3D AOI is a new type of testing technology emerging from the emerging world, but it has developed rapidly. Many manufacturers have introduced AOI testing equipment. 3D AOI enables precise inspection and measurement of the height dimension of devices on the PCB and provides clear side-view images of ICs and various devices.
With the growing complexity of assemblies, increasing miniaturisation of components and growing demands for lower pseudo defect rates, 3D AOI has become the standard in recent years. The aim is to make even more reliable statements regarding the reality of the quality of solder joints, components, etc. Whereas with a pure 2D image only a colour value is determined, 3D provides valuable height information in addition to X and Y values.
The global 3D AOI for IC market is valued at USD 33.36 million in 2020 and it is forecasted to reach USD 132.62 million by the end of 2027, growing at a CAGR of 20.02% between 2021 and 2027.
Global 3D AOI for IC Market: Key Playersl Analysis
Koh Young Technology, Test Research, ViTrox Corporation Berhad, Saki Corporation, Cyberoptics Corporation, Omron Corporation, Viscom , Mirtec, Parmi Corp, VI Technology (Mycronic), GÖPEL electronic GmbH, Mek Marantz Electronics, Nordson YESTECH are some of the key players in the global 3D AOI for IC market.
At present, in developed countries, the 3D AOI industry is generally at a more advanced level. The world's large enterprises are mainly concentrated in South Korea and Other Asia countries. Meanwhile, foreign companies have more advanced equipment, strong R & D capability, and leading technical level. However, foreign companies’ manufacturing cost is relatively higher, compared with Chinese companies. With the development of Chinese 3D AOI production technology, their share in the international market is increasing, and competitiveness in the international market gradually increases.
Koh Young Technology, Test Research, ViTrox Corporation Berhad are the top 3 players globally. The three companies accounted for 43.95% market share in 2020.
Global 3D AOI for IC Market: Segmental Analysis
3D AOI can be divided into Inline 3D AOI and Offline 3D AOI. Currently, In-line 3D AOI Equipment are dominating the market, due to the superior performance and the market demand. The basis of high quality is the AOI device configuration; compared to the offline 3D AOI configuration, the comprehensive configuration of the online 3D AOI device is higher than that of a hardware or software. The online 3D AOI equipment simplifies the process flow and reduces unnecessary error links. From the perspective of overall quality control, it has a positive effect on the improvement of inspection quality. In 2020, more than 88% 3D AOI in the market are inline type.
At present, the two most widely used areas of 3D AOI are the printed circuit board and panel display industries, other application areas include semiconductors, solar cells, and medical treatment. Compare with the PCB, FPD fields, the resolution and the barriers enter into 3D AOI used in the IC fields are the highest.
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