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Global Solder Ball Market Report, History and Forecast 2014-2025, Breakdown Data by Manufacturers, Key Regions, Types and Application

Published Date: 2019-04-13   |   Pages: 132   |   Tables: 162   | Report Id: 1088465   | Hits: 31 |   Chemical & Material

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Summary

In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.

Solder Ball are very small spheres of high-purity solder for micro soldering system. The most important advantages of Solder Ball are their very clean surfaces and exact solder quantity control. Most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.

Asia Pacific held the leading share of the market in terms of revenue in 2016. We estimate that the global market share of Solder Ball is 27.66% in Taiwan, 20.54% in Korea, 17.28% in Japan, 15% in China and 10.56% in South East Asia. Because there are many larger IC packaging (including testing) companies in these region, such as ASE, Amkor, SPIL etc. Solder Ball are most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.

Senju Metal, DS HiMetal and MKE captured the top three revenue share spots in the Solder Ball market in 2016. Senju Metal dominated with 40.00% revenue share, followed by DS HiMetal with 19.14% revenue share and MKE with 7.08% revenue share.

The global Solder Ball market was 210 million US$ in 2018 and is expected to 350 million US$ by the end of 2025, growing at a CAGR of 6.4% between 2019 and 2025.

This report studies the Solder Ball market size (value and volume) by players, regions, product types and end industries, history data 2014-2018 and forecast data 2019-2025; This report also studies the global market competition landscape, market drivers and trends, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.

Geographically, this report is segmented into several key regions, with sales, revenue, market share and growth Rate of Solder Ball in these regions, from 2014 to 2025, covering

North America (United States, Canada and Mexico)

Europe (Germany, UK, France, Italy, Russia and Turkey etc.)

Asia-Pacific (China, Japan, Korea, India, Australia, Indonesia, Thailand, Philippines, Malaysia and Vietnam)

South America (Brazil etc.)

Middle East and Africa (Egypt and GCC Countries)

The various contributors involved in the value chain of the product include manufacturers, suppliers, distributors, intermediaries, and customers. The key manufacturers in this market include

Senju Metal

DS HiMetal

MKE

YCTC

Nippon Micrometal

Accurus

PMTC

Shanghai hiking solder material

Shenmao Technology

By the product type, the market is primarily split into

Lead Solder Ball

Lead Free Solder Ball

By the end users/application, this report covers the following segments

BGA

CSP & WLCSP

Flip-Chip & Others

We can also provide the customized separate regional or country-level reports, for the following regions:

North America

United States

Canada

Mexico

Asia-Pacific

China

India

Japan

South Korea

Australia

Indonesia

Singapore

Malaysia

Philippines

Thailand

Vietnam

Rest of Asia-Pacific

Europe

Germany

France

UK

Italy

Spain

Russia

Rest of Europe

Central & South America

Brazil

Rest of Central & South America

Middle East & Africa

GCC Countries

Turkey

Egypt

South Africa

Rest of Middle East & Africa

The study objectives of this report are:

To study and analyze the global Solder Ball market size (value & volume) by company, key regions/countries, products and application, history data from 2014 to 2018, and forecast to 2025.

To understand the structure of Solder Ball market by identifying its various subsegments.

To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).

Focuses on the key global Solder Ball manufacturers, to define, describe and analyze the sales volume, value, market share, market competition landscape, SWOT analysis and development plans in next few years.

To analyze the Solder Ball with respect to individual growth trends, future prospects, and their contribution to the total market.

To project the value and volume of Solder Ball submarkets, with respect to key regions (along with their respective key countries).

To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.

To strategically profile the key players and comprehensively analyze their growth strategies.

In this study, the years considered to estimate the market size of Solder Ball are as follows:

History Year: 2014-2018

Base Year: 2018

Estimated Year: 2019

Forecast Year 2019 to 2025

This report includes the estimation of market size for value (million USD) and volume (M Units). Both top-down and bottom-up approaches have been used to estimate and validate the market size of Solder Ball market, to estimate the size of various other dependent submarkets in the overall market. Key players in the market have been identified through secondary research, and their market shares have been determined through primary and secondary research. All percentage shares, splits, and breakdowns have been determined using secondary sources and verified primary sources.

For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.

Key Stakeholders

Raw material suppliers

Distributors/traders/wholesalers/suppliers

Regulatory bodies, including government agencies and NGO

Commercial research & development (R&D) institutions

Importers and exporters

Government organizations, research organizations, and consulting firms

Trade associations and industry bodies

End-use industries

Available Customizations

With the given market data, QYResearch offers customizations according to the company's specific needs. The following customization options are available for the report:

Further breakdown of Solder Ball market on basis of the key contributing countries.

Detailed analysis and profiling of additional market players.

Licenses Type

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Multiple users can access the report

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