In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.
Solder Ball are very small spheres of high-purity solder for micro soldering system. The most important advantages of Solder Ball are their very clean surfaces and exact solder quantity control. Most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.
Asia Pacific held the leading share of the market in terms of revenue in 2016. We estimate that the global market share of Solder Ball is 27.66% in Taiwan, 20.54% in Korea, 17.28% in Japan, 15% in China and 10.56% in South East Asia. Because there are many larger IC packaging (including testing) companies in these region, such as ASE, Amkor, SPIL etc. Solder Ball are most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.
Senju Metal, DS HiMetal and MKE captured the top three revenue share spots in the Solder Ball market in 2016. Senju Metal dominated with 40.00% revenue share, followed by DS HiMetal with 19.14% revenue share and MKE with 7.08% revenue share.
The global Solder Ball market was 210 million US$ in 2018 and is expected to 350 million US$ by the end of 2025, growing at a CAGR of 6.4% between 2019 and 2025.
This report studies the Solder Ball market size (value and volume) by players, regions, product types and end industries, history data 2014-2018 and forecast data 2019-2025; This report also studies the global market competition landscape, market drivers and trends, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.
Geographically, this report is segmented into several key regions, with sales, revenue, market share and growth Rate of Solder Ball in these regions, from 2014 to 2025, covering
North America (United States, Canada and Mexico)
Europe (Germany, UK, France, Italy, Russia and Turkey etc.)
Asia-Pacific (China, Japan, Korea, India, Australia, Indonesia, Thailand, Philippines, Malaysia and Vietnam)
South America (Brazil etc.)
Middle East and Africa (Egypt and GCC Countries)
The various contributors involved in the value chain of the product include manufacturers, suppliers, distributors, intermediaries, and customers. The key manufacturers in this market include
Shanghai hiking solder material
By the product type, the market is primarily split into
Lead Solder Ball
Lead Free Solder Ball
By the end users/application, this report covers the following segments
CSP & WLCSP
Flip-Chip & Others
We can also provide the customized separate regional or country-level reports, for the following regions:
Rest of Asia-Pacific
Rest of Europe
Central & South America
Rest of Central & South America
Middle East & Africa
Rest of Middle East & Africa
The study objectives of this report are:
To study and analyze the global Solder Ball market size (value & volume) by company, key regions/countries, products and application, history data from 2014 to 2018, and forecast to 2025.
To understand the structure of Solder Ball market by identifying its various subsegments.
To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).
Focuses on the key global Solder Ball manufacturers, to define, describe and analyze the sales volume, value, market share, market competition landscape, SWOT analysis and development plans in next few years.
To analyze the Solder Ball with respect to individual growth trends, future prospects, and their contribution to the total market.
To project the value and volume of Solder Ball submarkets, with respect to key regions (along with their respective key countries).
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
To strategically profile the key players and comprehensively analyze their growth strategies.
In this study, the years considered to estimate the market size of Solder Ball are as follows:
History Year: 2014-2018
Base Year: 2018
Estimated Year: 2019
Forecast Year 2019 to 2025
This report includes the estimation of market size for value (million USD) and volume (M Units). Both top-down and bottom-up approaches have been used to estimate and validate the market size of Solder Ball market, to estimate the size of various other dependent submarkets in the overall market. Key players in the market have been identified through secondary research, and their market shares have been determined through primary and secondary research. All percentage shares, splits, and breakdowns have been determined using secondary sources and verified primary sources.
For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.
Raw material suppliers
Regulatory bodies, including government agencies and NGO
Commercial research & development (R&D) institutions
Importers and exporters
Government organizations, research organizations, and consulting firms
Trade associations and industry bodies
With the given market data, QYResearch offers customizations according to the company's specific needs. The following customization options are available for the report:
Further breakdown of Solder Ball market on basis of the key contributing countries.
Detailed analysis and profiling of additional market players.