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Global Flip Chip Bonder market increased to 445.06 million USD by 2022

Author: QYResearch | Publish date: 2018-04-18 | Views: 76
The smartphone market has grown rapidly for the past few years, and has entered into a mature phase.

Publisher: QYResearch

Published Date: 2018-04-18

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Meanwhile, the new driving force for the semiconductor market shifts to the IoT market. Over 50 billions of things will be virtually connected on the internet by 2020, and a change can be seen in the demand for semiconductor devices. In the future, it will be essential for big servers and supercomputers to be larger volume and higher speed, and for mobile devices to be energy saving as well as smaller and thinner sized. Due to these changes in the trend of semiconductor packaging, the popularity of wireless processes, such as flip chip and wafer-level packaging, is expected to grow. To respond to the trend, the enterprises have been enhancing the product lineup for the flip-chip bonder market.


Flip Chip Bonder industry is relatively concentrated, manufacturers are mostly in the Europe, US and Asia. As for the downstream market, China sales accounted for more than 22.71% of the total sales of global Flip Chip Bonder in 2016. Besi is the world leading manufacturer in global Flip Chip Bonder market with the market share of 28.62%, in terms of revenue.


Compared to 2015, Flip Chip Bonder market increased sales by 6.45 percent to 261.43 million USD worldwide in 2016 from 245.58 million USD in 2015. It shows that the Flip Chip Bonder market performance is positive, despite the weak economic environment.


The global Flip Chip Bonder market is expected to reach $445.06 million by 2022 from $245.54 million in 2017, growing at a CAGR of 12.63% from 2017 to 2022. And China market is expected to be the biggest market with sales market share of 24.43% in 2022.


The Global Flip Chip Bonder Sales Market Report 2017 report released by QYResearch provides a basic overview of the Flip Chip Bonder industry, including definition, classification, application and industrial chain structure. Discuss development policies and plans as well as manufacturing processes and cost structures.


The report then focuses on major industry players in Global, including company profiles, product images and specifications, sales, market share, and contact information. More importantly, the Flip Chip Bonder industry development trends and marketing channels were analyzed. Providing the main statistical data on the current status of the industry is a valuable guide and direction for companies and individuals interested in the market.


Click to view the full report:http://www.qyresearchglobal.com/goods-1251921.html
QYResearchglobal focus on market survey and report 
Media contact: press@qyresearch.com

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