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Author: QYResearch | Published Date: 2019-01-14 | Views: 90
Global Electronic Packaging Materials Market: Drivers and Restraints
The global electronic packaging materials market is prognosticated to witness substantial demand due to increasing international trade and logistics in the electronic goods industry. The need to maintain the safety of electronic goods, as the extension of global supply chains results into long traveling times and distances, is predicted to augur well for the global market.
Increasing warranty agreements and the need to regain the lost customer loyalty or to sustain it are foretold to trigger the demand for electronic packaging materials.
However, stringent regulations related to the use of VOCs in packaging materials are expected to pose a challenge to the global market. On the other hand, the inflammable nature of most packaging materials and concerns over growing amounts of plastic waste damaging the environment are foreseen to impede the growth of the global market.
Global Electronic Packaging Materials Market: Forecast by Product and Application
The global electronic packaging materials market is segmented into ceramic, plastic, and metal packages by product. On the basis of application, the global market is divided into PCB, semiconductor and IC, and others.
Large players operating in the global electronic packaging materials industry are envisaged to work in close cooperation with downstream PCB and semiconductor and IC manufacturers.
Global Electronic Packaging Materials Market: Forecast by Region
On the basis of geography, the global electronic packaging materials market is classified into India, Southeast Asia, Japan, China, Europe, and the U.S.
In terms of consumption, the global market is led by Japan, Europe, the U.S., and Greater China. Followed by the U.S., Greater China accounted for the largest share of the global market with impressive sales revenue. China is predicted to continue to play a significant role in the growth of the global market.
Global Electronic Packaging Materials Market: Competitive Analysis
The top three players of the global electronic packaging materials market are Sumitomo Chemical, Shinko Electric Industries, and DuPont. The competition in the global market is anticipated to become more intensified due to the improvement of raw material cost control, acquisitions, and product innovation.
Manufacturers are observed to use their own mature sales network. They are prophesied to adopt annual investment in marketing channel infrastructure as a strategy to achieve better sales in the global electronic packaging materials industry. They are also expected to improve their sales through resells, retailers, partners, and authorized distributors.
Global Electronic Packaging Materials Market: Key Players
The report includes the company profiling section where major players such as Shinko Electric Industries, Tanaka, Mitsui High-tec, Sumitomo Chemical, Mitsubishi Chemical, EPM, Evonik, and DuPont have been covered.
Full Report Overview@ https://www.qyresearch.com/index/detail/97372/global-electronic-packaging-materials-sales-market
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