Laser marking is widely used in the semiconductor industry due to its apparent advantages, such as high marking accuracy, fast speed, and permanent marking.
Wafer Laser Marking Machine is a relatively mature market, but there is still a large space for distance saturation. In 2020, the global wafer laser marking machine market reached 151.82 million U.S. dollars and is expected to reach 234.80 million U.S. dollars in 2026, with a compound annual growth rate (CAGR) of 6.7%.
The product types of Wafer Laser Marking Machine mainly include Semi-automatic, Full-automatic. Among them, the Full-automatic occupies the main market share. In 2020, the market size of this type is 126.44 million US dollars, accounting for 83.29% of the total market. The Semi-automatic type will become the first type to be eliminated, because its performance has no major advantages compared with Full-automatic.
Wafer laser marking machine can be used for silicon wafers, substrates, etc., mainly in the role of 2-12 inch wafers. Due to equipment precision is high and no corrosion on the surface of the object, there is a huge demand for wafer marking machine in many industries. Among them, the semiconductor industry will be the fastest growing industry in the future, 8 & 12 inch wafers will become the main battlefield.
The wafer laser marking machine market is highly concentrated. The major players are located in Korea, Japan, USA, Germany and China, including EO Technics, Thinklaser (ESI), InnoLas Semiconductor GmbH, Han's Laser Corporation, FitTech Co., Ltd, E&R Engineering Corp, HANMI Semiconductor, Towa Laserfront Corporation, Genesem, Hylax Technology, Beijing KHL Technical Equipment, Shenzhen D-WIN Technology, Gem Laser Limited, New Power Team Technology, Nanjing Dinai Laser Technology, Tianhong Laser, etc. In the future, the low-end wafer laser marking machine market will be gradually eliminated and the technology of the high-end market will be concentrated in the hands of a few companies, so the market concentration may tend to rise.
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