to 2018, and forecast to 2025.

To understand the structure of Electronic Potting & Encapsulating market by identifying its various subsegments.

To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).

Focuses on the key global Electronic Potting & Encapsulating manufacturers, to define, describe and analyze the sales volume, value, market share, market competition landscape, SWOT analysis and development plans in next few years.

To analyze the Electronic Potting & Encapsulating with respect to individual growth trends, future prospects, and their contribution to the total market.

To project the value and volume of Electronic Potting & Encapsulating submarkets, with respect to key regions (along with their respective key countries).

To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.

To strategically profile the key players and comprehensively analyze their growth strategies.

In this study, the years considered to estimate the market size of Electronic Potting & Encapsulating are as follows:

History Year: 2014-2018

Base Year: 2018

Estimated Year: 2019

Forecast Year 2019 to 2025

This report includes the estimation of market size for value (million USD) and volume (K MT). Both top-down and bottom-up approaches have been used to estimate and validate the market size of Electronic Potting & Encapsulating market, to estimate the size of various other dependent submarkets in the overall market. Key players in the market have been identified through secondary research, and their market shares have been determined through primary and secondary research. All percentage shares, splits, and breakdowns have been determined using secondary sources and verified primary sources.

For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.

Key Stakeholders

Raw material suppliers

Distributors/traders/wholesalers/suppliers

Regulatory bodies, including government agencies and NGO

Commercial research & development (R&D) institutions

Importers and exporters

Government organizations, research organizations, and consulting firms

Trade associations and industry bodies

End-use industries

Available Customizations

With the given market data, QYResearch offers customizations according to the company's specific needs. The following customization options are available for the report:

Further breakdown of Electronic Potting & Encapsulating market on basis of the key contributing countries.

Detailed analysis and profiling of additional market players.

Licenses Type

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Multiple users can access the report

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