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FOUP and FOSB are the containers to transfer the wafers safely. The FOUP and FOSB must comply with the semiconductor industry standards such as M31, E15.1, E57, E62 and others. The FOUP and FOSB are so designed that it increases the wafer position accuracy along with its operability.

 

The semiconductor wafer carrier product line is divided into different types according to the application purpose. The wafer carriers used for transfer from the wafer manufacturer to the semiconductor manufacturer are called front opening shipping boxes (FOSB), while the carriers used in the semiconductor manufacturing process line are called front opening unified boxes (FOUP).

 

FOUP and FOSB market has several key players, like Entegris, Shin-Etsu Polymer and Miraial Co.,Ltd.. The top three largest players occupied 85.36% global revenue market share in 2022. Global giant manufactures mainly distributed in USA, Japan, Taiwan and South Korea. It has unshakable status in this field. At present, considering the cost and the influence of the size of silicon wafers on the performance and efficiency of integrated circuits, the increase in the size of wafers is an inevitable trend and a mainstream trend, in particular, 8-inch and 12-inch. Wafer may develop in the direction of 18 inches in the future. Taiwan (China) has dominant place in the global wafer industry and absolutely is the largest consumption region of FOUP and FOSB, with a consumption market share of 19.83% in 2022.

 

The global FOUP and FOSB market was valued at US$ 679.95 million in 2021 and it is expected to reach US$ 1.10 billion by the end of 2028, growing at a CAGR of 6.59% during 2022-2028.

 

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