The global Atomic Layer Deposition Equipment (ALD) market was valued at US$ 1869.98 million in 2020 and will reach US$ 2645.44 million by the end of 2027, growing at a CAGR of 5.08% during 2020-2027.
Atomic Layer Deposition Equipment (ALD) is a versatile research deposition tool for thermal or energy enhanced ALD. Atomic layer deposition (ALD) is a thin-film deposition technique based on the sequential use of a gas-phase chemical process; it is a subclass of chemical vapour deposition. The majority of ALD reactions use two chemicals called precursors (also called "reactants"). These precursors react with the surface of a material one at a time in a sequential, self-limiting, manner. A thin film is slowly deposited through repeated exposure to separate precursors. ALD is a key process in fabricating semiconductor devices, and part of the set of tools for synthesising nanomaterials.
For the major players of Atomic Layer Deposition Equipment (ALD), ASM International maintained its first place in the ranking in 2020, followed by TOKYO ELECTRON, Lam Research, Applied Materials and Eugenus. Top 5 players accounted for 80.47% of the Global Atomic Layer Deposition Equipment (ALD) revenue market share in 2020. The industry is highly concentrated. Apart from the above suppliers, players such as Veeco, Picosun, Beneq, Leadmicro, NAURA, Ideal Deposition, Oxford Instruments, Forge Nano, Solaytec, NCD, CN1, also account for a certain market share.
On the basis of product type, Industrial Production Equipment segment is projected to account for the largest sales volume market share during the forecast period; this segment was estimated to account for 68.73% share in 2020 in terms of volume.
In the applications, Semiconductor and Integrated Circuits Industry segment accounted for the highest market share of 72.23% in 2020 in terms of volume.
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